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7420154 Pixel circuit with non-destructive readout circuit and methods of operation thereof  
A pixel cell allows both correlated double sampling (CDS) and automatic light control (ALC) operations through a non-destructive, parallel readout. An image sensor may include an array of pixel...
7419913 Methods of forming openings into dielectric material  
This invention includes methods of forming openings into dielectric material. In one implementation, an opening is partially etched through dielectric material, with such opening comprising a...
7419895 NAND memory arrays  
Methods and apparatus are provided. A source slot and a drain contact region are formed at opposite ends of a NAND string disposed on a substrate of a NAND memory array using a single mask. The...
7419871 Methods of forming semiconductor constructions  
The invention includes a method in which a semiconductor substrate is provided to have a memory array region, and a peripheral region outward of the memory array region. Paired transistors are...
7419865 Methods of forming memory circuitry  
The invention includes methods of forming memory circuitry. In one implementation, a semiconductor substrate includes a pair of word lines having a bit node received therebetween. A bit node...
7419854 Methods for packaging image sensitive electronic devices  
The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the...
7419852 Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies  
Low temperature processed back side redistribution lines (RDLs) are disclosed. Low temperature processed back side RDLs may be electrically connected to the active surface devices of a...
7419841 Microelectronic imagers and methods of packaging microelectronic imagers  
Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor,...
7419768 Methods of fabricating integrated circuitry  
The invention includes methods of fabricating integrated circuitry and semiconductor processing polymer residue removing solutions. In one implementation, a method of fabricating integrated...
7419299 Methods of sensing temperature of an electronic device workpiece  
The present invention includes electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece. In one aspect, the invention...
7418526 Memory hub and method for providing memory sequencing hints  
A memory module includes a memory hub coupled to several memory devices. The memory hub is also coupled to receive a memory packet from a system controller containing a memory hint indicative of...
7418161 Photonic crystal-based optical elements for integrated circuits and methods therefor  
Exemplary embodiments of the invention provide photonic crystal-based optical elements for integrated circuits. A photonic crystal optical device comprises a substrate and a plurality of pillars...
7418071 Method and apparatus for generating a phase dependent control signal  
A phase detector generates a phase dependent control signal according to the phase relationship between a first and second clock signal. The phase detector includes first and second phase detector...
7417916 Methods of reducing coupling noise between wordlines  
Memory devices configured to reduce coupling noise between adjacent wordlines in a memory array. More specifically, wordline drivers are interleaved such that adjacent wordlines are driven by...
7417901 Memory device having terminals for transferring multiple types of data  
A memory device includes a number of terminals for transferring input data and output data to and from a memory array. The memory device includes an auxiliary circuit for receiving input auxiliary...
7417894 Single latch data circuit in a multiple level cell non-volatile memory device  
A single latch circuit is coupled to each bit line in a multiple level cell memory device to handle reading multiple data bits. The circuit is comprised of a latch having an inverted node and a...
7417893 Integrated DRAM-NVRAM multi-level memory  
An integrated DRAM-NVRAM, multi-level memory cell is comprised of a vertical DRAM device with a shared vertical gate floating plate device. The floating plate device provides enhanced charge...
7417677 Lag cancellation in CMOS image sensors  
A pixel cell with improved lag characteristics without increased noise. The pixel cell according to embodiments of the invention includes a photo-conversion device and a floating diffusion region...
7417674 Multi-magnification color image sensor  
A color image sensor has imaging elements each structured to form, at an image plane, an image of a subject having a respective magnification. Ones of the imaging elements forming respective ones...
7417505 CMOS amplifiers with frequency compensating capacitors  
The frequency and transient responses of a CMOS differential amplifier are improved by employing one or more compensating capacitors. A compensating capacitor coupled to a differential input of the...
7417478 Delay line circuit  
Methods, circuits, devices, and systems are provided, including a delay line for a delay-locked loop. One method includes providing a reference clock to a first delay unit in a delay line. The...
7417325 Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts  
A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit...
7417305 Electronic devices at the wafer level having front side and edge protection material and systems including the devices  
Methods for applying a dielectric protective layer to a wafer in wafer-level chip scale package manufacture are disclosed. A flowable dielectric protective material with fluxing capability is...
7417294 Microelectronic imaging units and methods of manufacturing microelectronic imaging units  
Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies...
7417280 Method and apparatus for a flash memory device comprising a source local interconnect  
A method for forming a flash memory device having a local interconnect connecting source regions of a plurality of transistors within a sector allows for a highly selective wet etch of a dielectric...
7417272 Image sensor with improved dynamic range and method of formation  
Embodiments of the invention provide an image sensor having an improved dynamic range. A pixel cell comprises at least one transistor structure. The transistor structure comprises at least one...
7416994 Atomic layer deposition systems and methods including metal beta-diketiminate compounds  
The present invention provides atomic layer deposition systems and methods that include metal compounds with at least one β-diketiminate ligand. Such systems and methods can be useful for...
7416958 Epitaxial semiconductor layer and method  
A method for epitaxially forming a first semiconductor structure attached to a second semiconductor structure is provided. Devices and methods described include advantages such as reduced lattice...
7416943 Peripheral gate stacks and recessed array gates  
Methods are provided for simultaneously processing transistors in two different regions of an integrated circuit. Planar transistors are provided in a logic region while recessed access devices...
7416933 Methods of enabling polysilicon gate electrodes for high-k gate dielectrics  
Complementary transistors and methods of forming the complementary transistors on a semiconductor assembly are described. The transistors are formed with an optional interfacial oxide, such as SiO...
7416913 Methods of manufacturing microelectronic imaging units with discrete standoffs  
Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies...
7416472 Systems for planarizing workpieces, e.g., microelectronic workpieces  
This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is...
7416107 Concave face wire bond capillary and method  
An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a...
7415567 Memory hub bypass circuit and method  
A computer system and a method used to access data from a plurality of memory devices with a memory hub. The computer system includes a plurality of memory modules coupled to a memory hub...
7415404 Method and apparatus for generating a sequence of clock signals  
A clock generator circuit generates a sequence of clock signals equally phased from each other from a master clock signal. The clock generator is formed by inner and outer delay-locked loops. The...
7415317 Method and system for correlating and combining production and non-production data for analysis  
This document discusses, among other things, a method and system for correlating and combining production and non-production data for analysis for the purposes of increasing manufacturing...
7414895 NAND flash memory cell programming  
A flash memory device, such as a NAND flash, having an array of floating gate transistor memory cells arranged in a first and second addressable blocks. A voltage source to supply programming...
7414662 Multifunction lens  
An image capture apparatus having a multifunction lens and a method for capturing an image are disclosed. The multifunction lens has an imaging lens portion adapted to focus a scene onto an image...
7414661 CMOS image sensor using gradient index chip scale lenses  
A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the...
7414653 Dark reduction via feedback control of photodiode bias  
An active pixel sensor comprises a photodiode providing a photodiode output current indicative of an intensity of light incident the photodiode and an integrator circuit electrically coupled to the...
7414444 Clock capture in clock synchronization circuitry  
Clock capturing synchronization circuitry first generates a synchronized clock signal from a reference clock signal, then captures the synchronized clock signal, and continues to output a...
7414299 Semiconductor package assembly and method for electrically isolating modules  
A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for...
7414297 Capacitor constructions  
The invention includes methods of forming rugged electrically conductive surfaces. In one method, a layer is formed across a substrate and subsequently at least partially dissociated to form gaps...
7414260 Vertical tunneling transistor  
The disclosed embodiments relate to a vertical tunneling transistor that may include a channel disposed on a substrate. A quantum dot may be disposed so that an axis through the channel and the...
7413981 Pitch doubled circuit layout  
In one embodiment of the present invention, a method for connecting a plurality of bit lines to sense circuitry includes providing a plurality of bit lines extending from a memory array in a first...
7413979 Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices  
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and dies are disclosed herein. In one...
7413962 Method for forming sublithographic features during the manufacture of a semiconductor device and a resulting in-process apparatus  
A method for forming a semiconductor device comprises forming a layer to be etched, then forming a hard mask layer over the layer to be etched. The hard mask is etched to form an opening defined by...
7413952 Methods of forming a plurality of circuit components and methods of forming a plurality of structures suspended elevationally above a substrate  
A plurality of capacitor electrode openings is formed within capacitor electrode-forming material. A first set of the openings is formed to a depth which is greater within the capacitor...
7413948 Semiconductor capacitor structure and method to form same  
A semiconductor capacitor structure comprising sidewalls of conductive hemispherical grained material, a base of metal silicide material, and a metal nitride material overlying the conductive...
7413946 Formation of standard voltage threshold and low voltage threshold MOSFET devices  
Wells are formed in a substrate where standard Vt and low Vt devices of both a first and second type are to be fabricated. Wells defining the locations of first type standard Vt devices are masked,...
Matches 301 - 350 out of 17621 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >