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7469812 |
Wire bonding apparatus
A wire bonding apparatus includes a heat block ( 121 ) and a heat plate ( 122 ) provided on the heat block ( 121 ). A recess ( 1221 ) is provided in the heat plate ( 122 ) to receive the first...
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7464854 |
Method and apparatus for forming a low profile wire loop
A method of bonding a wire between a first bonding location and a second bonding location is provided. The method includes bonding a first end of a wire to a first bonding location using a wire...
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7464851 |
Wire bonding method and apparatus therefor
Methods and apparatus for detecting the welding state in each bonding section and the application of ultrasonic vibration and pressing force is stopped promptly when completion of welding is...
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7464460 |
Method of metallurgically bonding a stator bar
A method for metallurgically bonding a stator bar to a coupling to reduce the incidence of leak paths resulting from corrosion. The stator bar comprises strands through which a liquid coolant can...
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7458498 |
Semiconductor device and a wire bonding method
A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding...
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7458496 |
Wire bonder and method of operating the same
Wire bonder having a bonding head which has a bonding tool and a bonding wire guide and, especially, a bonding wire cutting device which comprises a cutter for separation of that section of a...
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7431192 |
Wire bonding apparatus
A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is...
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7427009 |
Capillary for wire bonding
A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire...
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7419085 |
Optical processing apparatus
The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing...
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7416107 |
Concave face wire bond capillary and method
An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a...
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7413108 |
Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding tool
In the manufacture of electronic devices ( 22, 22 ′), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool ( 10 ) is used having a bonding tip or wedge ( 1, 2 ) at each of...
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7412767 |
Microprobe tips and methods for making
Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building...
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7407079 |
Automated filament attachment system for vacuum fluorescent display
A filament attachment system includes a bond head comprising a de-spooling system with a spool and balanced dancer arm assembly, a clamp having a curved filament entry, a narrower gripping region,...
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7404513 |
Wire bonds having pressure-absorbing balls
A semiconductor device with a chip having at least one metallic bond pad ( 101 ) over weak insulating material ( 102 ). In contact with this bond pad is a flattened metal ball ( 104 ) made of at...
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