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7372092 |
Memory cell, device, and system
A memory cell, device, and system include a memory cell having a shared digitline, a storage capacitor, and a plurality of access transistors configured to selectively electrically couple the...
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7372091 |
Selective epitaxy vertical integrated circuit components
Integrated circuit components are described that are formed using selective epitaxy such that the integrated circuit components, such as transistors, are vertically oriented. These structures have...
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7371697 |
Ion-assisted oxidation methods and the resulting structures
Oxidation methods and resulting structures including providing an oxide layer on a substrate and then re-oxidizing the oxide layer by vertical ion bombardment of the oxide layer in an atmosphere...
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7371676 |
Method for fabricating semiconductor components with through wire interconnects
A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also...
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7371647 |
Methods of forming transistors
The invention encompasses a method of forming a structure over a semiconductor substrate. A silicon dioxide containing layer is formed across at least some of the substrate. Nitrogen is formed...
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7371642 |
Multi-state NROM device
An array of NROM flash memory cells configured to store at least two bits per four F 2 . Split vertical channels are generated along each side of adjacent pillars. A single control gate is formed...
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7371627 |
Memory array with ultra-thin etched pillar surround gate access transistors and buried data/bit lines
A memory array with data/bit lines extending generally in a first direction formed in an upper surface of a substrate and access transistors extending generally upward and aligned generally atop a...
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7371612 |
Method of fabrication of stacked semiconductor devices
A method for increasing integrated circuit density is disclosed comprising stacking an upper wafer and a lower wafer, each of which having fabricated circuitry in specific areas on their respective...
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7371608 |
Method of fabricating a stacked die having a recess in a die BGA package
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
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7371587 |
Method for reducing diffusion through ferromagnetic materials
A method and apparatus are disclosed for inhibiting diffusion of mobile atoms from an antiferromagnetic layer toward a tunnel oxide layer and through a ferromagnetic layer which is pinned by the...
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7371509 |
Resist pattern and reflow technology
A reflow stabilizing solution for treating photoresist patterns and a reflow technology are disclosed. The reflow stabilizing solution comprises a polymer and is applied after the photoresist...
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7371333 |
Methods of etching nickel silicide and cobalt silicide and methods of forming conductive lines
The invention includes methods of etching nickel silicide and cobalt silicide, and methods of forming conductive lines. In one implementation, a substrate comprising nickel silicide is exposed to a...
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7371263 |
Plasmaless dry contact cleaning method using interhalogen compounds
A method of removing an oxide layer from an article. The article may be located in a reaction chamber into which an interhalogen compound reactive with the oxide layer is introduced. A temperature...
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7370659 |
Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines
Stepper and/or scanner machines including cleaning devices and methods for cleaning stepper and/or scanner machines are disclosed herein. In one embodiment, a stepper and/or scanner machine...
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7370306 |
Method and apparatus for designing a pattern on a semiconductor surface
A method of forming a pattern of elements is shown. In one embodiment, the method is used to create a reticle. In another embodiment, the method is used to further form a number of elements on a...
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7370226 |
System and method for communicating a software-generated pulse waveform between two servers in a network
A method of monitoring a status condition of a first server with a second server in a server network, and also providing synchronization and messaging between the two servers, the method including:...
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7370225 |
System and method for communicating a software-generated pulse waveform between two servers in a network
A method of monitoring a status condition of a first server with a second server in a server network, and also providing synchronization and messaging between the two servers, the method including:...
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7370150 |
System and method for managing a cache memory
A processing system optimized for data string manipulations includes data string execution circuitry associated with a bus interface unit or memory controller. Cache coherency is maintained, and...
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7370134 |
System and method for memory hub-based expansion bus
A system memory includes a memory hub controller, a memory module accessible by the memory hub controller, and an expansion module having a processor circuit coupled to the memory module and also...
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7370122 |
Distributed configuration storage
Systems and methods for providing distributed configuration storage are presented. The configuration storage is divided into distributed configuration target modules that are physically located in...
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7369623 |
Apparatuses to simultaneously distribute clock signals and data on integrated circuits, interposers, and circuit boards
A technique is described for simultaneously and synchronously transmitting digital data and a clock signal in a digital integrated circuit, circuit board, or system. The technique is based on the...
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7369447 |
Random cache read
A non-volatile memory is described that utilizes a cache read mode of operation, where a next page of memory is being read/sensed from the memory array by the sense amplifiers while a previously...
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7369436 |
Vertical NAND flash memory device
Memory devices, arrays, and strings are included that facilitate the use of vertical floating gate memory cells in NAND architecture memory strings, arrays, and devices. NAND Flash memory strings,...
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7369435 |
Write once read only memory employing floating gates
Structures and methods for write once read only memory employing floating gates are provided. The write once read only memory cell includes a floating gate transistor formed in a modified dynamic...
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7369434 |
Flash memory with multi-bit read
A memory device is described that uses extra data bits stored in a multi-level cell (MLC) to provide error information. An example embodiment provides a memory cell that uses more than 2 X logic...
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7369379 |
Methods, circuits, and applications using a resistor and a Schottky diode
A combination of a current limiting resistor and a clamping Schottky diode prevent substantial forward biasing of a pn junction associated with a pad in a snapback device during normal operation,...
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7369168 |
Circuit for an active pixel sensor
A pixel circuit includes a silicon substrate having a photodiode that converts light intensity into a voltage signal and two metal layers disposed on the substrate having a pixel control circuit....
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7369167 |
Photo diode ID for CMOS imagers
A CMOS image pixel array formed on a chip is used for storing programmed information within the pixel array. Manufacturing lot and other data is written to the array during manufacturing and...
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7369138 |
Full-scene anti-aliasing method and system
A method and system for performing full-scene anti-aliasing for an image through a technique of rotating and unrotating rasterization of a scene and rendering a resulting image. A scene is...
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7369072 |
Method and apparatus for calibrating imaging device circuits
A method of operating an imaging device, an imaging device, a camera system including an imaging device, and a processing system including an imaging device for calibrating an analog-to-digital...
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7368965 |
Clock capture in clock synchronization circuitry
Clock capturing synchronization circuitry first generates a synchronized clock signal from a reference clock signal, then captures the synchronized clock signal, and continues to output a...
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7368812 |
Interposers for chip-scale packages and intermediates thereof
A carrier substrate, or interposer, for use in a chip-scale package includes a material, such as a semiconductive material, that has a coefficient of thermal expansion that is the same or similar...
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7368810 |
Invertible microfeature device packages
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
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7368800 |
Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry
The invention includes methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating integrated circuitry including memory circuitry, and integrated...
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7368796 |
Metal gate engineering for surface P-channel devices
A semiconductor device, such as a CMOS device, having gates with a high work function in PMOS regions and low work functions in NMOS regions and a method of producing the same. Using nitrogen...
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7368790 |
Strained Si/SiGe/SOI islands and processes of making same
A process of making a strained silicon-on-insulator structure is disclosed. A recess is formed in a substrate to laterally isolate an active area. An undercutting etch forms a bubble recess under...
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7368701 |
Optical channels for multi-level metal optical imagers and method for manufacturing same
The manufacture of multi-level optical imagers and the resulting imagers are described. Multiple levels of metallization are prepared, each level having a via. The vias are aligned and a material...
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7368698 |
Imaging device with reduced row readout time and method of operating the same
An imager in which a column line bias current control signal is pulsed at some time during and/or after the pulsing of the reset control and the transfer control signals to increase a bias current...
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7368696 |
Generation and storage of column offsets for a column parallel image sensor
The plural signal chains of an imaging device are calibrated in the digital domain. The pixel array of the imaging device includes a row of calibration pixels. The column circuitry, prior to...
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7368678 |
Method for sorting integrated circuit devices
A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including automatically reading the ID code of each of...
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7368416 |
Methods of removing metal-containing materials
Various methods for selectively etching metal-containing materials (such as, for example, metal nitrides, which can include, for example, titanium nitride) relative to one or more of silicon,...
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7368402 |
Systems and methods for forming tantalum oxide layers and tantalum precursor compounds
A method of forming (and apparatus for forming) a tantalum oxide layer on a substrate, particularly a semiconductor substrate or substrate assembly, using a vapor deposition process and a tantalum...
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7368399 |
Methods of forming patterned photoresist layers over semiconductor substrates
This invention includes methods of forming patterned photoresist layers over semiconductor substrates. In one implementation, a porous antireflective coating is formed over a semiconductor...
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7368391 |
Methods for designing carrier substrates with raised terminals
A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent...
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7368389 |
Methods of forming electrically conductive plugs
A method of forming an electrically conductive plug includes providing an opening within electrically insulative material over a node location on a substrate. An electrically conductive material is...
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7368382 |
Atomic layer deposition methods
The invention includes an atomic layer deposition method of forming a layer of a deposited composition on a substrate. The method includes positioning a semiconductor substrate within an atomic...
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7368381 |
Methods of forming materials
The invention includes methods of forming films over substrates. A substrate is provided within a reaction chamber, and a mixture is also provided within the chamber. The mixture includes a...
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7368378 |
Methods for making integrated-circuit wiring from copper, silver, gold, and other metals
Integrated circuits, the key components in thousands of electronic and computer products, include interconnected networks of electrical components. The components are typically wired, or...
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7368374 |
Super high density module with integrated wafer level packages
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
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7368372 |
Methods of fabricating multiple sets of field effect transistors
The invention includes methods of fabricating multiple sets of field effect transistors. In one implementation, an etch stop layer is formed over an insulative capping layer which is formed over a...
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