Maruyama, Shigeyuki (Kawasaki, JP)
Tashiro, Kazuhiro (Kawasaki, JP)
Watanabe, Naoyuki (Kawasaki, JP)
Plaque It!
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| JP5148172 | April, 1976 | |||
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| JP1097887 | April, 1998 | |||
| JP1126126 | January, 1999 | |||
| JP11185911 | July, 1999 | SOCKET FOR MEASURING IC PACKAGE | ||
| JP2002025732 | January, 2002 | BURN-IN SOCKET | ||
| JP2002198138 | July, 2002 | IC RECEPTACLE, IC PACKAGE LOADING JIG, AND IC PACKAGE LOADING METHOD |
1. An electronic component attaching tool for attaching an electronic component to a predetermined attachment position of an attachment object, comprising: a main body removably mounted on the attachment object; a first structure part that is formed on the main body, wherein a position of the first structure part is aligned to a standard part formed on the attachment object, and the forming of the standard part does not substantially depend on an external shape of the electronic component; and a second structure part that is formed in accordance with the external shape of the electronic component so as to have a function of aligning a position of the electronic component to the predetermined position of the attachment object in a state where the first structure part is aligned and attached to the standard part, the second structure part being formed on an inner wall of an opening forming part of the main body, wherein the inner wall includes an inclination surface which is formed so that an inner diameter increases as a position in the inclination surface is close to the second structure part, and guiding the electronic component to the predetermined position.
2. The electronic component attaching tool according to claim 1, wherein the first structure part is formed on an exterior surface of the main body.
3. The electronic component attaching tool according to claim 2, wherein the opening forming part comprises a first opening forming portion at an entrance position from which the electronic component is inserted into the opening forming part, and a second opening forming portion at an exit position that is an opposite position of the opening forming part from the entrance position, the first opening forming portion is larger than the external shape of the electronic component, and the second opening forming portion has an approximately same shape as the external shape of the electronic component.
4. The electronic component attaching tool according to claim 2, having a structure in which a plurality of electronic components are arranged at upper sides of one another in the opening forming part of the main body, and further comprising: a first holding mechanism having a holding member and an operational member, wherein the holding member engages with the lowest electronic component that is located at the lowest position among the plurality of electronic components to prevent the plurality of electronic components from being detached from the main body, and when the electronic component attaching tool is attached to the attachment object, the operational member is moved from a first engagement position where the holding member engages with the lowest electronic component to a first engagement releasing position where the holding member does not engage with the lowest electronic component; and a second holding mechanism having a dropping prevention member and a releasing member, wherein the dropping prevention member engages with at least second lowest electronic component among the plurality of electronic components to prevent the at least second lowest electronic component from dropping when the operational member is moved to the engagement releasing position, and the releasing member releases the engagement between the dropping prevention member and the at least second lowest electronic component when the releasing member is operated to be moved from a second engagement position where the dropping prevention member engages with the at least second lowest electronic component to a second engagement releasing position where the dropping prevention member does not engage with the at least second lowest electronic component.
5. The electronic component attaching tool according to claim 2, wherein the opening forming part has a first opening forming portion at an entrance position from which the electronic component is inserted into the opening forming part, and a second opening forming portion at an exit position that is an opposite position of the opening forming part from the entrance position, and a vertical center axis of the first opening forming portion is shifted from a vertical center axis of the second opening forming portion.
6. The electronic component attaching tool according to claim 2, wherein the inner wall of the opening forming part includes a vertical surface, the vertical surface aligns the electronic component to the predetermined attachment position of the attachment object.
7. The electronic component attaching tool according to claim 2, wherein the inner wall of the opening forming part includes a surface that is continuously formed from an entrance position of the opening forming part where the electronic component is inserted into the opening forming part to an exit position that is an opposite position of the opening forming part from the entrance position.
8. The electronic component attaching tool according to claim 2, wherein a plurality of grooves are formed on the second structure part.
9. The electronic component attaching tool according to claim 2, wherein the main body is made of an elastic material, and the opening forming part has a first opening forming portion at an entrance position of the opening forming part from which the electronic component is inserted into the opening forming part, and a second opening forming portion at an exit position that is an opposite position of the opening forming part from the entrance position such that the first opening forming portion is larger than the external shape of the electronic component, and the second opening forming portion is smaller than the external shape of the electronic component.
10. The electronic component attaching tool according to claim 2, wherein the main body includes a brim part that is formed around an entrance position of the opening forming part from which the electronic component is inserted into the opening forming part, the brim part extending horizontally and outward, and a size of the brim part in a plan view being larger than a size of the attachment object in a plan view.
11. The electronic component attaching tool according to claim 2, further comprising a plurality of the second structure parts.
12. The electronic component attaching tool according to claim 2, wherein the main body includes a sliding path for sliding the electronic component toward the second structure part.
13. The electronic component attaching tool according to claim 1, further comprising a holding mechanism that is provided at the second structure part and holds the electronic component in the electronic component attaching tool.
14. The electronic component attaching tool according to claim 13, wherein the holding mechanism includes: a holding member that engages with the electronic component to prevent the electronic component from being detached from the main body; and an operational member, wherein when the main body is attached to the attachment object, the operational member is moved from an engagement position where the holding member engages with the electronic component to an engagement releasing position where the holding member does not engage with the electronic component.
15. The electronic component attaching tool according to claim 13, wherein the second structure part is formed by an inner wall of an opening forming part that is formed on the main body, and the holding mechanism includes a protruding part that has elastically deforming properties and is provided on the inner wall of the opening forming part.
16. The electronic component attaching tool according to claim 1, wherein a conductive film is coated on a surface of the main body.
17. The electronic component attaching tool according to claim 1, wherein the main body is made of a conductive material.
18. The electronic component attaching tool according to claim 1, further comprising a position alignment mechanism that aligns a position of the main body to the attachment object.
19. The electronic component attaching tool according to claim 18, wherein the position alignment mechanism includes a plurality of position alignment pins having different sizes, and the plurality of position alignment pins are inserted into position alignment holes formed on the attachment object.
20. The electronic component attaching tool according to claim 1, wherein the main body includes a recognition mark for recognizing a direction of the main body.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to a method of attaching an electronic component, and an electronic component attaching tool. Specifically, the present invention relates to a method of attaching an electronic component such as a semiconductor device (whose representative is an LSI) and a ceramic condenser to an attachment object such as an IC socket while the position of the electronic component is aligned to the attachment object, and relates to an electronic component attaching tool used in this method.
2. Description of the Related Art
Recently, an electronic device having installed electronic components, and mainly a portable device such as a portable terminal, a cellular phone, and a digital still camera have rapidly become smaller and lighter. Accompanying this fact, electronic components (whose representative is a semiconductor device) that are installing components for such a downsized electronic device are greatly demanded to be smaller and lighter.
For this demand, a semiconductor device having a package form (referred to as Chip Size Package CSP has been rapidly introduced. The package size of the semiconductor device is made to be near the chip size. The representatives of the CSP are Fine-pitch Ball Grid Array FBGA, Fine-pitch Land Grid Array FLGA, and so on.
Such a semiconductor device is made to be downsized, so that an external terminal of the semiconductor device is also made to have a minute size. Accordingly, when testing is performed on the semiconductor device, when the semiconductor device is attached on a tray or the like, or when the semiconductor device is attached on a substrate or the like, the semiconductor device is aligned with high accuracy to the attachment object such as an IC socket, an IC tray, and an attachment substrate to which the semiconductor device is attached.
Before the CSP was realized, a Small Out-line J-Leaded Package SOJ, a Thin Small Out-line Package TSOP and the like were generally used as the package form of the downsized semiconductor device. Even when the chip size of the semiconductor chip that was attached in the package was changed, the external shape of the package that encloses the semiconductor device was set to the same, that is, not changed. For this reason, the largest size of the semiconductor devices to be attached in the package was used as a standard when the package was designed. Accordingly, the external shape of the semiconductor device package was conventionally larger than the size of the semiconductor device attached in the package.
On the other hand, the semiconductor device needs to be attached at the predetermined position on the attachment object such as the IC socket, the tray, and the attachment substrate with high accuracy. According to Japanese Laid-Open Patent Application No. 10-97887, the attachment object has a position alignment structure for positioning the semiconductor device at a predetermined position.
This position alignment structure uses the external shape of the semiconductor devices (electronic components) to be generally attached in the package form. The position alignment using the external shape of the electronic components was applied in order to simplify the position alignment structure, facilitate the position alignment, and improve the accuracy of the position alignment.
Conventionally, the packages of the semiconductor devices have the common external shape, so that one position alignment structure suitable for the common package external shape can cope with various semiconductor devices.
However, in the case of the CSP whose size is made to be near the smaller chip size, when the chip size is changed, the package size is inevitably changed. Furthermore, in the case of a memory device, the chip size shrinks every about six months even for the same type memory device. Accompanying this chip size change, the package size of the memory device is also changed.
Accordingly, one position alignment structure of the attachment object such as the IC socket, the tray, and the attachment substrate no longer can cope with the downsized devices. For this reason, position alignment structures that correspond to package sizes of the respective CSPs were developed and manufactured so as to be incorporated in the attachment object each time the package size is changed.
FIGS. 1 through 3 show how the conventionally used attachment object copes with the change in the electronic component size. In FIGS. 1 through 3, the CSPs are shown as an example of an electronic component.
For example, it is assumed that before the chip size is changed, a semiconductor chip 2 A is cut out from a wafer 1 A, and the semiconductor chip 2 A is packaged to form a semiconductor device 3 A (CSP). As shown in FIG. 2A, the side length of the semiconductor device 3 A is “A”, and the pitch of bumps 4 of the semiconductor device 3 A is “a”.
The thus-manufactured semiconductor device 3 A is attached to the attachment object at the time of the testing, the shipment, the substrate attachment, and the like. FIG. 1 shows the state where the semiconductor device 3 A is attached to the IC socket 5 A as the attachment object for the testing, the state where the semiconductor device 3 A is attached to the tray 6 A as the attachment object for the shipment, and the state where the semiconductor device 3 A is attached to the attachment substrate 8 A. FIG. 2B shows the detailed state where the semiconductor device 3 A is attached to the IC socket 5 A.
When the chip size shrinks, and a semiconductor chip 2 B that is smaller than the semiconductor chip 2 A is cut out from a wafer 1 B, a semiconductor device 3 B that is smaller than the semiconductor device 3 A is used for enclosing the semiconductor chip 2 B. FIGS. 3A and 3B are enlarged views showing the semiconductor devices 3 B and 3 A. As shown in FIG. 3A, the side length of the semiconductor device is “B” (B<A). The pitch “b” of bumps of the semiconductor device 3 B is equal to the pitch of the bumps 4 of the semiconductor device 3 A (b=a).
As described above, conventionally, when the package size is changed from the semiconductor device 3 A to the semiconductor device 3 B, all of the attachment objects were changed to be suitable ones for the semiconductor devices 3 B. In other words, the position alignment structures of the IC socket 5 A, the tray 6 A, the attachment substrate 8 A that are the attachment objects are made based on the external shape of the semiconductor device 3 A. Accordingly, these attachment objects for the semiconductor device 3 A cannot be used for the semiconductor device 3 B whose shape is different from the shape of the semiconductor device 3 A.
For this reason, conventionally, when the package size is changed from the semiconductor device 3 A to the semiconductor device 3 B, the IC socket 5 A is replaced with an IC socket 5 B suitable for the semiconductor device 3 B, the tray 6 A is replaced with a tray 6 B suitable for the semiconductor device 3 B, and the attachment substrate 8 A is replaced with an attachment substrate 8 B suitable for the semiconductor device 3 B.
Thus, when the package size is changed, the attachment object, and the position alignment structure of the attachment object need to be entirely changed, resulting in a large cost. Furthermore, a process of changing the position alignment structure requires much time, and the serviceability ratio of the attachment objects are lowered.
In addition, when the package size is changed, and a period for changing and developing the position alignment structure is long, a service period of the developed position alignment structure becomes short because the life cycle of the semiconductor device is short. As a result, an equipment cost generated by the package size change cannot be recovered.
SUMMARY OF THE INVENTION
In view of the foregoing, it is an object of the present invention to provide an electronic component attaching method and an electronic component attaching tool in which even when the size of the electronic component is changed, position alignment of electronic components having various sizes can be performed without changing an attachment object to which the electronic components are attached.
According to one aspect of the present invention, there is provided a method of attaching to a predetermined attachment position of an attachment object a first electronic component and a second electronic component, an external size of the first electronic component being different from an external size of the second electronic component, comprising the steps of:
preparing a first electronic component attaching tool for the first electronic component, wherein the first electronic component attaching tool has a function of aligning the first electronic component to the predetermined attachment position of the attachment object;
preparing a second electronic component attaching tool for the second electronic component, wherein the second electronic component attaching tool has a function of aligning the second electronic component to the predetermined position of the attachment object;
attaching the first electronic component attaching tool or the second electronic component attaching tool to a standard part formed on the attachment object in accordance with a first case where the first electronic component is attached to the predetermined attachment position or a second case where the second electronic component is attached to the predetermined attachment position, wherein the forming of the standard part does not substantially depend on the external sizes of the first and second electronic components;
in the first case, by using the first electronic component attaching tool, attaching the first electronic component to the attachment object with the position of the first electronic component being aligned to the predetermined attachment position;
removing the first electronic component attaching tool from the attachment object;
in the second case, by using the second electronic component attaching tool, attaching the second electronic component to the attachment object with the position of the second electronic component being aligned to the predetermined attachment position; and
removing the second electronic component attaching tool from the attachment object.
According to another aspect of the present invention, there is provided an electronic component attaching tool for attaching an electronic component to a predetermined attachment position of an attachment object, comprising:
a main body;
a first structure part that is formed on the main body, wherein a position of the first structure part is aligned to a standard part formed on the attachment object, and the forming of the standard part does not substantially depend on an external shape of the electronic component; and
a second structure part that is formed in accordance with the external shape of the electronic component so as to have a function of aligning a position of the electronic component to the predetermined position of the attachment object in a state where the first structure part is aligned and attached to the standard part.
With this method and tool, when the electronic components having different sizes are attached to the attachment object, it is not necessary to prepare different attachment objects for the respective different electronic components. In other words, only by selectively attaching the different electronic component attaching tools to the standard part formed on attachment object, it is possible to align and attach the electronic components having the different sizes to the attachment object.
Furthermore, when one electronic component having one external shape to be attached to the attachment object is replaced with another electronic component having another external shape, only the electronic component attaching tool is replaced, and there is no necessity that the attachment object be modified.
Accordingly, it is possible to promptly cope with the change of the electronic component to be attached to the attachment object, and therefore, it is possible to certainly cope with the short life cycle of the electronic component. In addition, the serviceability ratio of the attachment object and the throughput by the attachment object can be improved, reducing a cost for the electronic component. Moreover, when the electronic component to be attached to the attachment object is changed, it is not necessary to modify the attachment object, reducing an equipment cost required for the change of the electronic component.
Further, the electronic component attaching tool can be removed from the attachment object without adversely affecting the position of the electronic component attached to the attachment object and without adversely affecting the condition of the connection between the electronic component and the attachment object. Thereby, after the electronic component is aligned and attached to the attachment object by the electronic component attaching tool, it is not necessary to maintain the state in which the electronic component attaching tool is mounted on the attachment object. Therefore, when there are a plurality of attachment objects to which the electronic components are attached, one electronic component attaching tool enables the electronic components to be attached to a plurality of the attachment objects, respectively.
Furthermore, the electronic component attaching tool may include an opening for aligning the position of the electronic component to the attachment object. By dropping the electronic component free to the opening, the electronic component can be automatically aligned and attached to the attachment object, so that it is possible to easily align and attach the electronic component to the attachment object.
Moreover, the electronic component attaching tool may include a holding mechanism that holds the electronic component. While the holding mechanism holds the electronic component, the electronic component attaching tool may be mounted on the attachment object. Thereby, at the same time the electronic component attaching tool is mounted on the attachment object, the electronic component can be attached to the attachment object. Therefore, it is possible to improve the efficiency of aligning and attaching the electronic component to the attachment object.
Further, while the electronic component is held by the electronic component attaching tool, the electronic component may be optically tested by optical means via the opening of the electronic component attaching tool. When the electronic component is held by the electronic component attaching tool, the bottom part of the electronic component may be exposed via the opening. In this manner, it is possible to test the electronic component without removing the electronic component from the electronic component attaching tool. Therefore, it is possible to improve the efficiency of testing the electronic component.
Furthermore, the electronic component may be a chip size package.
The attachment object may be an open top type IC socket. By pushing the IC socket via the electronic component attaching tool, a contact pin of the IC socket may be connected to or released from a terminal of the electronic component. Therefore, the electronic component attaching tool can be used for pushing the IC socket.
The attachment object may be a tray, a tape, or an attachment substrate.
Furthermore, a region of the attachment object to which the electronic component is attached may be adhesive. Thereby, the electronic component is held at the aligned and attached position by the adhesive force, so that even when or after the electronic component attaching tool is removed from the attachment object, the electronic component is not moved from the aligned and attached position.
In addition, a cover may be attached for holding the electronic component in a state in which the electronic component is aligned and attached to the attachment object. In this manner, the electronic component can be held at the aligned and attached position by the cover, so that the electronic component is not moved from this aligned and attached position.
Other objects, features, and advantages of the present invention will become more apparent from the following detailed description when read in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an illustration for a problem of a conventional method of aligning and attaching semiconductor devices to an attachment object;
FIGS. 2A and 2B are illustrations for the problem of the conventional method of aligning and attaching semiconductor devices to an attachment object;
FIGS. 3A and 3B are illustrations for the problem of the conventional method of aligning and attaching semiconductor devices to an attachment object;
FIG. 4 shows an electronic component attaching tool according to a first embodiment of the present invention;
FIGS. 5A and 5B are illustrations showing a method of aligning and attaching the electronic component to the attachment object by using the electronic component attaching tool shown in FIG. 4;
FIGS. 6C and 6D are illustrations showing the method of aligning and attaching the electronic component to the attachment object by using the electronic component attaching tool shown in FIG. 4;
FIG. 7E is an illustration showing the method of aligning and attaching the electronic component to the attachment object by using the electronic component attaching tool shown in FIG. 4;
FIG. 8 is an illustration showing the method of aligning and attaching the electronic component to the attachment object by using the electronic component attaching tool shown in FIG. 4;
FIGS. 9A through 9D are illustrations showing the method of aligning and attaching the electronic component to the attachment object by using the electronic component attaching tool shown in FIG. 4;
FIGS. 10E through 10H are illustrations showing the method of aligning and attaching the electronic component to the attachment object by using another electronic component attaching tool according to the first embodiment of the present invention;
FIG. 11 is an illustration for an advantage achieved by the electronic component attaching tools and the position aligning method according to the first embodiment of the present invention;
FIG. 12 shows an electronic component attaching tool according to a second embodiment of the present invention;
FIG. 13 shows an electronic component attaching tool according to a third embodiment of the present invention;
FIG. 14 shows an electronic component attaching tool according to a fourth embodiment of the present invention;
FIG. 15 shows an electronic component attaching tool according to a fifth embodiment of the present invention;
FIG. 16 shows an electronic component attaching tool according to a sixth embodiment of the present invention;
FIGS. 17A through 17C show examples of modifications of grooves according to the sixth embodiment of the present invention;
FIG. 18 shows an electronic component attaching tool according to a seventh embodiment of the present invention;
FIG. 19 shows a method of aligning and attaching the electronic component to the attachment object by using the electronic component attaching tool shown in FIG. 18;
FIG. 20 shows the method of aligning and attaching the electronic component to the attachment object by using the electronic component attaching tool shown in FIG. 18;
FIG. 21 shows an electronic component attaching-tool according to an eighth embodiment of the present invention;
FIGS. 22A and 22B show electronic component attaching tools according to a ninth embodiment of the present invention;
FIGS. 23A through 23C show an electronic component attaching tool according to a tenth embodiment of the present invention;
FIGS. 24A and 24B show an electronic component attaching tool and a holding mechanism provided on this electronic component attaching tool according to an eleventh embodiment of the present invention;
FIGS. 25A and 25B show an operation of the electronic component attaching tool and the holding mechanism shown in FIGS. 24A and 24B;
FIGS. 26A and 26B show a method of aligning and attaching the electronic component to the attachment object by using the electronic component attaching tool shown in FIGS. 24A and 24B;
FIGS. 27C and 27D show the method of aligning and attaching the electronic component to the attachment object by using the electronic component attaching tool shown in FIGS. 24A and 24B;
FIG. 28E shows the method of aligning and attaching the electronic component to the attachment object by using the electronic component attaching tool shown in FIGS. 24A and 24B;
FIGS. 29A through 29D show a method of detecting a defect of the electronic component by using a camera as well as aligning and attaching the electronic component to the attachment object;
FIG. 30 shows a modification of a testing device that is used for the testing method shown in FIGS. 29A through 29C;
FIG. 31 shows an electronic component attaching tool according to a twelfth embodiment of the present invention;
FIGS. 32A through 32C show a method of aligning and attaching the electronic component to the attachment object by using the electronic component attaching tool shown in FIG. 31;
FIG. 33 shows an electronic component attaching tool according to a thirteenth embodiment of the present invention;
FIG. 34 shows an electronic component attaching tool having a recognition mark;
FIG. 35 shows an electronic component attaching tool according to a fourteenth embodiment of the present invention;
FIGS. 36A through 36C show an electronic component attaching tool according to a fifteenth embodiment of the present invention;
FIG. 37 shows a sixteenth embodiment of the present invention;
FIG. 38 shows an example in which the electronic component attaching tool of the first embodiment of the present invention is applied to a tray;
FIG. 39 shows the tray of FIG. 38 to which the electronic components are attached;
FIG. 40A shows a tray having adhesive sheets to which the electronic components are attached by using the electronic component attaching tool of the first embodiment of the present invention;
FIG. 40B shows a method of aligning and attaching the electronic component to the tray shown in FIG. 40A by using the electronic component attaching tool of the first embodiment of the present invention;
FIGS. 41A and 41B show a method of fixing the electronic components attached to a tray by using an upper cover;
FIGS. 42A and 42B show a tray on which position alignment pins and position alignment holes are formed;
FIG. 43 shows a tray to which the electronic component attaching tool of the fourteenth embodiment of the present invention is applied;
FIG. 44 shows a tray to which the sixteenth embodiment of the present invention is applied;
FIGS. 45A and 45B show a tape to which the electronic component attaching tool of the first embodiment of the present invention is applied;
FIG. 46 shows the tape of FIGS. 45A and 45B;
FIGS. 47A and 47B show a method of aligning and attaching the electronic component to a tape having adhesive sheets, by using the electronic component attaching tool of the first embodiment:
FIGS. 48A and 48B show a method of fixing the electronic component attached to the tape of FIGS. 45A and 45B by using an upper cover;
FIGS. 49A and 49B show a tape on which position alignment pins and position alignment holes are formed;
FIGS. 50A and 50B show an example in which the electronic component attaching tool of the fourteenth embodiment of the present invention is applied to the tape;
FIG. 51 shows an example in which the sixteenth embodiment of the present invention is applied to the tape;
FIG. 52 shows an example in which the electronic component attaching tool of the first embodiment of the present invention is applied to an attachment substrate;
FIGS. 53A and 53B show an attachment substrate on which position alignment pins and position alignment holes are formed; and
FIG. 54 shows an example in which the sixteenth embodiment of the present invention is applied to an attachment substrate.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
A description will now be given, with reference to the drawings, of embodiments of the present invention.
FIGS. 4 through 10 show electronic component attaching tools 20 A and 20 B according to a first embodiment of the present invention. The electronic component attaching tools 20 A and 20 B have functions of aligning the positions of the semiconductor devices 3 A and 3 B, respectively, to an IC socket 30 that is the attachment object at the time of mounting the semi-conductor devices 3 A and 3 B on the IC socket 30 . The semiconductor devices 3 A and 3 B are examples of electronic components.
In the following embodiments, the semiconductor device whose package form is a CSP type is used as an example of an electronic component. However, the application of the present invention is not limited to the semiconductor device, but may be applied to other electronic components such as a ceramic condenser.
Further, in the following embodiments, two types of the semiconductor devices 3 A and 3 B whose package sizes are different from each other. The semiconductor devices 3 A and 3 B are the same shown in FIGS. 1 through 3B. However, the present invention may be applied to an electronic component having three or more size types.
The electronic component attaching tool 20 A for the semiconductor device 3 A differs only in a second structure part or the second structure part size (that is described later) from the electronic component attaching tool 20 B for the semiconductor device 3 B. Accordingly, except for a necessity that the description be made by distinguishing the semiconductor device 3 A from the semiconductor device 3 B, only the electronic component attaching tool 20 A suitable for the semiconductor device 3 A will be described in the following.
First, a structure of the IC socket 30 that functions as the attachment object for attaching the electronic component attaching tool 20 A thereto will be described. The IC socket 30 is an open top type IC socket that does not have a lid.
This IC socket 30 includes a fixed part 31 and a movable part 32 . The fixed part 31 is fixed on a test substrate 36 (refer to FIG. 8). The fixed part 31 is provided with a plurality of contact pins 33 that correspond to the bumps 4 formed on the semiconductor device 3 A (and the semiconductor device 3 B).
One end (at the side of the direction Z 2 indicated by the arrow “Z2” of FIG. 4) of each contact pin 33 branches into two portions so as to form pin end portions 33 a and 33 b . When the semiconductor device 3 A or 3 B is mounted on the IC socket 30 , the bump 4 is sandwiched by a pair of the pin end portions 33 a and 33 b so that the bump 4 can be electrically and mechanically connected to the contact pin 33 .
The movable part 32 is structured so as to move in the directions Z 1 and Z 2 indicated by the arrows “Z1” and “Z2” of FIG. 4 relative to the fixed part 31 . Further, springs 34 are provided between the fixed part 31 and the movable part 32 such that the movable part 32 is pushed in the direction “Z2” relative to the fixed part 31 by the springs 34 .
The pair of the pin end portions 33 a and 33 b of the contact pin 33 are structured so as to move or deform, accompanying the movement of the movable part 32 . In other words, when the movable part 32 is pushed and moved in the lower direction “Z1”, the pair of the pin end portions 33 a and 33 b are moved and separated from each other.
The semiconductor device 3 A or 3 B is attached to the IC socket 30 with the movable part 32 being pushed in the direction Z 1 . In the state in which the movable part 32 is pushed in the direction Z 1 , the distance between the pair of the pin end portions 33 a and 33 b is widened. Accordingly, the bump 4 of the semiconductor device 3 A or 3 B can be easily inserted between the pair of the pin end portions 33 a and 33 b (refer to FIG. 6D).
In the state in which the bump 4 is positioned between the pair of the pin end portions 33 a and 33 b , when the pushing force applied to the movable part 32 is released, the elastic restoring force of the springs 34 cause the movable part 32 to move in the direction Z 2 (i.e., the upward direction). Accompanying the movement of the movable part 32 in the direction Z 2 , the pair of the pin end portions 33 a and 33 b are moved to be close to each other. In this manner, when the pushing force applied to the movable part 32 is released, the bump 4 is sandwiched by the pair of the pin end portions 33 a and 33 b so that the bump 4 can be electrically connected to the contact pin 33 and be mechanically fixed to the contact pin 33 , that is, the semiconductor device 3 A or 3 B can be fixed on the IC socket 30 .
Meanwhile, a depression part is formed at an upper center part of the movable part 32 . The inner wall of the depression part is standard surface 35 . This standard surface 35 (the inner wall) is formed substantially regardless of the external shape of the semiconductor devices 3 A and 3 B that are attached to the IC socket 30 .
In other words, the standard surface 35 need not have the function of aligning the position of the semiconductor devices 3 A and 3 B. Accordingly, the formation size or area of the standard surface 35 is larger than the external sizes or areas of the semiconductor devices 3 A and 3 B. As described later, the standard surface 35 is formed with high accuracy because the standard surface 35 is used for aligning the position where the electronic component attaching tool 20 A is attached with high accuracy.
Next, the electronic component attaching tools 20 A and 20 B will be described. When the electronic component attaching tools 20 A and 20 B are mounted on the IC socket 30 , the electronic component attaching tools 20 A and 20 B function to align the semiconductor devices 3 A and 3 B to predetermined attachment positions on the IC socket 30 . The predetermined attachment positions may be the positions where the bumps 4 are connected to the contact pins 33 . The electronic component attaching tool 20 A may be structured to be suitable for the semiconductor device 3 A, and the electronic component attaching tool 20 B may be structured to be suitable for the semiconductor device 3 B.
The electronic component attaching tools 20 A and 20 B differ from each other in the shapes of vertical surfaces 23 B and 25 B that have the function of aligning the positions of the semiconductor devices 3 A and 3 B. Other structures of the electronic component attaching tools 20 A and 20 B are substantially the same. Accordingly, in the following, only the electronic component attaching tool 20 A is described as an example, and the only different structure of the electronic component attaching tool 20 B is described.
The electronic component attaching tool 20 A includes a main body 21 A, an engaging surface 22 (a first structure part) formed on the main body 21 A, and a position alignment surface 23 (the above-mentioned second structure part) formed on the main body 21 A. Thus, the electronic component attaching tool 20 A has very simple structure, so that it is possible to manufacture the electronic component 20 A at a low cost.
As one example, the materials for the main body 21 A may include resin that has a low thermal expansion rate, high insulation characteristics, and a smooth surface (to be specific, the material for the main body 21 A may include fluoroplastics). The shape of the main body 21 A viewed from the upper side of the electronic component attaching tool 20 A may be approximately the same as the shape of the IC socket 30 viewed from the upper side of the IC socket 30 . An opening 26 is formed at the center part of the main body 21 A of the electronic component attaching tool 20 A. As described later, the semiconductor device 3 A or 3 B is inserted in the opening 26 .
The engaging surface 22 that is the first structure part is formed at the outer surface of the main body 21 A. In the state in which the electronic component attaching tool 20 A is mounted on the IC socket 30 , the engaging surface 22 engages with an engagement surface formed on the IC socket 30 .
The position alignment surface 23 that is the second structure part is formed at an inner surface of the opening formed on the main body 21 A. According to the first embodiment, the position alignment surface 23 includes an inclination surface 23 A and the vertical surface 23 B.
The inclination surface 23 A guides the insertion of the semiconductor device 3 A when the semiconductor device 3 A is inserted into the opening 26 of the electronic component attaching tool 20 A. The vertical surface 23 B aligns the semiconductor device 3 A to the predetermined attachment position on the IC socket 30 . Accordingly, the shape of a part of the opening 26 that is defined by the vertical surface 23 B may be equal to the external shape of the semiconductor device 3 A, or may be slightly larger than the external shape of the semiconductor device 3 A within the range in which the position alignment of the semiconductor device 3 A can be performed and the semiconductor device 3 A can be smoothly inserted into the opening 26 of the electronic component attaching tool 20 A.
In the above-described structure of the electronic component attaching tool 20 A, the opening 26 has an entrance shape (upper side shape) viewed from the direction of inserting the semiconductor device into the opening 26 , the entrance shape being larger than the external shape of the semiconductor device. 3 A. The opening 26 has an exit shape (lower side shape) whose size is approximately the same as the external size of the semiconductor device 3 A. With this structure, at the entrance side of the electronic component attaching tool 20 A, the semiconductor device 3 A can be easily inserted into the opening 26 , and at the exit side of the electronic component attaching tool 20 A, the position alignment of the semiconductor device 3 A can be firmly performed.
A brim part 24 A that extends in a horizontal direction is formed at the entrance side of the electronic component attaching tool 20 A from which the semiconductor device 3 A is inserted. When the electronic component attaching tool 20 A is mounted on the IC socket 30 , the brim part 24 A is positioned on the upper surface of the movable part 32 . Accordingly, at the time of pushing the movable part 32 , it is possible to push the movable part 32 via the brim part 24 A (the electronic component attaching tool 20 A).
On the other hand, also as for the electronic component attaching tool 20 B for the semiconductor device 3 B, the engaging surface 22 that is the first structure part is formed on the outer surface of the main body 21 A of the electronic component attaching tool 20 B. The structure of the engaging surface 22 of the electronic component attaching tool 20 B is the same as the engaging surface 22 of the electronic component attaching tool 20 A. When the electronic component attaching tool 20 B is mounted on the IC socket 30 , the engaging surface 22 of the electronic component attaching tool 20 B engages with the engagement surface formed on the IC socket 30 .
The electronic component attaching tool. 20 B also includes a position alignment surface 25 . The position alignment surface 25 that is the second structure part includes an inclination surface 25 A and a vertical surface 25 B. The inclination surface 25 A guides the insertion of the semiconductor device 3 B into the electronic component attaching tool 20 B. The vertical surface 25 B aligns the semiconductor device 3 B to a predetermined position on the IC socket 30 . An opening 26 is also formed at the center part of the electronic component attaching tool 20 B. Therefore, the size of a part of the opening 26 defined by the vertical surface 25 B may be equal to the external size of the semiconductor device 3 B, or may be slightly larger than the external size of the semiconductor device 3 B within the range in which the position alignment of the semiconductor device 3 B can be performed, and the semiconductor device 3 B can be smoothly inserted into the electronic component attaching tool 20 B.
Next, a method of attaching the semiconductor device 3 A to the IC socket by using the electronic component attaching tool 20 A will be described with reference to FIGS. 5A through 8.
As described above, the movable part 32 can be moved in the direction Z 2 to the upper position, and be moved in the direction Z 1 to the lower position. FIG. 5A shows the electronic component 20 A that is about to be attached to the IC socket 30 . In the state shown in FIG. 5A, the movable part 32 of the IC socket 30 is located at the upper position, and the distance between the pair of the pin end portions 33 a and 33 b is narrow.
FIG. 5B shows the electronic component attaching tool 20 A mounted on the IC socket 30 . When the electronic component attaching tool 20 A is mounted on the IC socket, the electronic component attaching tool 20 A is simply placed (or inserted) at the depression part formed on the upper side of the movable part 32 . Accordingly, it is possible to easily mount the electronic component attaching tool 20 A on the IC socket 30 .
When the electronic component attaching tool 20 A is mounted on the IC socket, the engaging surface 22 of the electronic component attaching tool 20 A contacts with the standard surface 35 (or the engagement surface) of the IC socket 30 so that the position of the electronic component attaching tool 20 A to the IC socket can be determined. Furthermore, when the position of the electronic component attaching tool 20 A to the IC socket 30 is determined, the attachment position where the semiconductor device 3 A can be attached to the IC socket 30 can be automatically determined by the vertical surface 23 B of the electronic component attaching tool 20 A. In this manner, it is possible to align the electronic component attaching tool 20 A to the IC socket 30 with great ease and good operationality.
After the electronic component attaching tool 20 A is mounted on the IC socket 30 , the brim part 24 A is pushed in the direction F of FIG. 6C to move the movable part 32 in the direction Z 1 . As described above, the pair of pin end portions 33 a and 33 b of the contact pin 33 are thereby moved in the direction of separating the pin end portions 33 a and 33 b from each other.
Then, while pushing the brim part 24 A, the semiconductor device 3 A is inserted into the opening 26 from the upper side of the electronic component attaching tool 20 A. In the operation of inserting the semiconductor device 3 A into the opening 26 , holding of the semiconductor device 3 A is released at the position above the opening 26 . In this manner, by releasing the holding of the semiconductor device 3 A, the semiconductor device 3 A drops free toward and in the opening 26 .
At this time, the semiconductor device 3 A can be easily inserted into the opening 26 because the inclination surface 23 A defines a larger opening part at the entrance position of the opening 26 . Furthermore, since the inclination surface 23 A is continuously connected to the vertical surface 23 B, it is possible to smoothly advance the semiconductor device 3 A into the opening 26 defined by the vertical surface 23 B. In the first embodiment, a moving device for forcibly moving the semiconductor device 3 A in the opening 26 of the electronic component attaching tool 20 A is not provided, but even the free drop of the semiconductor device 3 A enables the semiconductor device 3 A to be accurately aligned and attached to the predetermined attachment position.
As described above, the semiconductor device 3 A is guided to the attachment position by the electronic component attaching tool 20 A, and FIG. 6D shows the semiconductor device 3 A attached to the predetermined position. As shown in FIG. 6D, each bump 4 of the semiconductor device 3 A is located between the pair of the pin end portions 33 a and 33 b of the contact pin 33 .
When the semiconductor device 3 A is attached to the predetermined attachment position of the IC socket 30 , the pushing force applied on the brim part 24 A is released. As a result, the movable part 32 is moved in the direction Z 2 by the elastic restoring force of the springs 34 . Accompanying this movement of the movable part 32 in the direction Z 2 , the distance between the pair of the pin end portions 33 a and 33 b becomes narrow, so that the pair of the pin end portions 33 a and 33 b sandwiches the bump 4 . In this state, the contact pin 33 is electrically connected to the bump 4 , and the semiconductor device 3 A is fixed on the IC socket 30 .
Next, the electronic component attaching tool 20 A is removed from the IC socket 30 as shown in FIG. 7E. When the electronic component attaching tool 20 A is removed from the IC socket 30 , the semiconductor device 3 A is fixed on the IC socket 30 . Accordingly, the electronic component attaching tool 20 A can be removed from the IC socket 30 without adversely affecting the fixed position of the semiconductor device 3 A and the connected condition of the semiconductor device 3 A to the IC socket 30 . In other words, after the semiconductor device 3 A is attached to the IC socket 30 , the electronic component attaching tool 20 A can be removed from the IC socket 30 .
In this manner, as shown in FIG. 8, even in the case where a plurality of IC sockets (in this example, three IC sockets) that mount the semiconductor devices 3 A thereon are provided on a test substrate 36 , it is not necessary to prepare three electronic component attaching tools 20 A. That is, one electronic component attaching tool 3 A enables plural semiconductor devices 3 A to be aligned and attached to the plural IC sockets 30 - 1 through 30 - 3 , respectively.
Next, a method of attaching to the same IC socket 30 the semiconductor devices 3 A and 3 B whose sizes are different from each other will be described with reference to FIGS. 9A through 9D. FIGS. 9A through 9D show the method of attaching the semiconductor device 3 A to the IC socket 30 .
The procedure of this method of attaching the semiconductor device 3 A to the IC socket 30 is basically the same as the procedure shown in FIGS. 5A through 7E. In this method, as shown in FIG. 9B, the electronic component attaching tool 20 A is mounted on the IC socket 30 of FIG. 9A. Thereafter, as shown in FIG. 9C, the semiconductor device 3 A is mounted at the predetermined attachment position of the IC socket 30 by using the electronic component attaching tool 20 A. Then, the electronic component attaching tool 20 A is removed from the IC socket 30 with the semiconductor device 3 A being attached to the IC socket 30 .
FIG. 10E shows the same IC socket 30 as the above IC socket 30 to which the semiconductor device 3 A is attached. As shown in FIG. 10F, when the semiconductor device 3 B is attached to the IC socket 30 , the electronic component attaching tool 20 B that is suitable for the semiconductor device 3 B is mounted on the IC socket 30 . At this time, the engaging surface 22 of the electronic component attaching tool 20 B contact with the standard surface 35 of the IC socket 30 .
As described above, the engaging surface 22 formed on the electronic component attaching tool 20 B is basically the same as the engaging surface 22 formed on the electronic component attaching tool 20 A. The engaging surface 22 of the electronic component attaching tool 20 B engage with the standard surface 35 so that the opening part defined by the vertical surface 25 B can be aligned to the position corresponding to the predetermined attachment position where the semiconductor device 3 B is attached to the IC socket 30 .
Accordingly, as shown in FIG. 10G, by inserting the semiconductor device 3 B into the electronic component attaching tool 20 B, the semiconductor device 3 B is guided and aligned to the predetermined attachment position of the IC socket 30 . Subsequently, when the semiconductor device 3 B is electrically and mechanically connected to the IC socket 30 , the electronic component attaching tool 20 B is removed from the IC socket 30 as shown in FIG. 10H.
According to the first embodiment of the present invention, when the semiconductor devices 3 A and 3 B (whose sizes or external shapes are different from each other) are attached to the IC sockets, the IC sockets 30 that are suitable for the respective semiconductor devices 3 A and 3 B need not be prepared. In other words, by only selectively attaching the electronic component attaching tools 20 A and 20 B to the standard surface 35 (the standard part) formed on the IC socket 30 , it is possible to align and attach to the IC sockets 30 the semiconductor devices 3 A and 3 B having the different external sizes.
Furthermore, when the electronic component to be attached to the IC socket 30 is changed from the semiconductor device 3 A to the semiconductor device 3 B, the electronic component attaching tool 20 A is simply replaced with the electronic component attaching tool 20 B, and the design or the like of the IC socket 30 need not be changed. In other words, as shown in FIG. 11, when the semiconductor devices 3 A and 3 B whose shapes or sizes are different from each other are attached to the IC socket 30 , the tray 50 , and the attachment substrate 90 that are the attachment objects, the electronic component attaching tools 20 A and 20 B are replaced with each other in accordance with the semiconductor devices 3 A and 3 B, and the modification need not be applied to the IC socket 30 , the tray 50 , and the attachment substrate 90 .
Accordingly, when the shape or size of the semiconductor devices 3 A and 3 B (electronic components) to be attached to the attachment objects 30 , 50 , and 90 are changed, it is possible to promptly cope with this size change. Therefore, it is possible to firmly cope with the size change or the shape change even when the life cycle of the semiconductor devices 3 A and 3 B is short. Furthermore, it is possible to improve the serviceability ratio and the throughput by the attachment objects 30 , 50 , and 90 , so that the electronic component attaching tools 20 A and 20 B of the first embodiment can contribute to the reduction in the manufacturing cost of the semiconductor devices 3 A and 3 B. In addition, when the size or the shape of the semiconductor devices 3 A and 3 B are changed, the modification need not be applied to the attachment objects 30 , 50 , and 90 , so that equipment cost caused by the size change or the shape change of the semiconductor devices 3 A and 3 B can be reduced.
Next, a second embodiment of the present invention will be described.
FIG. 12 shows an electronic component attaching tool 20 C according to the second embodiment of the present invention. In the following, the same reference numbers are attached to the elements having the same structures as those shown in FIGS. 4 through 11, and the overlapping description of the same structures are omitted.
In the first embodiment, the position alignment surfaces 23 and 25 of the electronic component attaching tools 20 A and 20 B include the inclination surfaces 23 A and 25 A, and the vertical surfaces 23 B and 25 B, respectively. However, when the position alignment surfaces 23 and 25 are formed by the inclination surfaces 23 A and 25 A, and the vertical surfaces 23 B and 25 B, respectively, the level difference may be generated between the inclination surfaces 23 A and 25 A and the vertical surfaces 23 B and 25 B. Accordingly, the downsized semiconductor device may be caught by this level difference between the inclination surface and the vertical surface, so that there is a possibility that the semiconductor device is not appropriately attached to the IC socket 30 .
With the view of the above, according to the second embodiment, there is provided an inclination surface that is formed on the inner surface of the opening and of which slope is continuously formed from the entrance position to the exit position for the electronic component, as shown in FIG. 12. With this structure, there is no level difference on the inclination surface 37 within the range from the entrance position to the exit position. Therefore, the downsized semiconductor device is not caught by the opening 26 when the semiconductor device is inserted into the opening 26 . That is, it is possible to securely attach the semiconductor device to the predetermined attachment position of the attachment object (the IC socket 30 and so on).
Next, a third embodiment of the present invention will be described.
FIG. 13 shows an electronic component attaching tool 20 D according to the third embodiment of the present invention. Similarly to the second embodiment, the electronic component attaching tool 20 D also has a position alignment surface 23 that is continuously formed such that there is no level difference within the range from the entrance position to the exit position.
In the second embodiment, as shown in FIG. 12, the inclination surface 37 has the same inclination angle θ throughout the inclination surface 37 . Meanwhile, according to the third embodiment, the inclination surface 37 is basically formed by the inclination surface 23 A and the vertical surface 23 B, and a curved part 38 is formed at the contact part between an upper surface of the electronic component attaching tool 20 D and the inclination surface 23 A, and at the contact part between the inclination surface 23 A and the vertical surface 23 B, as shown in FIG. 13.
With this structure, it is possible to provide the position alignment surface 23 that is continuously formed from the entrance position to the exit position of the opening 26 without the level difference. Accordingly, in the third embodiment, the downsized semiconductor device (the electronic component) is not caught by the opening 26 when the semiconductor device is inserted into the opening 26 , and it is possible to firmly attach the semiconductor device to the predetermined attachment position of the attachment objects (the IC socket 30 or the like).
Next, fourth and fifth embodiments of the present invention will be described.
FIG. 14 shows an electronic component attaching tool 20 E according to the fourth embodiment of the present invention. FIG. 15 shows an electronic component attaching tool 20 F according to the fifth embodiment of the present invention.
The electronic component attaching tool 20 E includes a coating film 39 having conductive properties that is formed on the surface of the main body 21 A. On the other hand, the electronic component attaching tool 20 F includes a main body 21 B that is formed by a conductive material. A metal material having high conductive properties and high corrosion-proof properties is preferably used for the coating film 39 . As for the main body 21 B, a resin material may be made to contain conductive powders or conductive fibers so as to configure the main body 21 B. Alternatively, the main body 21 B may be formed by a conductive metal.
In these structures, even when static electricity is generated between the semiconductor device (the electronic component) and the electronic component attaching tool 20 E or 20 F at the time of attaching the semiconductor device to the attachment object, the generated static electricity flows out via the coating film 39 or the main body 21 B. Accordingly, it is possible to prevent the semiconductor device from being damaged by the static electricity.
Next, a sixth embodiment of the present invention will be described.
FIG. 16 and FIGS. 17A through 17C show an electronic component attaching tool 20 G according to the sixth embodiment of the present invention. In the electronic component attaching tool 20 G, a groove part including grooves 40 A is formed on the position alignment surface 23 that defines the opening 26 . The section of the groove 40 A has a rectangular shape in this example. The groove 40 A is formed so as to extend in the vertical directions (the directions Z 1 and Z 2 . The grooves 40 A are continuously formed from the inclination surface 23 A to the vertical surface 23 B of the position alignment surface 23 .
By forming the grooves 40 A on the position alignment surface 23 , even when dust or the like adheres to the semiconductor device, the dust adhering to the semiconductor device is made to enter the recession part, i.e., the grooves 40 A of the groove part when the semiconductor device is inserted into the opening of the electronic component attaching tool 20 G. Accordingly, it is possible to prevent the semiconductor device from being caught at the position alignment surface 23 by the dust that comes in between the semiconductor device and the position alignment surface.
With the electronic component attaching tool 20 G, it is possible to firmly attach the semiconductor device to the IC socket 30 or the like (attachment object). Furthermore, since the dust is captured by the electronic component attaching tool 20 G, it is also possible to prevent the dust from coming in between the terminal (bump) of the semiconductor device and the contact pin 33 of the IC socket 30 , improving the electric connectivity. Furthermore, by forming the groove 40 A on the position alignment surface 23 , it is possible to decrease a contact area between the position alignment surface and the semiconductor device. In this structure, when the semiconductor device slides on the position alignment surface 23 toward the predetermined attachment position, the friction resistance generated between the semiconductor device and the position alignment surface is reduced. Accordingly, it is possible to prevent the semiconductor device from being caught by the electronic component attaching tool 20 G, and to firmly align the semiconductor device to the predetermined attachment position of the IC socket 30 .
A sectional shape of the groove 40 A formed on the position alignment surface 23 is not limited to the rectangular shown in FIG. 16, but may be various shapes shown in FIGS. 17A through 17C, for example. In FIG. 17A, a groove 40 B having a triangular sectional shape is formed on the position alignment surface 23 . In FIG. 17B, a groove 40 C that is wave-shaped in section is formed on the position alignment surface 23 . In FIG. 17C, a groove 40 D that is U-shaped in section is formed on the position alignment surface 23 .
Next, a seventh embodiment of the present invention will be described.
FIGS. 18 through 20 are illustrations for an electronic component attaching tool 20 H according to the seventh embodiment of the present invention. In the first embodiment through the sixth embodiment, the main bodies 21 A and 21 B of the electronic component attaching tools 20 A through 20 G may be formed by materials that are not easily deformed or are not flexible.
Meanwhile, according to the seventh embodiment, a main body 21 C of the electronic component attaching tool 20 H is made of an elastic material such as rubber. Furthermore, in the seventh embodiment, the size of the opening 26 at the entrance position where the semiconductor device 3 A is inserted into the electronic component attaching tool 20 H is larger than the external size of the semiconductor device 3 A, similarly to the above embodiments. However, in the seventh embodiment, the size of the opening 26 at the exit position for the semiconductor device 3 A is smaller than the external size of the semiconductor device 3 A. In other words, in the example shown in FIG. 18, the length L of the side of the opening at the exit position is smaller than the length A of the side of the semiconductor device 3 A (L<A).
With this structure, when the semiconductor device 3 A is inserted into the opening 26 from the upper side of the opening 26 , the semiconductor device 3 A is engaged and (temporarily) held at the exit position of the opening 26 as shown in FIG. 18 because the size of the opening 26 at the exit position is smaller than the external size of the semiconductor device 3 A. In this manner, it is possible to transport the electronic component attaching tool 20 H with the semiconductor device 3 A being engaged and held by the electronic component attaching tool 20 H.
Accordingly, the semiconductor device 3 A is engaged (temporarily held) by the electronic component attaching tool 20 H in advance, and by keeping this state, the electronic component attaching tool 20 H is then mounted on the IC socket 30 (the attachment object) so as to align the semiconductor device 3 A. Therefore, at the same time the electronic component attaching tool 20 H is mounted on the IC socket 30 , the semiconductor device 3 A can be attached to the IC socket 30 . Accordingly, it is possible to improve the efficiency of aligning the semiconductor device 3 A.
In order to attach to the IC socket 30 the semiconductor device 3 A that is engaged and held by the electronic component attaching tool 20 H, the semiconductor device 3 A is pushed toward the IC socket 30 in the direction indicated by the arrow “B” of FIG. 19. The electronic component attaching tool 20 H is thereby elastically deformed, so that the semiconductor device 3 A held by the electronic component attaching tool 20 H is released and attached to the IC socket 30 , as shown in FIG. 19.
In the case where the electronic component attaching tool 20 H is removed from the IC socket 30 after the semiconductor device 3 A is attached to the IC socket 30 , the electronic component attaching tool 20 H is raised upward as shown in FIG. 20. At this time, the semiconductor device 3 A has already been released from the electronic component attaching tool 20 H in the downward direction relative to the electronic component attaching tool 20 H, so that the semiconductor device 3 A can be easily raised upward. The elastic coefficient of the electronic component attaching tool 20 H is set in the range within which when the engaging surface 22 of the electronic component attaching tool 20 H contacts with the standard surface 35 of the IC socket 30 , the position alignment surface 23 enables the semiconductor device 3 A to be aligned to the predetermined attachment position of the IC socket 30 with good accuracy.
Next, an eighth embodiment of the present invention will be described.
FIG. 21 shows an electronic component attaching tool 201 according to the eighth embodiment of the present invention. In the above-described embodiments, the brim part 24 A formed on the electronic component attaching tools 20 A through 20 H has the shape in the plan view that is approximately the same as the shape in the plan view of the IC socket 30 .
On the other hand, in the eighth embodiment, a brim part 24 B extends in the side direction (the horizontal direction) to be longer such that the size of the brim part 24 B in the plan view is larger than the size of the IC socket in the plan view. In other words, the length W 2 of the size of the brim part 24 B is larger than the length W 1 of one side of the IC socket 30 , as shown in FIG. 21 (W 2 >W 1 ).
With this structure, when the open top type. IC socket 30 is operated, the IC socket 30 can be easily operated (the movable part 32 can be easily pushed) because the area of the brim part 24 B is wide. Particularly when a plurality of IC sockets 30 - 1 through 30 - 3 are arranged so as to be close to each other as shown in FIG. 8, the operability of pushing the small movable part 32 is low. However, by using the electronic component attaching tool 20 I having the wide brim part 24 B, it is possible to efficiently perform the operation of attaching the semiconductor device 3 A to the IC socket even when a plurality of IC sockets 30 - 1 through 30 - 3 are close to each other in the arrangement.
Next, a ninth embodiment of the present invention will be described.
FIGS. 22A and 22B show electronic component attaching tools 20 J and 20 K, respectively according to the ninth embodiment of the present invention. In this embodiment, a position alignment mechanism for aligning the electronic component attaching tools 20 J and 20 K to the IC socket 30 (the attachment object) is provided.
Specifically, in the example of FIG. 22A, position alignment pins 41 A are formed on the electronic component attaching tool 20 J, and position alignment holes 42 A into which the position alignment pins 41 A are respectively inserted are formed on the IC socket 30 . On the other hand, in the example of FIG. 22B, position alignment holes 42 A are formed on the electronic component attaching tools 20 K, and position alignment pins 41 A that are inserted into the position alignment hoes 42 A, respectively are formed on the IC socket 30 .
According to the ninth embodiment, when the electronic component attaching tools 20 J and 20 K are mounted on the IC socket 30 , not only the engaging surface 22 engages with the standard surface 35 , but also the positions of the electronic component attaching tools 20 J and 20 K are aligned to the IC socket 30 by the engagement of the position alignment pins 41 A and the position alignment holes 42 A. Furthermore, the position alignment of the electronic component attaching tools 20 J and 20 K to the IC socket 30 can be performed by only inserting the position alignment pins 41 A into the position alignment holes 42 A. Accordingly, in this embodiment, it is possible to easily align the positions of the electronic component attaching tools 20 J and 20 K to the IC socket 30 with further high accuracy.
Next, a tenth embodiment of the present invention will be described.
FIGS. 23A through 23C show electronic component attaching tools 20 L according to the tenth embodiment of the present invention. In this embodiment, a holding mechanism for holding the semiconductor device 3 A is provided on the electronic component attaching tool 20 L. The holding mechanisms of FIGS. 23A, 23 B, and 23 C include protrusion parts 43 A, 43 B, and 43 C, respectively that are formed on the inner surface (the second structure part) of the opening 26 so as to protrude in the inward direction. Each of the protrusion part 43 A through 43 C is made of an elastic material such as rubber.
A protrusion part 43 A shown in FIG. 23A is formed on the electronic component attaching tool 20 L so as to engage with the bump 4 A of the semiconductor device 3 A when the semiconductor device 3 A is mounted on the electronic component attaching tool 20 L. A protrusion part 43 B shown in FIG. 23B is formed on the electronic component attaching tool 20 L so as to engage with the lower surface of the package main body of the semiconductor device 3 A when the semiconductor device 3 A is mounted on the electronic component attaching tool 20 L. A protrusion part 43 C shown in FIG. 23C is formed on the electronic component attaching tool 20 L so as to engage with the outer circumferential surface of the package main body of the semiconductor device 3 A when the semiconductor device 3 A is mounted on the electronic component attaching tool 20 L.
According to the tenth embodiment, by providing the protrusion part 43 A, 43 B, or 43 C to the electronic component attaching tool 20 L, it is possible to hold the semiconductor device 3 A in the electronic component attaching tool 20 L. Therefore, similarly to the electronic component attaching tool 20 H of FIG. 18 in the seventh embodiment, the semiconductor device 3 A can be held at the position alignment surface 23 of the electronic component attaching tool 20 L in advance, and the electronic component attaching tool 20 L that holds the semiconductor device 3 A can be aligned and attached to the IC socket 30 . In this manner, at the same time the electronic component attaching tool 20 L is mounted on the IC socket 30 , the semiconductor device 3 A can be attached to the IC socket 30 . Accordingly, it is possible to improve the efficiency of the position alignment operation.
Furthermore, in the tenth embodiment, the holding mechanism is structured so as to include the protrusion part 43 A, 43 B, or 43 C that is provided on the position alignment surface 23 such that the protrusion parts 43 A, 43 B, or 43 C can be elastically deformed. Accordingly, the holding mechanism can be realized by a simple structure. Therefore, the protrusion part 43 A, 43 B, or 43 C is elastically deformed by pushing the semiconductor device 3 A in the downward direction so that the semiconductor device 3 A held by the protrusion part 43 A, 43 B, or 43 C can be released from the protrusion part 43 A, 43 B, or 43 C. Then, the semiconductor device 3 A can get over the protrusion parts 43 A, 43 B, or 43 C, and can be attached to the predetermined attachment position of the IC socket 30 . Therefore, the simple operation enables the semiconductor device 3 A to be released from the protrusion part 43 A, 43 B, or 43 C and to be attached to the IC socket 30 .
Next, an eleventh embodiment of the present invention will be described.
FIGS. 24A through 28E show an electronic component attaching tool 20 M according to the eleventh embodiment of the present invention. A holding mechanism 44 in this embodiment is shown in FIGS. 24A and 24B. FIG. 24B is an enlarged sectional view of the part of the dashed circle indicated by the arrow A of FIG. 24A.
The holding mechanism 44 is provided at the lower part of the main body 21 A of the electronic component attaching tool 20 M. The holding mechanism 44 includes a holding pin 45 and an operational pin 46 . As shown in FIG. 24B, the holding pin 45 can be rotated clockwise (as indicated by the arrow “B1”) and counterclockwise (as indicated by the arrow “B2”) with a supporting shaft 49 being the center of this rotation. The supporting shaft 49 is provided on the main body 21 A. A first spring 47 is provided at the right side in FIG. 24B of the supporting shaft 49 for supporting the holding pin 45 , and the first spring 47 gives a spring force that causes the holding pin 45 to rotate clockwise in the direction B 1 .
On the other hand, a predetermined lower part of the operational pin 46 protrudes from the bottom part of the main body 21 A. An upper end part of the operational pin 46 engages with the right part in FIG. 24B of the holding pin 45 with respect to the supporting shaft 49 . A second spring 48 shown in FIG. 24B gives a spring force that causes the operational pin 46 to move in the downward direction in FIG. 24B.
With this structure, in a normal state of the holding mechanism 44 where the operational pin 46 is not operated as shown in FIG. 24B, the lower part of the operational pin 46 protrudes from the bottom surface of the main body 21 A. Furthermore, when the holding pin 45 rotates clockwise in the direction B 1 and is directed horizontally (that is, the holding pin 45 protrudes toward the inside (i.e., the opening 26 ) of the main body 21 A from a window part 74 (position alignment surface 23 ) formed on the main body 21 A, the state of the holding mechanism 44 becomes the normal state.
In the normal state of the holding mechanism 44 , when the semiconductor device 3 A is inserted into the electronic component attaching tool 20 M, the semiconductor device 3 A engages with the holding pin 45 that protrudes from the position alignment surface 23 , and is held in the electronic component attaching tool 20 M. The semiconductor device 3 A is thereby prevented from being detached from the electronic component attaching tool 20 M.
The working of the holding mechanism 44 when the operational pin 48 is moved in the upward direction from the normal state shown in FIGS. 24A and 24 B will be described. As shown in FIG. 25B, when an upward force F is applied to the operational pin 46 , the operational pin 46 is moved upward against the spring force of the second spring 48 . When the operational pin 46 is moved upward, the holding pin 45 that engages with the operational pin 46 is driven to rotate counterclockwise in the direction B 2 with the supporting shaft 49 being the center of the rotation. The holding pin 45 is thereby rotated in the direction B 2 against the spring force of the first spring 47 , and gets into the inside of the window part 74 .
Thus, the holding pin 45 comes into the inside of the window part 74 , that is, the holding pin 45 is withdrawn to the inner side of the position alignment surface 23 so that the semiconductor device 3 A held by the holding pin 45 (the holding mechanism 44 ) can be released from the holding pin 45 , and can be moved downward along the position alignment surface 23 .
FIGS. 26A through 28E show a method of attaching the semiconductor device 3 A to the IC socket 30 by using the electronic component attaching tool 20 M that has the holding mechanism 44 . FIG. 26A shows the electronic component attaching tool 20 M before the electronic component attaching tool 20 M is mounted on the IC socket 30 . In the state shown in FIG. 26A, the movable part 32 of the IC socket 30 is located at the upper position (the position to which the movable part 32 is moved in the direction Z 2 ) relative to the fixed part 31 , and a width between the pair of the pin end portions 33 a and 33 b of the contact pin 33 is narrow.
Furthermore, in the state shown in FIG. 26A, the holding mechanism 44 takes the normal state, and the semiconductor device 3 A is mounted on the electronic component attaching tool 20 M in advance. Since the holding mechanism 44 takes the normal state, the semiconductor device 3 A attached to the electronic component attaching tool 20 M engages with the holding pin 45 , so that the semiconductor device 3 A is held by the electronic component attaching tool 20 M.
FIG. 26B shows the electronic component attaching tool 20 M mounted on the IC socket 30 . The electronic component attaching tool 20 M can be easily mounted on the IC socket 30 only by attaching or inserting the electronic component attaching tool 20 M to the depression part formed at the upper part of the movable part 32 . As described above, at this time, the semiconductor device 3 A is mounted on the electronic component attaching tool 20 M in advance, so that the attachment of the electronic component attaching tool 20 M to the IC socket 30 , and the attachment of the semiconductor device 3 A to the IC socket can be performed simultaneously.
By attaching the electronic component attaching tool 20 M to the IC socket 30 , the standard surface 35 contacts with the engaging surface 22 so that the position of the electronic component attaching tool 20 M can be aligned to the IC socket 30 . Furthermore, in the state where the position of the electronic component attaching tool 20 M is aligned to the IC socket 30 , the position of the semiconductor device 3 A can be also aligned to the IC socket 30 . Thus, according to the eleventh embodiment, since the position alignment of the electronic component attaching tool 20 M to the IC socket 30 , and the position alignment of the semiconductor device 3 A to the IC socket 30 can be performed simultaneously, it is possible to improve operability and efficiency of attaching the electronic component attaching tool 20 M and the semiconductor device 3 A to the IC socket 30 . In the state shown in FIG. 26B, the operational pin 46 of the holding mechanism 44 has not been operated yet.
Subsequently, as shown in FIG. 27C, when the electronic component attaching tool 20 M is mounted on the IC socket 30 , the movable part 32 is moved in the direction Z 1 by pushing the electronic component attaching tool 20 M in the direction indicated by the arrows F. At the side of the fixed part 31 , the pair of the pin end portions 33 a and 33 b are thereby moved in the direction of being separated from each other.
Furthermore, when the movable part 32 is moved in the direction Z 1 , an upper surface of a contact pin housing 51 contacts against the operational pin 46 provided at the holding mechanism 44 of the electronic component attaching tool 20 M so that the operational pin 46 can be moved in the upward direction relative to the movable part 32 . Thereby, the holding pin 45 is moved as in the above-described manner. That is, the holding pin 45 is rotated to the position where the holding pin 45 is withdrawn to the inside of the vertical surface 23 B. As a result, the holding of the semiconductor device 3 A by the holding mechanism 44 is released, and the semiconductor device 3 A drops free toward the predetermined attachment position of the IC socket 30 with the semiconductor device 3 A being guided by the vertical surface 23 B. The timing the holding of the semiconductor device 3 A by the electronic component attaching tool 20 M is released can be changed by adjusting the timing the operational pin 46 is moved or by adjusting the state of the engagement between the operational pin 46 and the holding pin 45 . Accordingly, it is possible to attach the semiconductor device 3 A to the IC socket 30 at an arbitrary timing.
FIG. 27D shows the semiconductor device 3 A attached to the predetermined attachment position of the IC socket 30 . As shown in FIG. 27D, each of the bumps 4 of the semiconductor device 3 A is located between the pair of the pin end portions 33 a and 33 b of the contact pin 33 .
As described above, when the semiconductor device 3 A is attached to the predetermined attachment position of the IC socket 30 , the pushing force applied to the electronic component attaching tool 20 M is released. Accordingly, the elastic restoring force of the spring 34 causes the movable part 32 to move in the direction Z 2 so that the width between the pair of the pin end portions 33 a and 33 b can become narrow. As a result, the bump 4 is sandwiched by the pair of the pin end portions 33 a and 33 b . In this state, the bump 4 is electrically connected to the contact pin 33 , and the semiconductor device 3 A is fixed to the IC socket 30 .
Then, as described in FIG. 28E, the electronic component attaching tool 20 M is removed from the IC socket 30 . Also in this embodiment, at this time, it is possible to remove the electronic component attaching tool 20 M from the IC socket 30 without adversely affecting the fixed position of the semiconductor device 3 A on the IC socket 30 , and the connected condition of the semiconductor device 3 A and the IC socket 30 . Furthermore, at this time, since the electronic component attaching tool 20 M is separated from the IC socket, the holding pin 45 and the operational pin 46 of the holding mechanism 44 move to the original positions, so that the holding mechanism 44 takes the normal state again.
As shown in FIG. 26A, the semiconductor device 3 A is attached to the electronic component attaching tool 20 M in advance before the electronic component attaching tool 20 M is mounted on the IC socket 30 . However, the testing of the semiconductor device 3 A may be performed before the semiconductor device 3 A is attached to the IC socket 30 . This testing method will be described with reference FIGS. 29A through 29D.
As shown in FIG. 29A, for example, the semiconductor device 3 A is attached to the electronic component attaching tool 20 M from a tray 50 so as to be held by the holding mechanism 44 . At this time, since the electronic component attaching tool 20 M has the opening 26 that penetrates the electronic component attaching tool 20 M from the upper side to the lower side thereof, the bumps 4 of the semiconductor device 3 A can be seen from the lower side of the electronic component attaching tool 20 M in the state in which the semiconductor device 3 A is held by the holding pin 45 (the holding mechanism 44 ).
For this reason, a testing device 52 A shown in FIG. 29B is provided for optically testing or inspecting the semiconductor device 3 A. The testing device 52 A has a CCD camera 53 at the lower part of the testing device 52 A. This CCD camera 53 can produce an image of an upper side thereof. An upper part of the testing device 52 A is structured so as to mount the electronic component attaching tool 20 M on the testing device 52 A. Accordingly, by mounting the electronic component attaching tool 20 M that holds the semiconductor device 3 A on the testing device 52 A, it is possible to test the bumps 4 of the semiconductor device 3 A.
FIG. 29C shows one example of an image of the semiconductor device 3 A produced by the CCD camera 53 . The CCD camera 53 is connected to an image recognition processing device. Proper image data (referred to as standard image data) of the semiconductor device 3 A having the bumps 4 is stored in the image recognition processing device. The image recognition processing device compares with the standard image data the image data of the tested semiconductor device 3 A that is received from the CCD camera 53 . In this manner, an abnormal state of the tested semiconductor device 3 A is detected.
When there is a defect or damage (in the example shown in FIG. 29C, a loss of the bump 4 ) on the semiconductor device 3 A, the image recognition processing device causes an alarm to ring, for example, in order to make notification about the defect or the damage of the semiconductor device 3 A. Accordingly, it is possible to weed out the semiconductor device 3 A having the defect or the damage that can be recognized from the appearance thereof, improving the efficiency of the testing.
The testing device 52 A shown in FIG. 29B is structured such that the CCD camera 53 and the semiconductor device 3 A directly face each other. However, it is not always necessary that the CCD camera 53 and the semiconductor device 3 A directly face each other, and the arrangement shown in FIG. 30 of the CCD camera 53 and the semiconductor device may be applied. As in an testing device 52 B, by providing a mirror 55 , it is possible to make the testing device 52 B thinner.
Next, a twelfth embodiment of the present invention will be described.
FIGS. 31 through 32C show an electronic component attaching tool 20 N according to the twelfth embodiment of the present invention. In this embodiment, a plurality of semiconductor devices 3 A are arranged at the upper side of one another in the main body 21 A of the electronic component attaching tool 20 N. The electronic component attaching tool 20 N having a plurality of the semiconductor devices 3 A arranged at the upper side of one another can be mounted on the IC socket 30 . Furthermore, in the twelfth embodiment, a first holding mechanism 44 having the substantially same structure as the holding mechanism 44 of the eleventh embodiment, and a second holding mechanism 56 that is different from the first holding mechanism 44 are provided at the electronic component attaching tool 20 N.
In the twelfth embodiment, the length of the main body 21 A of the electronic component attaching tool 20 N is long in the upward and downward directions. Accordingly, as shown in FIG. 31, a plurality of the semiconductor devices 3 A can be arranged at the inside of the position alignment surface 23 (the vertical surface 23 B). The first holding mechanism 44 is formed at the lower part of the main body 21 A. The first holding mechanism 44 holds the semiconductor device 3 A that is located at the lowest level out of a plurality of the semiconductor devices 3 A arranged in the position alignment surface 23 . The structure of the first holding mechanism 44 is the same as that of the holding mechanism 44 of the eleventh embodiment, and a description of the structure of the first holding mechanism 44 is omitted.
The second holding mechanism 56 is provided at the main body 21 A, and the arranged position of the second holding mechanism 56 is higher than the arranged position of the first holding mechanism 44 . The second holding mechanism 56 includes a pressing contact part 57 (dropping prevention member) and a releasing lever 58 (a releasing member).
In a normal state where the releasing lever 58 is not operated, the pressing contact part 57 engages (or contacts) with and holds the semiconductor device 3 A (referred to as the second semiconductor device 3 A) whose level is the second lowest out of a plurality of the semiconductor devices 3 A attached in the position alignment surface 23 . To be specific, the pressing contact part 57 presses the outer circumferential part of the package of the second semiconductor device 3 A so as to hold the second semiconductor device 3 A in the electronic component attaching tool 20 N.
On the other hand, the pressing contact part 57 is connected to the releasing lever 58 , and by operating the releasing lever 58 , the pressing contact part 57 is moved to release the pressing (engagement) of the second semiconductor device 3 A by the pressing contact part 57 . When the second semiconductor device 3 A is released from the pressing (or the engagement) applied by the pressing contact part 57 , the second semiconductor device 3 A can move in the main body 21 A of the electronic component attaching tool 20 N.
A process of attaching the semiconductor device 3 A to the IC socket by using the electronic component attaching tool 20 N having the above-described structure will be described with reference to FIGS. 32A through 32C. FIG. 32A shows the state before the semiconductor device 3 A is attached to the IC socket 30 .
When the semiconductor device 3 A located at the lowest level is attached to the IC socket 30 from the state shown in FIG. 32A by using the electronic component attaching tool 20 N, the same process that is described above with reference to FIGS. 26A through 28D is performed on the electronic component attaching tool 20 N.
FIG. 32B shows the state in which the semiconductor device located at the lowest level is attached to the IC socket 30 . In this state shown in FIG. 32B, the second semiconductor device 3 A is held by the second holding mechanism 56 . Accordingly, even when the semiconductor device 3 A located at the lowest level is attached to the IC socket 30 , the second semiconductor device 3 A keeps the original position in the electronic component attaching tool 20 N.
Therefore, it is possible to prevent a plurality of the semiconductor devices 3 A arranged in the electronic component attaching tool 20 N from dropping out from the electronic component attaching tool 20 N at the time the lowest semiconductor device 3 A is attached to the IC socket 30 by using the electronic component attaching tool 20 N. In the state shown in FIG. 32B, the electronic component attaching tool 20 N is separated from the IC socket 30 , so that the operational pin 46 is also separated from the IC socket 30 , and the state of the holding pin 45 returns to the normal state in which the operational pin 45 protrudes in the opening 26 .
Subsequently, in the state shown in FIG. 32B, the releasing lever 58 of the second holding mechanism 56 is operated. The second semiconductor device 3 A is thereby released from the holding (the pressing) applied by the pressing contact part 57 . As a result, the second semiconductor device 3 A and a plurality of the semiconductor devices 3 A arranged above the second semiconductor device 3 A drop free.
At this time, since the state of the holding pin 45 of the first holding mechanism 44 returns to the normal state as described above, the second semiconductor device is held by the first holding mechanism 44 , that is, the second semiconductor device 3 A becomes the semiconductor device 3 A located at the most lowest level. Furthermore, the semiconductor device 3 A whose level is the third lowest in FIG. 32A is held by the second holding mechanism 56 to become the second semiconductor device 3 A. Thereafter, the above-described process is repeated so that a plurality of the semiconductor devices 3 A accommodated in the electronic component attaching tool 20 N are attached to the IC sockets 30 , respectively.
As described above, according to the electronic component attaching tool 20 N of the twelfth embodiment, by adjusting the timing the semiconductor device to be located at the lowest level is held by the first holding mechanism 44 , the timing the semiconductor device 3 A at the lowest level is released from the holding applied by the first holding mechanism 44 , the timing the semiconductor device 3 A is held by the second holding mechanism 56 , and the timing the second semiconductor device 3 A is released from the holding applied by the second holding mechanism 56 , it is possible to attach the semiconductor devices 3 A to the IC sockets one by one when a plurality of the semiconductor devices 3 A are arranged at the upper side of one another in the main body 21 A. In this manner, it is possible to improve the efficiency of attaching the semiconductor devices 3 A to the IC socket 30 compared with the eleventh embodiment in which one semiconductor device 3 A is accommodated in the main body 21 A.
In the twelfth embodiment, the second holding mechanism 56 holds only the second semiconductor device 3 A. However, the holding target of the second holding mechanism 56 is not limited to the second semiconductor device 3 A, and the second holding mechanism 56 may hold a plurality of the semiconductor devices 3 A together including the second semiconductor device 3 A that are arranged at the upper side of one another in the main body 21 A.
Next, a thirteenth embodiment of the present invention will be described.
FIG. 33 shows an electronic component attaching tool 20 P according to the thirteenth embodiment of the present invention. In the thirteenth embodiment, a plurality of position alignment pins 41 B and 41 C whose sizes are different from each other, and position alignment holes 42 B and 42 C to which the position alignment pins 41 B and 41 C are inserted constitute a position alignment mechanism for aligning the position of the electronic component attaching tool 20 P to the IC socket 30 .
In this embodiment, the position alignment pins 41 B and 41 C are provided at the electronic component attaching tool 20 P, and diameters of the position alignment pins 41 B are larger than diameters of the position alignment pins 41 C. Accordingly, diameters of the position alignment holes 42 B formed on the IC socket 30 are different from diameters of the position alignment holes 42 C so as to correspond to the different sizes of the position alignment pins 41 B and 41 C.
With this simple structure, by only changing sizes or shapes of the position alignment pins 41 B and 41 C and the position alignment holes 42 B and 42 C, it is possible to securely align the electronic component attaching tool 20 P and the IC socket 30 to each other in the accurate direction of the electronic component attaching tool 20 P with respect to the IC socket 30 . According to the thirteenth embodiment, the advantage can be obtained particularly when it is difficult to recognize the attachment direction of the semiconductor device 3 A having a square shape in the plan view, for example.
FIG. 34 shows an electronic component attaching tool 20 Q that is a modification of the electronic component attaching tool 20 P shown in FIG. 33 . In this modification, a recognition mark (index mark) is formed on the upper surface of the main body 21 A. Thus, with the simple structure, by forming the recognition mark 61 on the electronic component attaching tool 20 Q, it is possible to prevent an error of the attachment of the semiconductor device 3 A to the attachment object.
Next, a fourteenth embodiment of the present invention will be described.
FIG. 35 shows an electronic component attaching tool 20 R according to the fourteenth embodiment of the present invention. In the electronic component attaching tools 20 A through 20 N of the above-described embodiments, one position alignment surface 23 is formed on one main body 21 A or 21 B. Meanwhile, in the fourteenth embodiment, a plurality of position alignment surfaces 23 are formed on one main body 21 F of the electronic component attaching tool 20 R.
As shown in FIG. 35, the electronic component attaching tool 20 R is effective particularly when a plurality of IC sockets 30 - 1 through 30 - 3 are provided on a test substrate 36 in advance. In other words, since a plurality of the IC sockets 30 - 1 through 30 - 3 are fixed on the test substrate 36 , the positions of the standard surfaces 35 are already known, and are not changed.
Accordingly, the electronic component attaching tool 20 R having a plurality of the position alignment surfaces 23 that correspond to the IC sockets 30 - 1 through 30 - 3 , respectively can be formed. With this structure of the electronic component attaching tool 20 R, it is possible to align the electronic component attaching tool 20 R to a plurality of the IC sockets 30 - 1 through 30 - 3 at once.
In the electronic component attaching tools 20 A through 20 N of the above-described embodiments, when the electronic component attaching tools are attached to a plurality of the IC sockets, the separate alignment processes need to be performed to a plurality of the IC sockets 30 - 1 through 30 - 3 , respectively. On the other hand, in the fourteenth embodiment, the electronic component attaching tool