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7415761 Method of manufacturing multilayered circuit board  
An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the...
7407596 Fluxgate sensor integrated in printed circuit board and method for manufacturing the same  
A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit...
7235148 Selectively roughening conductors for high frequency printed wiring boards  
A printed wiring board is formed from two or more layers, one of which has circuit lines formed thereon, and wherein the surfaces of the circuit lines are roughened only in areas that require good...
7128844 Metal/ceramic circuit board and method for producing same  
A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10 , and a resist 14 having a predetermined shape is formed on the metal layer 12 ....
6908561 Polymide-to-substrate adhesion promotion in HDI  
Methods for adhering polyimide dielectric materials to copper-, titanium-, aluminum-, or copper-and-titanium-containing portions of a substrate are described. The methods include the steps of...
6884659 Thin interface layer to improve copper etch stop  
In accordance with the objectives of the invention a new method is provided for improving adhesion strength that is deposited over the surface of a layer of copper. Conventional etch stop layers of...
6743369 Method for manufacturing electrode for secondary battery  
A method of manufacturing an electrode for a secondary battery by depositing a thin film composed of active material on a current collector in which a surface-treated layer such as an...
6668445 Method of increasing tab bond strength using reactive ion etching  
A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of...
6656368 Nonstick layer for a micromechanical component  
A method for manufacturing micromechanical components, and a micromechanical component, in which a movable element is produced on a sacrificial layer. In a subsequent step the sacrificial layer...
6616854 Method of bonding and transferring a material to form a semiconductor device  
A donor substrate ( 12 ) which is patterned to include a donor mesa ( 18 ) is bonded to a receiving substrate ( 20 ). In a one embodiment, a bulk portion of the donor substrate is removed while...
6602431 Enhancements in sheet processing and lead formation  
A connection component for making microelectronic assemblies includes a dielectric structural layer having a first surface and a plurality of conductive leads having first and second ends overlying...
6562252 Method for reproducing images or text on a metalized holographic 2D, 3D bright colored film  
The invention relates to a method for reproducing images or text on a metalized holographic film, comprising a coupling step, in which a bottom metalized holographic film is laminated to a second...
6500349 Manufacture of printed circuits using single layer processing techniques  
A continuous process for forming multilayer circuit structures which includes applying and curing a film forming polymer onto the matte side of a copper foil. The opposite (shiny) side of the foil...
6495053 Electrical circuit board and a method for making the same  
A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 , and which includes grooves or troughs 20, 22 which are effective to selectively entrap...
6475629 Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device  
Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified...
6454953 Solid electrolytic capacitor and method for producing the same  
An object of the present invention is to provide a solid electrolytic capacitor with excellent electrostatic capacitance and reduced dispersion of capabilities by treating the surface of a...
6419784 Process for improving the adhesion of polymeric materials to metal surfaces  
A process is described which is useful in treating metal surfaces to increase the adhesion of polymeric materials thereto. The process involves treating the metal surface with a pre-dip which...
6264851 Selective seed and plate using permanent resist  
The present invention is for a method wherein a printed circuit board can be fabricated in an electroless process with a minimum number of manufacturing steps using mild etchant conditions on an...
6136412 Microtextured catalyst transfer substrate  
A membrane electrode assembly is provided comprising an ion conducting membrane and one or more electrode layers that comprise nanostructured elements, wherein the nanostructured elements are in...
6117794 Method for improved metal oxide bonding of optical elements  
A method of preparing a supporting substrate of an optical subassembly for metal-oxide bonding an optical element to the substrate. The method includes providing a supporting substrate including a...
5800724 Patterned metal foil laminate and method for making same  
A method for making a patterned metal foil/substrate laminate by laminating a sheet of metal foil to a substrate by applying an adhesive between the metal foil and substrate and irradiating the...
5759422 Patterned metal foil laminate and method for making same  
A patterned metal foil/substrate laminate wherein the pattern is formed by laminating a sheet of metal foil to a substrate by applying an adhesive between the metal foil and substrate in a...
5759420 Production of partially metallised grating structures  
A process for producing a partially transparent, visually discernible surface pattern with surface elements which diffusely scatter, reflect or diffract light incident on the surface pattern...
5738797 Three-dimensional multi-layer circuit structure and method for forming the same  
A three dimensional multi-layer circuit structure is formed by partially etching a foil having a coating. A pre-circuit is formed by providing a metal foil, applying a photodefinable photoresist to...
5714079 Method for making a thin gauge metallic article with electrical insulation on one side  
A metallic sheet (10) is laminated between a pair of photoresist layers (26, 30) having different properties which permit one photoresist (26) to be stripped from the metallic sheet, substantially...
5705082 Roughening of metal surfaces  
A process for roughening a metal surface is provided comprising applying a coating to the metal surface wherein the coating is a temporary barrier to an etchant attacking the metal surface and the...
5702584 Enhanced plating adhesion through the use of metallized fillers in plastic substrate  
A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a...
5630948 Method for the fabrication of integrated conductor suspensions and product  
Integrated conductor suspensions are fabricated by progressively etching a suspension shape in a preformed laminate of copper, and stainless steel adhering to an intermediate resin layer, including...
5597494 Method of manufacturing multilayer ceramic electronic component  
Disclosed herein is a method of manufacturing a multilayer ceramic electronic component by forming external electrodes on a pair of opposite side surfaces of a sintered body (1) obtained by...
5535904 Surface preparation for bonding iron  
The present invention relates to an improved etchant for iron materials and method for etching iron materials. The etchant is an aqueous solution of ferrous chloride and phosphoric acid. The...
5517758 Plating method and method for producing a multi-layered printed wiring board using the same  
A dry sandblasting treatment for spraying abrasives onto a surface of an insulating resin layer, a chemical etching for chemically etching the surface, and a plating process for plating a...
5509557 Depositing a conductive metal onto a substrate  
A method for depositing a conductive metal onto a dielectric substrate is provided. The method includes obtaining a metal sheet having a roughened surface that has the following parameters: R a ...
5498311 Process for manufacture of printed circuit boards  
A method for manufacture of printed circuit boards uses plasma etch back/desmear, carbon deposits on board surfaces to be plated and panel plating. The plated board is abrasively pre-treated,...
5413838 Both-side roughened copper foil with protection film  
Disclosed is a both-side roughened copper foil with a protection film, comprising a metal foil as soft as or softer than copper, or an organic type film having a melting point equal to or higher...
5382505 Method of making a laminated structure with shear force delamination resistance  
The surface of a metal foil to be used as an intermediate layer in printed circuit boards is chemically roughened. In one embodiment, fine depressions are etched out of the metal coating. In...
5382333 Process for producing copper clad laminate  
A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness...
5352565 Method of forming apertures into thin metallic foils  
A device for shielding composite material surfaces of aircraft from the destructive forces associated with lightning strikes and for protecting avionics from electromagnetic interference (EMI) and...
5332465 Process for preparing plastic surfaces to be plated  
A process is disclosed which is beneficially employed in sensitizing plastic surfaces prior to etching which sensitization enhances the coverage and adhesiveness of the subsequent plate. The...
5246538 Adhesive bonding of poly(arylene sulfide) surfaces  
Preparing an arylene sulfide polymer surface for improved bonding to another surface includes molding the initially smooth polymer surface to fit the contours of a metallic foil having a high...
5242534 Platinum lift-off process  
A method for generating platinum features on the surface of a substrate is disclosed. The method provides an inexpensive means for constructing small platinum features. The method utilizes a...
H001164 Method of treating the surface of commercially available polymer films  
The surface of commercially available polymer films are treated with a low emperature gas plasma to improve the subsequent bonding of aluminum to the polymer surface without the need for adhesives.
5180639 Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom  
Method of modifying an aromatic polymer surface to improve adhesion of a metal layer thereon and to the articles produced therefrom. The surface of the aromatic polymer such as polycarbonate, is...
5112513 Solution and process for etching and activating surfaces of a nonconductive substrate  
An aqueous solution for etching and activating a surface of a nonconductive substrate for subsequent chemical and, if necessary, electrochemical deposition of a metal coating containing both an...
5036897 Thermal printing head manufacturing method  
A method of manufacturing a thermal printing head includes forming a layer of polyimide resin precursor on a heat-resistant resin substrate on which two parallel common electrodes and a large...
5006200 Method of bonding copper and resin  
A method of bonding copper and resin comprising the steps of: (a) forming a layer of copper oxide on the surface of copper by oxidation of copper; (b) reducing the layer of copper oxide thus...
4946546 Method of metallizing a substrate of silica, quartz, glass or sapphire  
A method of adhering a metal to a surface of a substrate of silica, quartz, glass or sapphire is set forth. The surface to be metallized is first roughened by mechanical abrasion to obtain a...
H000788 Method for bonding plastic to metal  
A method for bonding plastic to a metallic member is described which comprises the steps of forming a preselected pattern of etched cavities in the metallic surface to be bonded, which cavities at...
4902556 Multi-layer polynorbornene and epoxy laminates and process for making the same  
Multi-layer laminates are provided of alternating or non alternating layers of reinforced epoxy and reinforced polynorbornene. The laminates are made by a process which includes an adhesion...
4902551 Process for treating copper surface  
Adhesion of copper to a resin layer is improved by reducing a copper oxide layer with an aqueous aldehyde solution (a) while applying a potential of -1000 mV to -400 mV to the copper oxide layer,...
4886572 Composite electrode comprising a bonded body of aluminum and electroconductive polymer and electric cell using such a composite electrode  
A bonded body of aluminum and electroconductive polymer, said aluminum having a surface to which said polymer is bonded, and mainly having (HOO) face (H=1,2,4) as a crystal face at said surface.
Matches 1 - 50 out of 138 1 2 3 >