Wehrly Jr., James Douglas (Austin, TX, US)
Wilder, James (Austin, TX, US)
Wolfe, Mark (Round Rock, TX, US)
Goodwin, Paul (Austin, TX, US)

Plaque It!

11/283355

11/04/2008

11/18/2005

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Entorian Technologies, LP (Austin, TX, US)

257/730

257/717, 257/720, 257/713, 361/749, 361/709, 361/704, 438/122, 361/718, 257/707

H01L23/34; H01L21/00; H05K7/20

3372310	Universal modular packages for integrated circuits	March, 1968	Kantor
3436604	COMPLEX INTEGRATED CIRCUIT ARRAY AND METHOD FOR FABRICATING SAME	April, 1969	Hyltin
3582865	MICROCIRCUIT MODULE AND CONNECTOR	June, 1971	Franck et al.
3654394	FIELD EFFECT TRANSISTOR SWITCH, PARTICULARLY FOR MULTIPLEXING	April, 1972	Gordon
3704455	3D-COAXIAL MEMORY CONSTRUCTION AND METHOD OF MAKING	November, 1972	Scarbrough
3718842		February, 1973	Abbott, III et al.
3727064	OPTO-ISOLATOR DEVICES AND METHOD FOR THE FABRICATION THEREOF	April, 1973	Bottini
3746934	STACK ARRANGEMENT OF SEMICONDUCTOR CHIPS	July, 1973	Stein
3766439	ELECTRONIC MODULE USING FLEXIBLE PRINTED CIRCUIT BOARD WITH HEAT SINK MEANS	October, 1973	Issacson
3772776	METHOD OF INTERCONNECTING MEMORY PLANE BOARDS	November, 1973	Weisenburger
4169642	Integrated circuit connector	October, 1979	Mouissie
4288841	Double cavity semiconductor chip carrier	September, 1981	Gogal
4342069	Integrated circuit package	July, 1982	Link
4429349	Coil connector	January, 1984	Zachry
4437235	Integrated circuit package	March, 1984	McIver
4513368	Digital data processing system having object-based logical memory addressing and self-structuring modular memory	April, 1985	Houseman
4547834	Structure for assembling complex electronic circuits	October, 1985	Dumont et al.
4567543	Double-sided flexible electronic circuit module	January, 1986	Miniet
4587596	High density mother/daughter circuit board connector	May, 1986	Bunnell
4645944	MOS register for selecting among various data inputs	February, 1987	Uya
4656605	Single in-line memory module	April, 1987	Clayton
4672421	Semiconductor packaging and method	June, 1987	Lin
4682207	Semiconductor device including leadless packages and a base plate for mounting the leadless packages	July, 1987	Akasaki et al.
4696525	Socket for stacking integrated circuit packages	September, 1987	Coller et al.
4709300	Jumper for a semiconductor assembly	November, 1987	Landis
4724611	Method for producing semiconductor module	February, 1988	Hagihara
4727513	Signal in-line memory module	February, 1988	Clayton
4733461	Method of stacking printed circuit boards	March, 1988	Nakano
4739589	Process and apparatus for abrasive machining of a wafer-like workpiece	April, 1988	Brehm et al.
4763188	Packaging system for multiple semiconductor devices	August, 1988	Johnson
4771366	Ceramic card assembly having enhanced power distribution and cooling	September, 1988	Blake et al.
4821007	Strip line circuit component and method of manufacture	April, 1989	Fields et al.
4823234	Semiconductor device and its manufacture	April, 1989	Konishi et al.
4833568	Three-dimensional circuit component assembly and method corresponding thereto	May, 1989	Berhold
4850892	Connecting apparatus for electrically connecting memory modules to a printed circuit board	July, 1989	Clayton et al.
4862249	Packaging system for stacking integrated circuits	August, 1989	Carlson
4911643	High density and high signal integrity connector	March, 1990	Perry et al.
4953060	Stackable integrated circuit chip package with improved heat removal	August, 1990	Lauffer et al.
4956694	Integrated circuit chip stacking	September, 1990	Eide
4972580	Method for connecting electronic components with dummy patterns	November, 1990	Nakamura
4982266	Integrated circuit with metal interconnecting layers above and below active circuitry	January, 1991	Watanabe et al.
4983533	High-density electronic modules - process and product	January, 1991	Go
4985703	Analog multiplexer	January, 1991	Kaneyama
4992849	Directly bonded board multiple integrated circuit module	February, 1991	Corbett et al.
4992850	Directly bonded simm module	February, 1991	Corbett et al.
5014115	Coplanar waveguide semiconductor package	May, 1991	Moser
5014161	System for detachably mounting semiconductors on conductor substrate	May, 1991	Lee et al.
5016138	Three dimensional integrated circuit package	May, 1991	Woodman
5025306	Assembly of semiconductor chips	June, 1991	Johnson et al.
5034350	Semiconductor device package with dies mounted on both sides of the central pad of a metal frame	July, 1991	Marchisi
5041015	Electrical jumper assembly	August, 1991	Travis
5053853	Modular electronic packaging system	October, 1991	Haj-Ali-Ahmadi et al.
5065277	Three dimensional packaging arrangement for computer systems and the like	November, 1991	Davidson
5099393	Electronic package for high density applications	March, 1992	Bentlage et al.
5104820	Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting	April, 1992	Go et al.
5109318	Pluggable electronic circuit package assembly with snap together heat sink housing	April, 1992	Funari et al.
5117282	Stacked configuration for integrated circuit devices	May, 1992	Salatino
5119269	Semiconductor with a battery unit	June, 1992	Nakayama
5138430	High performance versatile thermally enhanced IC chip mounting	August, 1992	Gow, III et al.
5138434	Packaging for semiconductor logic devices	August, 1992	Wood et al.
5140405	Semiconductor assembly utilizing elastomeric single axis conductive interconnect	August, 1992	King et al.
5159535	Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate	October, 1992	Desai et al.
5173840	Molded IC card	December, 1992	Kodai et al.
5191404	High density memory array packaging	March, 1993	Wu et al.
5208729	Multi-chip module	May, 1993	Cipolla et al.
5214845	Method for producing high speed integrated circuits	June, 1993	King et al.
5219377	High temperature co-fired ceramic integrated phased array package	June, 1993	Poradish
5222014	Three-dimensional multi-chip pad array carrier	June, 1993	Lin
5224023	Foldable electronic assembly module	June, 1993	Smith et al.
5229916	Chip edge interconnect overlay element	July, 1993	Frankeny et al.
5229917	VLSI integration into a 3-D WSI dual composite module	July, 1993	Harris et al.
5239198	Overmolded semiconductor device having solder ball and edge lead connective structure	August, 1993	Lin et al.
5241454	Mutlilayered flexible circuit package	August, 1993	Ameen et al.
5241456	Compact high density interconnect structure	August, 1993	Marcinkiewiez et al.
5247423	Stacking three dimensional leadless multi-chip module and method for making the same	September, 1993	Lin et al.
5252857	Stacked DCA memory chips	October, 1993	Kane et al.
5259770	Impedance controlled elastomeric connector	November, 1993	Bates et al.
5261068	Dual path memory retrieval system for an interleaved dynamic RAM memory unit	November, 1993	Gaskins et al.
5268815	High density, high performance memory circuit package	December, 1993	Cipolla et al.
5276418	Flexible substrate electronic assembly	January, 1994	Klosowiak et al.
5281852	Semiconductor device including stacked die	January, 1994	Normington
5289062	Fast transmission gate switch	February, 1994	Wyland
5309986	Heat pipe	May, 1994	Itoh
5313097	High density memory module	May, 1994	Haj-Ali-Ahmadi et al.
5347428	Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip	September, 1994	Carson et al.
5375041	Ra-tab array bump tab tape based I.C. package	December, 1994	McMahon
5386341	Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape	January, 1995	Olson et al.
5394300	Thin multilayered IC memory card	February, 1995	Yoshimura
5397916	Semiconductor device including stacked die	March, 1995	Normington
5400003	Inherently impedance matched integrated circuit module	March, 1995	Kledzik
5428190	Rigid-flex board with anisotropic interconnect and method of manufacture	June, 1995	Stopperan
5438224	Integrated circuit package having a face-to-face IC chip arrangement	August, 1995	Papageorge et al.
5448511	Memory stack with an integrated interconnect and mounting structure	September, 1995	Paurus et al.
5477082	Bi-planar multi-chip module	December, 1995	Buckley, III et al.
5491612	Three-dimensional modular assembly of integrated circuits	February, 1996	Nicewarner, Jr. et al.
5502333	Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit	March, 1996	Bertin et al.
5523619	High density memory structure	June, 1996	McAlister et al.
5523695	Universal test socket for exposing the active surface of an integrated circuit in a die-down package	June, 1996	Lin
5541812	Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame	July, 1996	Burns
5572065	Hermetically sealed ceramic integrated circuit heat dissipating package	November, 1996	Burns
5600178	Semiconductor package having interdigitated leads	February, 1997	Russell
5612570	Chip stack and method of making same	March, 1997	Eide et al.
5631193	High density lead-on-package fabrication method	May, 1997	Burns
5642055	Electrical interconnect using particle enhanced joining of metal surfaces	June, 1997	Difrancesco
5644161	Ultra-high density warp-resistant memory module	July, 1997	Burns
5646446	Three-dimensional flexible assembly of integrated circuits	July, 1997	Nicewarner et al.
5654877	Lead-on-chip integrated circuit apparatus	August, 1997	Burns
5661339	Thin multichip module	August, 1997	Clayton
5686730	Dimm pair with data memory and state memory	November, 1997	Laudon et al.
5708297	Thin multichip module	January, 1998	Clayton
5714802	High-density electronic module	February, 1998	Cloud et al.
5717556	Printed-wiring board having plural parallel-connected interconnections	February, 1998	Yanagida
5729894	Method of assembling ball bump grid array semiconductor packages	March, 1998	Rostoker et al.
5731633	Thin multichip module	March, 1998	Clayton	257/723
5744862	Reduced thickness semiconductor device with IC packages mounted in openings on substrate	April, 1998	Ishii
5751553	Thin multichip module including a connector frame socket having first and second apertures	May, 1998	Clayton
5754409	Foldable electronic assembly module	May, 1998	Smith
5764497	Circuit board connection method and connection structure	June, 1998	Mizumo
5776797	Three-dimensional flexible assembly of integrated circuits	July, 1998	Nicewarner, Jr. et al.
5789815	Three dimensional semiconductor package having flexible appendages	August, 1998	Tessier et al.
5790447	High-memory capacity DIMM with data and state memory	August, 1998	Laudon et al.
5802395	High density memory modules with improved data bus performance	September, 1998	Connolly et al.
5805422	Semiconductor package with flexible board and method of fabricating the same	September, 1998	Otake et al.
5828125	Ultra-high density warp-resistant memory module	October, 1998	Burns
5835988	Packed semiconductor device with wrap around external leads	November, 1998	Ishii
5869353	Modular panel stacking process	February, 1999	Levy et al.
5899705	Stacked leads-over chip multi-chip module	May, 1999	Akram
5917709	Multiple circuit board assembly having an interconnect mechanism that includes a flex connector	June, 1999	Johnson et al.
5925934	Low cost and highly reliable chip-sized package	July, 1999	Lim
5926369	Vertically integrated multi-chip circuit package with heat-sink support	July, 1999	Ingraham et al.
5949657	Bottom or top jumpered foldable electronic assembly	September, 1999	Karabatsos
5953214	Dual substrate package assembly coupled to a conducting member	September, 1999	Dranchak et al.
5953215	Apparatus and method for improving computer memory speed and capacity	September, 1999	Karabatsos
5959839	Apparatus for heat removal using a flexible backplane	September, 1999	Gates
5963427	Multi-chip module with flexible circuit board	October, 1999	Bollesen
5966287	Clip on heat exchanger for a memory module and assembly method	October, 1999	Lofland et al.	361/704
5973395	IC package having a single wiring sheet with a lead pattern disposed thereon	October, 1999	Suzuki et al.
5995370	Heat-sinking arrangement for circuit elements	November, 1999	Nakamori
6002167	Semiconductor device having lead on chip structure	December, 1999	Hatano et al.
6002589	Integrated circuit package for coupling to a printed circuit board	December, 1999	Perino et al.
6008538	Method and apparatus providing redundancy for fabricating highly reliable memory modules	December, 1999	Akram et al.
6014316	IC stack utilizing BGA contacts	January, 2000	Eide
6021048	High speed memory module	February, 2000	Smith
6025992	Integrated heat exchanger for memory module	February, 2000	Dodge et al.	361/704
6028352	IC stack utilizing secondary leadframes	February, 2000	Eide
6028365	Integrated circuit package and method of fabrication	February, 2000	Akram et al.
6034878	Source-clock-synchronized memory system and memory unit	March, 2000	Osaka et al.
6038132	Memory module	March, 2000	Tokunaga et al.
6040624	Semiconductor device package and method	March, 2000	Chambers et al.
6049975	Method of forming a thin multichip module	April, 2000	Clayton
6060339	Method and apparatus providing redundancy for fabricating highly reliable memory modules	May, 2000	Akram et al.
6072233	Stackable ball grid array package	June, 2000	Corisis et al.
6078515	Memory system with multiple addressing and control busses	June, 2000	Nielsen et al.
6084294	Semiconductor device comprising stacked semiconductor elements	July, 2000	Tomita
6091145	Thin multichip module including a connector frame socket	July, 2000	Clayton
6097087	Semiconductor package including flex circuit, interconnects and dense array external contacts	August, 2000	Farnworth et al.
6111757	SIMM/DIMM memory module	August, 2000	Dell et al.
6121676	Stacked microelectronic assembly and method therefor	September, 2000	Solberg
RE36916	Apparatus for stacking semiconductor chips	October, 2000	Moshayedi
6157541	Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements	December, 2000	Hacke
6172874	System for stacking of integrated circuit packages	January, 2001	Bartilson
6178093	Information handling system with circuit assembly having holes filled with filler material	January, 2001	Bhatt et al.
6180881	Chip stack and method of making same	January, 2001	Isaak
6187652	Method of fabrication of multiple-layer high density substrate	February, 2001	Chou et al.
6205654	Method of manufacturing a surface mount package	March, 2001	Burns
6208521	Film carrier and laminate type mounting structure using same	March, 2001	Nakatsuka
6208546	Memory module	March, 2001	Ikeda
6214641	Method of fabricating a multi-chip module	April, 2001	Akram
6215181	Method and apparatus providing redundancy for fabricating highly reliable memory modules	April, 2001	Akram et al.
6215687	Semiconductor device and process for manufacturing the same	April, 2001	Sugano et al.
6222737	Universal package and method of forming the same	April, 2001	Ross
6222739	High-density computer module with stacked parallel-plane packaging	April, 2001	Bhakta et al.
6225688	Stacked microelectronic assembly and method therefor	May, 2001	Kim et al.
6232659	Thin multichip module	May, 2001	Clayton
6233650	Using FET switches for large memory arrays	May, 2001	Johnson et al.
6234820	Method and apparatus for joining printed circuit boards	May, 2001	Perino et al.
6262476	Composite member composed of at least two integrated circuits and method for the manufacture of a composite member composed of at least two integrated circuits	July, 2001	Vidal
6262895	Stackable chip package with flex carrier	July, 2001	Forthun
6265660	Package stack via bottom leaded plastic (BLP) packaging	July, 2001	Tandy
6266252	Apparatus and method for terminating a computer memory bus	July, 2001	Karabatsos
6281577	Chips arranged in plurality of planes and electrically connected to one another	August, 2001	Oppermann et al.
6288907	High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief	September, 2001	Burns
6288924	Semiconductor device and process for manufacturing the same	September, 2001	Sugano et al.
6300679	Flexible substrate for packaging a semiconductor component	October, 2001	Mukerji et al.
6316825	Chip stack package utilizing a connecting hole to improve electrical connection between leadframes	November, 2001	Park et al.
6323060	Stackable flex circuit IC package and method of making same	November, 2001	Isaak
6336262	Process of forming a capacitor with multi-level interconnection technology	January, 2002	Dalal et al.
6343020	Memory module	January, 2002	Lin et al.
6347394	Buffering circuit embedded in an integrated circuit device module used for buffering clocks and other input signals	February, 2002	Ochoa et al.
6349050	Methods and systems for reducing heat flux in memory systems	February, 2002	Woo et al.
6351029	Stackable flex circuit chip package and method of making same	February, 2002	Isaak
6357023	Connector assembly for testing memory modules from the solder-side of a PC motherboard with forced hot air	March, 2002	Co et al.
6358772	Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package	March, 2002	Miyoshi
6360433	Universal package and method of forming the same	March, 2002	Ross
6368896	Method of wafer level chip scale packaging	April, 2002	Farnworth et al.
6370668	High speed memory system capable of selectively operating in non-chip-kill and chip-kill modes	April, 2002	Garrett, Jr. et al.
6376769	High-density electronic package, and method for making same	April, 2002	Chung
6392162	Double-sided flexible jumper assembly and method of manufacture	May, 2002	Karabatsos
6404043	Panel stacking of BGA devices to form three-dimensional modules	June, 2002	Isaak
6410857	Signal cross-over interconnect for a double-sided circuit card assembly	June, 2002	Gonya
6424532	Heat sink and memory module with heat sink	July, 2002	Kawamura	361/708
6426240	Stackable flex circuit chip package and method of making same	July, 2002	Isaak
6426549	Stackable flex circuit IC package and method of making same	July, 2002	Isaak
6426560	Semiconductor device and memory module	July, 2002	Kawamura et al.
6428360	Memory module with offset notches for improved insertion and stability and memory module connector	August, 2002	Hassanzadeh et al.
6433418	Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism	August, 2002	Fujisawa et al.
6444921	Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like	September, 2002	Wang et al.
6446158	Memory system using FET switches to select memory banks	September, 2002	Karabatsos
6449159	Semiconductor module with imbedded heat spreader	September, 2002	Haba
6452826	Memory module system	September, 2002	Kim et al.
6459152	Semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface	October, 2002	Tomita et al.
6462412	Foldable, flexible laminate type semiconductor apparatus with reinforcing and heat-radiating plates	October, 2002	Kamei et al.
6465877	Semiconductor package including flex circuit, interconnects and dense array external contacts	October, 2002	Farnworth et al.
6465893	Stacked chip assembly	October, 2002	Khandros et al.
6472735	Three-dimensional memory stacking using anisotropic epoxy interconnections	October, 2002	Isaak
6473308	Stackable chip package with flex carrier	October, 2002	Forthun
6486544	Semiconductor device and method manufacturing the same, circuit board, and electronic instrument	November, 2002	Hashimoto
6489687	Semiconductor device and method of manufacturing the same, manufacturing device, circuit board, and electronic equipment	December, 2002	Hashimoto
6502161	Memory system including a point-to-point linked memory subsystem	December, 2002	Perego et al.
6514793	Stackable flex circuit IC package and method of making same	February, 2003	Isaak
6521984	Semiconductor module with semiconductor devices attached to upper and lower surface of a semiconductor substrate	February, 2003	Matsuura
6528870	Semiconductor device having a plurality of stacked wiring boards	March, 2003	Fukatsu et al.
6531772	Electronic system including memory module with redundant memory capability	March, 2003	Akram et al.
6544815	Panel stacking of BGA devices to form three-dimensional modules	April, 2003	Isaak
6552910	Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture	April, 2003	Moon et al.
6552948	Methods and systems for reducing heat flux in memory systems	April, 2003	Woo et al.
6560117	Packaged microelectronic die assemblies and methods of manufacture	May, 2003	Moon
6566746	Panel stacking of BGA devices to form three-dimensional modules	May, 2003	Isaak et al.
6572387	Flexible circuit connector for stacked chip module	June, 2003	Burns et al.
6573593	Integrated circuit with a housing accommodating the integrated circuit	June, 2003	Syri et al.
6576992	Chip scale stacking system and method	June, 2003	Cady et al.
6588095	Method of processing a device by electrophoresis coating	July, 2003	Pan
6590282	Stacked semiconductor package formed on a substrate and method for fabrication	July, 2003	Wang et al.
6600222	Stacked microelectronic packages	July, 2003	Levardo
6614664	Memory module having series-connected printed circuit boards	September, 2003	Lee
6627984	Chip stack with differing chip package types	September, 2003	Bruce et al.
6629855	Memory system including guides that receive memory modules	October, 2003	North et al.
6646936	Semiconductor memory device shiftable to test mode in module as well as semiconductor memory module using the same	November, 2003	Hamamatsu et al.
6660561	Method of assembling a stackable integrated circuit chip	December, 2003	Forthun
6661092	Memory module	December, 2003	Shibata et al.
6677670	Semiconductor device	January, 2004	Kondo
6683377	Multi-stacked memory package	January, 2004	Shim et al.
6690584	Information-processing device having a crossbar-board connected to back panels on different sides	February, 2004	Uzuka et al.
6699730	Stacked microelectronic assembly and method therefor	March, 2004	Kim et al.
6720652	Apparatus providing redundancy for fabricating highly reliable memory modules	April, 2004	Akram et al.
6721181	Elongated heat sink for use in converter assemblies	April, 2004	Pfeifer et al.
6721185	Memory module having balanced data I/O contacts pads	April, 2004	Dong et al.
6721226	Methods and systems for reducing heat flux in memory systems	April, 2004	Woo et al.
6744656	Semiconductor device and process for manufacturing the same	June, 2004	Sugano et al.
6751113	Arrangement of integrated circuits in a memory module	June, 2004	Bhakta et al.
6756661	Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device	June, 2004	Tsuneda et al.
6760220	Rugged modular PC 104 chassis with blind mate connector and forced convection cooling capabilities	July, 2004	Canter et al.
6762942	Break away, high speed, folded, jumperless electronic assembly	July, 2004	Smith
6768660	Multi-chip memory devices and modules including independent control of memory chips	July, 2004	Kong et al.
6833981	Spin valve magnetic head with three underlayers	December, 2004	Suwabe et al.
6833984	Semiconductor module with serial bus connection to multiple dies	December, 2004	Belgacem
6839266	Memory module with offset data lines and bit line swizzle configuration	January, 2005	Garrett, Jr. et al.
6841868	Memory modules including capacity for additional memory	January, 2005	Akram et al.
6850414	Electronic printed circuit board having a plurality of identically designed, housing-encapsulated semiconductor memories	February, 2005	Benisek et al.
6873534	Arrangement of integrated circuits in a memory module	March, 2005	Bhakta et al.
6878571	Panel stacking of BGA devices to form three-dimensional modules	April, 2005	Isaak et al.
6884653	Folded interposer	April, 2005	Larson
6914324	Memory expansion and chip scale stacking system and method	July, 2005	Rapport et al.
6919626	High density integrated circuit module	July, 2005	Burns
6956284	Integrated circuit stacking system and method	October, 2005	Cady et al.
7053478	Pitch change and chip scale stacking system	May, 2006	Roper et al.
7079396	Memory module cooling	July, 2006	Gates et al.	361/719
7094632	Low profile chip scale stacking system and method	August, 2006	Cady et al.
7180167	Low profile stacking system and method	February, 2007	Patridge et al.
7289327	Active cooling methods and apparatus for modules	October, 2007	Goodwin et al.	361/701
7324352	High capacity thin module system and method	January, 2008	Goodwin	361/803
20010001085	Memory module with offset notches for improved insertion and memory module connector	May, 2001	Hassanzadeh et al.
20010006252	Stacked microelectronic assembly and method therefor	July, 2001	Kim et al.
20010013423	FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALLIC CAP ON SOLDER	August, 2001	Dalal et al.
20010015487	Stackable chip package with flex carrier	August, 2001	Forthun
20010026009	Semiconductor devicse, a semicinductor module loaded with said semiconductor device and a method of manufacturing said semicoductor device	October, 2001	Tsuneda et al.
20010028588	Semiconductor memory	October, 2001	Yamada et al.
20010035572	Stackable flex circuit chip package and method of making same	November, 2001	Isaak
20010040793	Electronic device and method of producing the same	November, 2001	Inaba	361/749
20010052637	Memory modules including capacity for additional memory	December, 2001	Akram et al.
20020001216	SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING THE SAME	January, 2002	Sugano et al.
20020006032	Low-profile registered DIMM	January, 2002	Karabatsos
20020030995	Headlight	March, 2002	Shoji
20020076919	Composite interposer and method for producing a composite interposer	June, 2002	Peters et al.
20020094603	Three-dimensional memory stacking using anisotropic epoxy interconnections	July, 2002	Isaak
20020101261	Tri-directional, high-speed bus switch	August, 2002	Karabatsos
20020139577	In-street integrated circuit wafer via	October, 2002	Miller
20020164838	Flexible ball grid array chip scale packages and methods of fabrication	November, 2002	Moon et al.
20020180022	Semiconductor device	December, 2002	Emoto
20020185731	Method and apparatus providing redundancy for fabricating highly reliable memory modules	December, 2002	Akram et al.
20020196612	Arrangement of memory chip housings on a DIMM circuit board	December, 2002	Gall et al.
20030002262	Electronic printed circuit board having a plurality of identically designed, housing-encapsulated semiconductor memories	January, 2003	Benisek et al.
20030026155	Semiconductor memory module and register buffer device for use in the same	February, 2003	Yamagata
20030035328	Semiconductor memory device shiftable to test mode in module as well as semiconductor memory module using the same	February, 2003	Hamamatsu et al.
20030045025	Method of fabricating a molded package for micromechanical devices	March, 2003	Coyle et al.
20030049886	Electronic system modules and method of fabrication	March, 2003	Salmon
20030064548	Panel stacking of BGA devices to form three-dimensional modules	April, 2003	Isaak
20030081387	Module and connector having multiple contact rows	May, 2003	Schulz
20030081392	Integrated circuit stacking system and method	May, 2003	Cady et al.
20030089978	Memory-module and a method of manufacturing the same	May, 2003	Miyamoto et al.
20030090879	Dual inline memory module	May, 2003	Doblar et al.
20030096497	Electrode structure for use in an integrated circuit	May, 2003	Moore et al.
20030109078	Semiconductor device, method for manufacturing the same, and method for mounting the same	June, 2003	Takahashi et al.
20030116835	Memory-module and a method of manufacturing the same	June, 2003	Miyamoto et al.
20030159278	Methods and apparatus for fabricating Chip-on-Board modules	August, 2003	Peddle
20030168725	Methods of making microelectronic assemblies including folded substrates	September, 2003	Warner et al.
20040000708	Memory expansion and chip scale stacking system and method	January, 2004	Rapport et al.
20040012991	Semiconductor memory module	January, 2004	Kozaru
20040021211	Microelectronic adaptors, assemblies and methods	February, 2004	Damberg
20040099938	Assemblies having stacked semiconductor chips and methods of making same	May, 2004	Kang et al.
20040150107	Stack package and fabricating method thereof	August, 2004	Cha et al.
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Chambliss, Alonzo

Fish & Richardson P.C.

RELATED APPLICATIONS

This application is a continuation-in-part of U.S. patent application Ser. No. 11/231,418, filed Sep. 21, 2005, pending, which application is, in turn, a continuation-in-part of Pat. App. No. PCT/US05/28547 filed Aug. 10, 2005, pending, as well as a continuation-in-part of U.S. patent application Ser. No. 11/068,688 filed Mar. 1, 2005, now U.S. Pat. No. 7,324,352, which application is a continuation-in-part of U.S. patent application Ser. No. 11/007,551 filed Dec. 8, 2004, pending, which application is a continuation-in-part of U.S. patent application Ser. No. 10/934,027 filed Sep. 3, 2004, pending. This application is also a continuation-in-part of U.S. patent application Ser. No. 11/005,992 filed Dec. 7, 2004, pending, which application is a continuation-in-part of U.S. patent application Ser. No. 10/934,027 filed Sep. 3, 2004. This application is also a continuation-in-part of U.S. patent application Ser. No. 11/193,954 filed Jul. 29, 2005, pending, which application is a continuation-in-part of U.S. patent application Ser. No. 11/007,551 filed Dec. 8, 2004, pending. This application is also a continuation-in-part of U.S. patent application Ser. No. 10/934,027 filed Sep. 3, 2004, pending. This application is also a continuation-in-part of U.S. patent application Ser. No. 11/123,721 filed May 6, 2005, pending, which application is a continuation-in-part of both U.S. patent application Ser. No. 11/068,688 filed Mar. 1, 2005, now U.S. Pat. No. 7,324,352 and U.S. patent application Ser. No. 11/005,992 filed Dec. 7, 2004, both of which are pending.

The invention claimed is:

1. A circuit module comprising: a rigid substrate having two opposing lateral sides, an edge and a substrate extension; flex circuit having a first side which has plural contacts adapted for connection to a circuit board socket and first-flex-side first and second ranks of plural memory ICs between which are disposed the plural contacts, and the flex circuit having a second side which has second-flex-side first and second ranks of plural memory ICs, the flex circuit being disposed about the edge of the rigid substrate to dispose the second-flex-side first and second ranks of plural memory lCs adjacent to the rigid substrate; a first thermal spreader adjacent to and thermally connected to the first-flex-side first rank of plural memory ICs and a second thermal spreader adjacent to and thermally connected to the first-flex-side second rank of plural memory lCs, wherein the first and second thermal spreaders each exhibiting a thermal path extension which cooperates with a substrate extension to provide a thermal conduction path from the second-flex-side first and second ranks of plural ICs to the first and second thermal spreaders, respectively.

2. The circuit module of claim 1 in which the rigid substrate is comprised of thermally conductive material.

3. The circuit module of claims 1 or 2 in which an IC having a function other than memory is populated on the second side of the flex circuit.

4. The circuit module of claim 3 in which the IC having a function other than Memory is an AMB.

5. The circuit module of claims 2 or 4 in which the first and second thermal spreaders each have at least one added extension in addition to the thermal path extension.

6. The circuit module of claim 1 in which the rigid substrate and the thermal spreaders are comprised of metallic thermally conductive material.

7. The circuit module of claim 1 in which the rigid substrate is comprised of aluminum.

8. The circuit module of claim 1 in which the rigid substrate and the thermal spreaders are comprised of aluminum.

9. A circuit module comprising: (a) a rigid substrate having two opposing lateral sides and an edge and a thermal sink accessible on at least one of the two opposing lateral sides of the substrate; and (b) a flex circuit having first and second sides, the first side of the flex circuit having plural contacts adapted for connection to a circuit board socket and at least the first of the first and second sides of the flex circuit being populated with plural memory CSPs with the second major side of the flex circuit being populated with at least an AMB, the flex circuit being disposed about the edge of the rigid substrate to dispose the AMB in thermal contact with the thermal sink; (c) first and second thermal spreaders each exhibiting a thermal path extension which cooperates with a substrate extension to provide a thermal conduction path front the first side plural memory CSPs to the first and second thermal spreaders, respectively.

10. The circuit module of claim 9 in which the rigid substrate is comprised of thermally conductive material.

11. The circuit module of claim 9 or 10 in which the substrate exhibits at least one extension.

12. The circuit module of claim 9 or 10 in which the rigid substrate is comprised of aluminum.

13. The circuit module of claim 9 in which at least a portion of the thermal sink provides an indentation into which, at least in part, a portion of the AMB is introduced.

14. The circuit module of claim 9 in which the thermal contact is realized through thermally conductive adhesive.

15. The circuit module of claim 9 in which both the first and second sides of the flex circuit are populated with plural memory CSPs.

16. The circuit module of claim 9 in which the thermal sink is comprised of copper.

17. The circuit module of claim 9 in which the thermal sink is comprised of non-metallic material that is thermally-conductive.

18. The circuit module of claim 9 in which the rigid substrate exhibits a window through which the thermal sink is accessible.

19. The circuit module of claim 9 in which the thermal sink is across a window of the rigid substrate.

20. The circuit module of claim 9 in which the thermal sink covers a window of the rigid substrate.

21. A circuit module comprising: a rigid substrate comprised of thermally conductive material and having first and second opposing lateral sides and an edge the rigid substrate having a window through the substrate; (a) to first and second thermal spreaders; (b) first and second thermal spreaders; (c) a thermal sink, at least a part of which is accessible in the window through the substrate; (d) a flex circuit having first and second sides, the firm side of the flex circuit having plural contacts adapted for connection to a circuit board socket and the first and second sides of the flex circuit being populated with plural CSPs of a first type with the second major side of the flex circuit being populated with at least one CSP of a second type, the flex circuit being disposed about the edge of the rigid substrate to dispose the at least one CSP of the second type in thermal contact with the thermal sink and the first thermal spreader being disposed adjacent to and in thermal connection with at least a selected first one of the plural CSPs of the first type and the second thermal spreader being disposed adjacent to and in thermal connection with at least a selected second one of the plural CSPs of the first type, wherein the first and second thermal spreaders each exhibiting a thermal path extension which cooperates with a substrate extension to provide a thermal conduction path from the plural memory CSPs to tire first and second thermal spreaders, respectively.

22. The circuit module of claim 21 in which the rigid substrate is comprised of thermally conductive material.

23. The circuit module of claim 21 in which the thermal sink is configured with an indentation into which, at least in part, a portion of the at least one CSP of the second type is introduced.

24. The circuit module of claim 21 in which the substrate is comprised of aluminum and the first and second thermal spreaders are comprised of aluminum and the substrate exhibits an extension.

25. The circuit module of claim 21 in which the rigid substrate is comprised of metallic thermally-conductive material.

26. The circuit module of claim 21 in which the thermal sink is comprised of copper.

27. The circuit module of claim 21 further comprising at least one alignment hole in the flex circuit for use in aligning the flex circuit with the substrate during assembly.

28. The circuit module of claim 21 in which the flex circuit is comprised of more than one conductive layer.

29. The circuit module of claim 21 in which the flex circuit is comprised for four conductive layers.

30. A circuit module comprising: a rigid substrate have first and second lateral sides, an edge, and a substrate extension; a flex circuit populated with plural ICs and having a set of contacts for insertion in a circuit board edge connector, the flex circuit being disposed about the edge of the substrate to place the flex circuit on each side of the rigid substrate; and first and second thermal spreaders disposed in thermal connection with and adjacent to selected ones of the plural ICs, each of the first and second thermal spreaders exhibiting a thermal path extension which cooperates with a substrate extension to provide a thermal conduction path from the plural ICs to the first and second thermal spreaders.

31. The circuit module of claim 30 in which the rigid substrate is comprised of thermally conductive material.

32. The circuit module of claim 31 in which the rigid substrate exhibits a substrate extension which forms a part of a thermal path between the rigid substrate and the selected ones of the plural ICs which are adjacent to the first or second thermal spreaders.

33. The circuit module of claim 30 in which the flex circuit is comprised of more than one conductive layer.

34. A circuit module comprising: (a) a rigid substrate having two opposing lateral sides and an edge and an extension; (b) a flex circuit having plural contacts adapted for connection to a circuit board socket, the flex circuit being populated with plural CSPs of a first type and at least one CSP of a second type, the flex circuit being disposed about the edge of the rigid substrate to dispose the at least one CSP of the second type in thermal contact with the rigid substrate: and (c) first and second thermal spreaders each of which is adjacent to selected ones of the plural CSPs of the first type, each of the first and second thermal spreaders exhibiting a thermal path extension which cooperates with a substrate extension thermal conduction path from the plural CSPs to the first and second thermal spreaders.

FIELD

The present invention relates to systems and methods for creating high density circuit modules and, in particular, to systems and methods for creating such modules with features directed to reducing thermal loading.

BACKGROUND

Memory expansion is one of the many fields where high density circuit module solutions provide space-saving advantages. For example, the well-known DIMM (Dual In-line Memory Module) has been used for years, in various forms, to provide memory expansion. A typical DIMM includes a conventional PCB (printed circuit board) with memory devices and supporting digital logic devices mounted on both sides. The DIMM is typically mounted in the host computer system by inserting a contact-bearing edge of the DIMM into a card edge connector. Typically, systems that employ DIMMs provide limited profile space for such devices and conventional DIMM-based solutions have typically provided only a moderate amount of memory expansion.

As bus speeds have increased, fewer devices per channel can be reliably addressed with a DIMM-based solution. For example, 288 ICs or devices per channel may be addressed using the SDRAM-100 bus protocol with an unbuffered DIMM. Using the DDR-200 bus protocol, approximately 144 devices may be addressed per channel. With the DDR2-400 bus protocol, only 72 devices per channel may be addressed. This constraint has led to the development of the fully-buffered DIMM (FB-DIMM) with buffered C/A and data in which 288 devices per channel may be addressed. That buffering function is provided by what is typically identified as the Advanced Memory Buffer or AMB. With the FB-DIMM, not only has capacity increased, pin count has declined to approximately 69 signal pins from the approximately 240 pins previously required.

The FB-DIMM circuit solution is expected to offer practical motherboard memory capacities of up to about 192 gigabytes with six channels and eight DIMMs per channel and two ranks per DIMM using one gigabyte DRAMs. This solution should also be adaptable to next generation technologies and should exhibit significant downward compatibility.

There are several known methods to improve the limited capacity of a DIMM or other circuit board. In one strategy, for example, small circuit boards (daughter cards) are connected to the DIMM to provide extra mounting space. The additional connection may, however, cause flawed signal integrity for the data signals passing from the DIMM to the daughter card while the additional thickness of the daughter card(s) increases the profile of the module.

Multiple die packages (MDP) can also be used to increase DIMM capacity. This scheme increases the capacity of the memory devices on the DIMM by including multiple semiconductor die in a single device package. The additional heat generated by the multiple die typically requires, however, additional cooling capabilities to operate at maximum operating speed. Further, the MDP scheme may exhibit increased costs because of increased yield loss from packaging together multiple die that are not fully pre-tested.

Stacked packages are yet another way to increase module capacity. Capacity is increased by stacking packaged integrated circuits to create a high-density circuit module for mounting on the larger circuit board. In some techniques, flexible conductors are used to selectively interconnect packaged integrated circuits. Staktek Group L.P. has developed numerous systems for aggregating CSP (chipscale packaged) devices in space saving topologies. The increased component height of some stacking techniques may, however, alter system requirements such as, for example, required cooling airflow or the minimum spacing around a circuit board on its host system.

Typically, the known methods for improved memory module performance or enlarged capacity raise thermal management issues. For example, when a conventional packaged DRAM is mounted on a DIMM, the primary thermal path is through the balls of the package into the core of a multilayer DIMM that has less than desirable thermal characteristics. In particular, when an advanced memory buffer (AMB) is employed in an FB-DIMM, a significant amount of heat is generated. Consequently, the already marginal thermal shedding attributes of DIMM circuit modules is exacerbated in a typical FB-DIMM by the localized generation of heat by the AMB.

What is needed, therefore, are methods and structures for providing high capacity circuit boards in thermally-efficient, reliable designs that perform well at higher frequencies but are not too large, yet can be made at reasonable cost with commonly available and readily managed materials.

SUMMARY

Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides of the flexible circuitry. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is supported by a rigid substrate, about which it is disposed in preferred embodiments, thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact or connection with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts a perspective view of a module devised in accordance with a preferred embodiment of the present invention.

FIG. 2 is an enlarged view of the area marked “A” in FIG. 1.

FIG. 3 is a cross-sectional depiction of a preferred embodiment taken along a perspective line that corresponds to line B-B of FIG. 1.

FIG. 4 is a cross-sectional view of a preferred embodiment taken along a perspective line that corresponds to line C-C of FIG. 1.

FIG. 5 is a depiction of a substrate employed in a preferred embodiment of the present invention.

FIG. 6 illustrates a substrate employed with an alternative embodiment of the present invention in which an area of the substrate is deformed to provide an indentation.

FIG. 7 depicts one side of a flex circuit employed in a preferred embodiment of the present invention.

FIG. 8 depicts another side of the flex circuit depicted in FIG. 7.

FIG. 9 is a view of a preferred embodiment before thermal spreaders devised in accordance with a preferred embodiment of the present invention are included in the module. A cutaway area D is provided to enhance illustration of certain features.

FIG. 10 is an enlarged depiction of the area identified with “D” in FIG. 9.

FIG. 11 is a cross-sectional depiction of the area near an end of a substrate as employed in a preferred embodiment of the present invention.

FIG. 12 is an exploded cross-sectional view of a flex circuit employed in a preferred embodiment of the present invention.

FIG. 13 is a cross-sectional view of another preferred embodiment devised in accordance with the invention.

FIG. 14 is an enlarged perspective view of the preferred embodiment of FIG. 13 devised in accordance with the present invention.

FIG. 15 is another cross-sectional view of another preferred embodiment devised in accordance with the invention.

FIG. 16 is an enlarged perspective view of the preferred embodiment of FIG. 15 devised in accordance with the present invention.

FIG. 17 is another cross-sectional view of another preferred embodiment devised in accordance with the invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

FIGS. 1 and 2 depict a module 10 devised in accordance with a preferred embodiment of the present invention. The depictions illustrate module 10 having substrate 14 about which is disposed flex circuit 12 populated with ICs 18 which are, in a preferred embodiment, integrated circuitry in CSP packages. Some alternative embodiments will have separate flex circuit on each side of substrate 14 . Substrate 14 is shown with an optional extension 16 T which, in this embodiment, is integral with the body 14 B of substrate 14 .

Optional extension 16 T may be devised in a variety of configurations and need not extend laterally from the main axis of substrate 14 in both directions. For example, extension 16 T may extend from substrate 14 in only one direction and need not project perpendicular from the body 14 B of substrate 14 .

Preferably, substrate 14 is comprised of thermally conductive material. Metallic materials are preferred choices. For example, aluminum like many other metallic materials, is thermally conductive and may be readily manipulated for configuration as substrate 14 . Materials such as FR4 may be employed, but if non-metallic materials are employed, other non-metallic materials that are thermally conductive are preferred over FR4. Carbon-based materials and certain plastics, for example, are known to readily conduct thermal energy and, as alternatives to metallic materials, such materials may be employed to advantage in preferred embodiments in accordance with the present invention where metallic materials are not available or wanted.

In the depicted embodiment, thermal spreaders 13 ₁ and 13 ₂ are thermally connected to ICs 18 and substrate 14 . Thermal spreaders 13 ₁ and 13 ₂ are comprised of thermally conductive material with higher conductivity metallic materials being preferred. Aluminum is a preferred choice for thermal spreaders in this embodiment due to its amenability to fabrication and relatively high thermal conductivity. Those of skill will recognize, however, that use of copper and copper alloys for thermal spreaders 13 ₁ and 13 ₂ will typically provide even greater thermal benefits although at typically a higher cost. Thermal spreaders 13 ₁ and 13 ₂ are preferably thermally connected to ICs 18 (or other ICs where accessible) with thermal adhesive.

ICs 18 are partially shown in FIG. 2 with portions of profiles that represent just some of the many profiles that may be exhibited by ICs 18 . ICs 18 on flexible circuit 12 are, in this preferred embodiment, CSP packaged memory devices of small scale. For purposes of this disclosure, the term chip-scale or “CSP” shall refer to integrated circuitry of any function with an array package providing connection to one or more die through contacts (often embodied as “bumps” or “balls” for example) distributed across a major surface of the package or die. CSP does not refer to leaded devices that provide connection to an integrated circuit within the package through leads emergent from at least one side of the periphery of the package such as, for example, a TSOP.

Embodiments of the present invention may be employed with leaded or CSP devices or other devices in both packaged and unpackaged forms but where the term CSP is used, the above definition for CSP should be adopted. Consequently, although CSP excludes leaded devices, references to CSP are to be broadly construed to include the large variety of array devices (and not to be limited to memory only) and whether die-sized or other size such as BGA and micro BGA as well as flip-chip. As those of skill will understand after appreciating this disclosure, some embodiments of the present invention may be devised to employ stacks of ICs each disposed where an IC 18 is indicated in the exemplar Figs.

Multiple integrated circuit die may be included in a package depicted as a single IC 18 . While in this embodiment memory ICs are used to provide a memory expansion board or module, various embodiments may include a variety of integrated circuits and other components and may be directed principally to functions other than or in addition to memory. Such variety may include processors—whether general purpose or function specific such as graphics, FPGA's, RF transceiver circuitry, and digital logic as a list of non-limiting examples, while primary module functions may include, as a non limiting list of examples, memory, graphics, communications, and computing to name just a few examples. Some modules in accordance with a preferred embodiment will exhibit plural CSPs of a first type, such as memory CSPs, for example, and will have at least one CSP of a second type, such as a microprocessor, graphics processor or buffer or, more particularly, an AMB, for example. Other modules will exhibit ICs of only a first type such as memory CSPs, for example, while other modules may exhibit many types of ICs such as, for example, memory ICs, logic ICs, and one or more buffer ICs.

FIG. 3 is a cross-sectional depiction of an exemplar module 10 taken along a line corresponding to B-B of FIG. 1. ICs 18 are shown as being thermally connected to thermal spreaders 13 ₁ and 13 ₂ . The thermal connection between thermal spreaders 13 ₁ and 13 ₂ and ICs 18 can be effectuated by direct contact or through an intermediate substance, particularly one that encourages thermal conduction. An example of such a substance is indicated in FIG. 3 with reference 30 representative of a thermal adhesive. Thermal adhesive is also preferred between ICs 18 and substrate 14 as shown. Optional flex support 14 FS supports flex circuit 12 in its transition from end 16 A of substrate 14 toward the ICs.

Those of skill will also note that FIG. 3 may be also representative of a cross-sectional view through an exemplar module 10 along a line corresponding to C-C of FIG. 1 as well as line B-B in those instances where module 10 consists primarily of ICs 18 along its entire length. For example, if no larger IC such as an AMB is employed, a typical memory module 10 comprising constituent CSP ICs 18 along its length may have a cross-sectional aspect that may be represented by the depiction of FIG. 3 when flex circuit 12 is populated on both sides while thermal spreaders 13 ₁ and 13 ₂ are disposed adjacent and thermally connected to ICs 18 B which are populated on side 8 of flex circuit 12 as further shown in FIG. 7. Reference to FIG. 7 illustrates that the ICs 18 B represented as being thermally connected to thermal spreaders 13 ₁ and 13 ₂ are disposed in two ranks separated by contacts 20 .

It should be recognized that optional substrate extension 16 T enables a thermal conduction path for thermal energy to flow from inner ICs 18 A (shown proximal to substrate 14 in FIG. 3) into thermal spreaders 13 ₁ and 13 ₂ through the thermal connection shown extant between substrate 14 and thermal spreaders 13 ₁ and 13 ₂ effectuated by substrate extension 16 T in thermal connection with thermal spreader extensions 13 ₁ A and 13 ₂ A, respectively.

FIG. 4 is a cross-sectional view of an exemplar module 10 that employs a larger IC 19 such as an AMB 19 with the view of FIG. 4 being taken along a line that corresponds to C-C of FIG. 1. FIG. 4 shows a substrate 14 with a window 250 through which an optional thermal sink 14 TS is accessible. Thermal sink 14 TS is comprised, in this preferred embodiment, from metallic material of high thermal conductivity such as, for example, copper or copper alloy and has, in this preferred embodiment, a central portion 14 TC that is a copper field substantially larger than and preferably in thermal contact with IC 19 which, in this preferred embodiment, is an AMB. AMB die 19 D is in contact with area 14 TC of thermal sink 14 TS either directly, or through thermally conductive adhesive or a thermally conductive gasket material, for example. Thermal contact with a part of circuit 19 should be considered thermal contact with circuit 19 .

In this preferred embodiment, central portion 14 TC of thermal sink 14 TS is raised above the periphery of thermal sink 14 TS and additionally provides an indentation into which may be introduced at least a portion of AMB circuit 19 such as, for example, AMB die 19 D, to assist in realization of a low profile for module 10 . Neither thermal sink 14 TS nor an indentation are required, however, to practice the invention. In the preferred depicted embodiment, thermal sink 14 TS is disposed over a window 250 through substrate 14 . AMB circuit 19 , which is mounted on the “inside” of flex circuit 12 , is disposed, at least in part, into window 250 from the “back” side of substrate 14 to realize thermal contact with thermal sink 14 TS to provide a conduit to reduce thermal energy loading of AMB circuit 19 .

Thermal sink 14 TS need not cover the entirety of window 250 . In other embodiments, for example, thermal sink 14 TS may merely be across the window 250 or thermal sink 14 TS may be set into window 250 instead of over or across the opening of window 250 . Thermal sink 14 TS is typically a separate piece of metal from substrate 14 but, after appreciating this specification, those of skill will recognize that, in alternative instances, thermal sink 14 TS may be integral with substrate 14 or a particular portion of substrate 14 may be constructed to be a thermal sink 14 TS in accordance with the teachings herein. For example, substrate 14 may be comprised of aluminum, while a thermal sink area 14 TS of substrate 14 may be comprised of copper yet substrate 14 and thermal sink 14 TS are of a single piece. In a variation of the integral thermal sink-substrate embodiment, the thermal sink could be attached to the substrate without a window and thus be preferentially accessible only on one side of substrate 14 . Construction expense will be more likely to militate against such construction but the principles of the invention encompass such constructions. Consequently, a window in substrate 14 is not required to practice some embodiments of the invention. Therefore, a thermal sink 14 TS should be considered to be an area or element integral with or attached to a substrate 14 and the material from which that thermal sink is composed exhibits greater thermal conductivity than the material of the substrate. To continue the example, substrate 14 may be aluminum while thermal sink 14 TS is comprised of copper.

Substrate 14 has first and second lateral sides identified as S ₁ and S ₂ . Flex 12 is wrapped about perimeter edge 16 A of substrate 14 . Some alternative embodiments may employ individual flex circuits on each side of substrate 14 . As will be further shown, AMB circuit 19 is mounted on inner side 9 of flex circuit 12 . When flex circuit 12 is disposed about substrate 14 , AMB circuit 19 is introduced, at least in part, into window 250 with AMB die 19 D being disposed, preferably, in thermal contact with thermal sink 14 TS of substrate 14 . That thermal contact is preferably through thermally conductive adhesive 30 but, in an alternative embodiment, another preferred construction may place AMB die 19 D in direct physical contact with thermal sink 14 TS to realize the thermal contact or connection between AMB circuit 19 and thermal sink 14 TS. Other thermal conduction enhancing materials may also be used in place of, or addition to thermal adhesive 30 such as for example, thermal grease or a thermal gasket.

In FIGS. 3 and 4, thermal spreaders 13 ₁ and 13 ₂ exhibit optional thermal spreader extensions 13 ₁ A and 13 ₂ A which, as previously described, provide a thermal conduction path for thermal energy from the inner ICs 18 A. They also, as shown, in cooperation with extension 16 T, form a thermally conductive enclosure 11 over module 10 . Thermal spreader extensions are not required as a part of thermal spreaders 13 ₁ and 13 ₂ , but where employed as those of skill will recognize, they may provide thermal or structural advantages.

In FIG. 5 a depicted substrate 14 is shown as having an integral thermal sink 14 TS. The different materials used for the thermal sink 14 TS as opposed to the substrate in general which result in the different thermal conductivity characteristics between substrate 14 and thermal sink 14 TS are represented by the different hatching of the FIG. 5. For example, thermal sink 14 TS in this depiction may be copper, for example, while the main body of substrate 14 may be comprised of aluminum, to name just one example. Another example could be a plastic bodied substrate 14 and a copper based thermal sink 14 TS. Flex support 14 FS is also shown in FIG. 5 and is typically comprised of the same material as substrate 14 .

Despite the advantages of using a thermal sink with module 10 , for cost reasons, amongst other rationales, some may wish to construct modules with low profiles lacking the conductivity differential of that feature. In that case, FIG. 6 illustrates a substrate employed with another alternative embodiment of the present invention in which an area of the substrate is deformed to provide an indentation but no thermal sink 14 TS is employed. Thus, embodiments that employ substrates such as that depicted in FIG. 6 will not have a thermal sink, but may rely on thermal connection or contact between substrate 14 and IC 19 to dissipate heat generated by IC 19 where IC 19 has been mounted on inner side 9 of flex circuit 12 as shown later. As those of skill will note, indentation 14 IN is not required but provides low profile advantages.

Consequently, an exemplar embodiment that employed a substrate such as that shown in FIG. 6 and does not exhibit a thermal sink 14 TS would look very much like the embodiment shown in FIG. 4 except that the structure labeled 14 TS would not be separate from substrate 14 and would be a part of substrate 14 and composed from the same material. Further, no window 250 would be present since no opening in substrate 14 would be needed. IC 19 would preferably be in thermal contact with substrate 14 .

Where a window 250 in substrate 250 is employed, at least a part of thermal sink 14 TS should be accessible through window 250 from the “other” side of substrate 14 . AMB circuit 19 or other high heat IC 19 and, in particular, AMB die 19 D, may be disposed in or across or over window 250 and preferably, will be introduced into an indentation of thermal sink 14 TS and disposed in thermal contact with thermal sink 14 TS and, more preferably, with the central core 14 TC of thermal sink 14 TS (where a central core has been optionally included in thermal sink 14 TS) either with direct contact or through thermal adhesives or glues. Other embodiments may include additional windows where other high heat circuits are employed on module 10 . Still other embodiments may insert some or all of ICs 18 into cutout areas in substrate 14 as described in detail in U.S. patent application Ser. No. 11/005,992 which has been incorporated by reference herein.

In a preferred embodiment, thermal sink 14 TS covers window 250 on one side of substrate 14 while AMB circuit 19 is disposed, at least in part, into window 250 to realize contact between thermal sink 14 TS and AMB circuit 19 and particularly AMB die 19 D either directly or as mediated through a thermally-conductive adhesive or glue.

FIG. 7 depicts a first side 8 of flex circuit 12 (“flex”, “flex circuitry”, “flexible circuit”) used in constructing a module according to an embodiment of the present invention. Flex circuit 12 is preferably made from one or more conductive layers supported by one or more flexible substrate layers as further described with reference to later FIG. 12. The construction of flex circuitry is known in the art. The entirety of the flex circuit 12 may be flexible or, as those of skill in the art will recognize, the flexible circuit structure 12 may be made flexible in certain areas to allow conformability to required shapes or bends, and rigid in other areas to provide rigid and planar mounting surfaces. Preferred flex circuit 12 has openings 17 for use in aligning flex circuit 12 to substrate 14 during assembly.

The depiction of FIG. 7 shows flex circuit 12 as having first and second fields or ranks of ICs 18 with contacts 20 being disposed between said ranks or fields of ICs 18 . After flex circuit is assembled with substrate 14 , those of skill will recognize that contacts 20 may appear on one or both sides of module 10 depending on the mechanical contact interface particulars of the application. Other embodiments may employ flex circuitry that exhibits contacts closer to an edge of the flex circuit.

Flex circuit 12 may also referenced by its perimeter edges, two of which are typically long (PE _long1 and PE _{long 2} ) and two of which are typically shorter (PE _short1 and PE _short2 ) although flex circuit 12 may come in a variety of shapes including square. Contact arrays such as array 11 A are disposed beneath ICs 18 and IC 19 , where employed, and are comprised of array contacts 11 C. An exemplar contact array 11 A is shown as is exemplar IC 18 to be mounted at contact array 11 A as depicted.

A first rank, group or plurality of ICs 18 is shown on side 8 of flex circuit 12 and is identified as IC _R1 and a second rank, group or plurality of CSPs on side 8 is identified as IC _R2 . Those of skill will recognize that the identified pluralities of CSPs are, when disposed in the configurations depicted, typically described as “ranks”. Between the ranks IC _R2 and IC _R2 , flex circuit 12 bears a plurality of module contacts allocated in this embodiment into two rows (C _R1 and C _R2 ) of module contacts 20 . When flex circuit 12 is folded about substrate 14 as earlier depicted, side 9 which is depicted in later FIG. 8, is closer to the substrate 14 about which flex circuit 12 is disposed than is side 8 and thus, ICs 18 A which are identified in the cross-sectional view of FIG. 3, for example, are populated along the inner side 9 of flex circuit 12 while those ICs 18 B identified in FIG. 3 are populated along the outer side 8 of flex circuit 12 . Other embodiments may have other numbers of ranks and combinations of plural CSPs connected to create the module of the present invention.

FIG. 7 depicts an exemplar conductive trace 21 connecting row C _R2 of module contacts 20 to ICs 18 . Those of skill will understand that there are many such traces in a typical embodiment. Traces 21 may also connect to vias that may transit to other conductive layers of flex 12 in certain embodiments having more than one conductive layer. In a preferred embodiment, vias connect ICs 18 on side 9 of flex 12 to module contacts 20 . An example via is shown as reference 23 . Traces 21 may make other connections between the ICs on either side of flex 12 and may traverse the rows of module contacts 20 to interconnect ICs. Together the various traces and vias make interconnections needed to convey data and control signals amongst the various ICs and buffer circuits. Those of skill will understand that the present invention may be implemented with only a single row of module contacts 20 and may, in other embodiments, be implemented as a module bearing ICs on only one side of flex circuit 12 .

FIG. 8 shows side 9 of flex circuit 12 depicting the other side of the flex circuit shown in FIG. 7 as may be employed in a preferred embodiment. Side 9 of flex circuit 12 is shown as being populated with multiple CSPs 18 and AMB circuit 19 . Side 9 includes fields F 1 and F 2 that each include at least one mounting contact array site for CSPs and, in the depicted case, include multiple contact arrays. Each of fields F 1 and F 2 include, in the depicted preferred embodiment, two pluralities of ICs in this embodiment. Other embodiments may have other arrangements and constituent ICs and, in some cases, may have ICs on only one side of flex circuit 12 . Other embodiments may also have fewer or greater numbers of ranks or pluralities of ICs in each field or on a side of a flex circuit.

FIG. 9 is a view of a preferred embodiment before thermal spreaders devised in accordance with a preferred embodiment of the present invention are appended about the module. A cutaway area D is provided to enhance illustration of certain features.

Flex circuit 12 is cutaway in area “D” to illustrate internal preferred features of module 10 . Area “D” is shown in greater enlargement in later FIG. 10. Within area D are seen thermal sink 14 TS and beyond the cutaway section of thermal sink 14 TS, there is shown a part of a circuit 19 which, in the depicted preferred embodiment, is an AMB employed in FB-DIMM circuitry. AMB circuit 19 includes AMB die 19 D and contacts 19 C.

FIG. 10 is an enlarged depiction of the area D identified in FIG. 9 of an exemplar module 10 depicting in partial cutaway, details concerning the relationship between a high heat IC 19 such as an AMB 19 and substrate 14 in a preferred embodiment. This view provides insight that would otherwise be blocked from view if thermal spreaders 13 ₁ and 13 ₂ were included in the depiction. AMB circuit 19 is shown through window 250 through substrate 14 . Preferably, AMB circuit 19 is mounted on what will become the internal side 9 of flex circuit 12 relative to module 10 and is, therefore, inserted into window 250 from the “rear” relative to the perspective shown in FIG. 10. Those of skill will recognize, particularly with reference to FIG. 10, that a portion of flex circuit 12 has been removed to expose thermal sink 14 TS and a part of 14 TS has also been cutaway.

FIG. 11 depicts an enlarged view of the area near end or edge 16 A of an exemplar module 10 . While a rounded configuration is shown, edge 16 A may take on other shapes devised to mate with various connectors or sockets. The form and function of various edge card connectors are well know in the art. In many preferred embodiments, flex 12 is wrapped around edge 16 A of substrate 14 and may be laminated or adhesively connected to substrate 14 with adhesive 30 . The depicted adhesive 30 and flex 12 may vary in thickness and are not drawn to scale to simplify the drawing. The depicted substrate 14 has a thickness such that when assembled with the flex 12 and adhesive 30 , the thickness measured between module contacts 20 falls in the range specified for the mating connector. In some other embodiments, flex circuit 12 may be implemented with two flex circuits 12 A and 12 B instead of one wrapped about end 16 A. For example, a flex circuit 12 A may be disposed on one side of module 10 while another flex circuit 12 B may be disposed on another side of module 10 . Adhesive 30 is employed to attached flex circuit 12 to substrate 14 and contacts 20 are disposed on each side of module 10 . In other embodiments, contacts 20 need not be on both sides of module 10 and may be exhibited on only one side in configurations.

FIG. 12 is an exploded depiction of a flex circuit 12 cross-section according to one preferred embodiment of the present invention. The depicted flex circuit 12 has four conductive layers 1201 - 1204 and seven insulative layers 1205 - 1211 . The numbers of layers described are merely those used in one preferred embodiment and other numbers of layers and arrangements of layers may be employed. Even a single conductive layer flex circuit 12 may be employed in some embodiments, but flex circuits with more than one conductive layer prove to be more adaptable to more complex embodiments of the invention.

Top conductive layer 1201 and the other conductive layers are preferably made of a conductive metal such as, for example, copper or alloy 110 . In this arrangement, conductive layers 1201 , 1202 , and 1204 express signal traces 1212 that make various connections by use of flex circuit 12 . These layers may also express conductive planes for ground, power or reference voltages.

In this embodiment, inner conductive layer 1202 expresses traces connecting to and among various ICs. The function of any one of the depicted conductive layers may be interchanged in function with others of the conductive layers. Inner conductive layer 1203 expresses a ground plane, which may be split to provide VDD return for pre-register address signals. Inner conductive layer 1203 may further express other planes and traces. In this embodiment, floods or planes at bottom conductive layer 1204 provides VREF and ground in addition to the depicted traces.

Insulative layers 1205 and 1211 are, in this embodiment, dielectric solder mask layers which may be deposited on the adjacent conductive layers for example. Other embodiments may not have such adhesive dielectric layers. Insulating layers 1206 , 1208 , and 1210 are preferably flexible dielectric substrate layers made of polyimide. However, any suitable flexible circuitry may be employed in the present invention and the depiction of FIG. 12 should be understood to be merely exemplary of one of the more complex flexible circuit structures that may be employed as flex circuit 12 .

FIG. 13 depicts another preferred embodiment in accordance with the present invention. The depicted module 10 includes thermal spreaders 13 ₁ and 13 ₂ configured with plural extensions 13 E which reside above substrate extension 16 T and project inwardly. As those of skill will recognize, plural spreader extensions will encourage thermal shedding from the module. FIG. 14 provides a perspective view of a module 10 shown in cross-section in prior FIG. 13.

FIG. 15 depicts another preferred embodiment in accordance with the present invention. The module 10 depicted in FIG. 15 exhibits plural spreader extensions above substrate extension 16 T but unlike the plural spreader extensions depicted in FIG. 13, the spreader extensions 13 E exhibited by the module 10 depicted in FIG. 15 project outwardly. FIG. 16 depicts a perspective view of a module 10 with plural thermal spreader extensions that project outwardly above substrate extension 16 T.

FIG. 17 depicts an exemplar module 10 that exhibits multiple radiative projects from thermal spreaders 13 ₁ and 13 ₂ to provide even more surface area for thermal shedding from module 10 .

One advantageous methodology for efficiently assembling an embodiment of a module 10 depicted herein is as follows. In a preferred method of assembling a preferred module assembly 10 , flex circuit 12 is placed flat and both sides populated according to circuit board assemb