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Match Document Document Title
7474005 Microelectronic element chips  
Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors...
7473993 Semiconductor stack package and memory module with improved heat dissipation  
A semiconductor stack package includes lower and upper individual packages. When the upper individual package is stacked on the lower individual package, a heat-conducting layer provided under the...
7473992 Multi-layer interconnection circuit module and manufacturing method thereof  
The present invention is directed to a multi-layer interconnection circuit module in which plural unit wiring layers are interlayer-connected to each other through a large number of via holes so...
7473581 Wafer stacking package method  
A method of wafer stacking packaging. The method comprises providing a die array including a plurality of singulated first dies cut from a first wafer; providing a second wafer with inseparate the...
7471538 Memory module, system and method of making same  
A memory module, system and method of making the same includes a memory module including a plurality of memory devices having a first portion of memory devices cooperatively forming a first rank of...
7470994 Bonding pad structure and method for making the same  
A semiconductor device includes a substrate with a dielectric layer thereon, a stack of interconnection structures in the dielectric layer, each interconnection structure including a conductive...
7468553 Stackable micropackages and stacked modules  
The present invention provides a system and method for devising stackable assemblies that may be then stacked to create a stacked circuit module. One or more integrated circuit (IC) die are...
7468552 Physical quantity sensor  
A physical quantity sensor includes a package, a circuit chip disposed and held in the package, a sensor chip stacked and fixed on the circuit chip, and a wiring member having flexibility, through...
7468551 Multiple chips bonded to packaging structure with low noise and multiple selectable functions  
A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor...
7466577 Semiconductor storage device having a plurality of stacked memory chips  
A semiconductor storage employs a base substrate ( 101 ) having a command/address external terminal group (CA), a data input/output external terminal group (DQ), and a single chip select external...
7466028 Semiconductor contact structure  
A semiconductor device structure for a three-dimensional integrated circuit is provided. The semiconductor device structure includes: a substrate having a first surface and a second surface; a via...
7466020 Power module  
The invention relates to a power module comprising a substrate ( 2 ), whose surfaces are provided with at least one electrically conductive layer ( 4, 6 ), at least one active semiconductor chip (...
7462930 Stack chip and stack chip package having the same  
Provided are a stack chip and a stack chip package having the stack chip. Internal circuits of two semiconductor chips are electrically connected to each other through an input/output buffer...
7462929 Semiconductor device and an image sensing device  
SI in a semiconductor device in which a plurality of semiconductor chips differing in withstand voltage or in noise immunity, such as a multi-chip module, is to be improved. The semiconductor...
7462925 Method and apparatus for stacking electrical components using via to provide interconnection  
An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active...
7459776 Stacked die assembly having semiconductor die projecting beyond support  
A stack of semiconductor dies is disclosed. A first stack level includes a first semiconductor die and at least one first support that are attached to a substrate surface. A second level includes a...
7459773 Stackable ball grid array  
A memory package having a plurality of vertically stacked ball grid arrays. Each of the vertically stacked ball grid arrays has a memory chip coupled thereto. Further, each of the plurality of ball...
7459772 Face-to-face bonded I/O circuit die and functional logic circuit die system  
An integrated circuit system includes a first set of integrated circuit dice each member of the set having a different configuration of input/output circuits disposed thereon and a second set of...
7456495 Semiconductor module with a semiconductor stack, and methods for its production  
An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a...
7453153 Circuit device  
The ground noise is reduced which propagates between circuit elements in a circuit device having a multiple stack structure. A grounding bonding pad provided on the surface of a second circuit...
7452754 Method for manufacturing flexible printed circuit boards  
A method for manufacturing of flexible printed circuit boards is provided. The method includes the steps of: providing a tape substrate having an electrically insulating layer and an electrically...
7452751 Semiconductor device and method of manufacturing the same  
Semiconductor device includes a pair of substrates ( 1, 2 ) disposed oppositely, semiconductor elements ( 5, 6 ) formed in the substrates ( 1, 2 ), respectively, and having semiconductor circuits (...
7449773 Microelectromechanical device packages with integral heaters  
A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device...
7446404 Three-dimensional package and method of making the same  
A three-dimensional package including a first wafer having at least one first pad and a first protection layer exposing the first pad. A first hole penetrates the first wafer. A first isolation...
7446403 Carrier structure stacking system and method  
The present invention provides a system and method for selectively stacking and interconnecting leaded packaged integrated circuit devices with connections between the feet of leads of an upper IC...
7446396 Stacked integrated circuit leadframe package system  
A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an...
7443037 Stacked integrated circuit package system with connection protection  
A stacked integrated circuit package system is provided connecting an interconnect between a first integrated circuit device and a substrate, the first integrated circuit device on the substrate,...
7443014 Electronic module and method of assembling the same  
An electronic module includes a semiconductor power switch and a semiconductor diode. The lower side of the semiconductor power switch includes an output contact mounted on a die pad of a...
7439620 Integrated circuit package-in-package system  
An integrated circuit package-in-package system is provided including forming an external interconnect having an upper portion and a lower portion; forming a packaged device; mounting an active...
7436071 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board  
An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such...
7436055 Packaging method of a plurality of chips stacked on each other and package structure thereof  
A package structure with a plurality of chips stacked on each other includes a substrate, a first chip and second chip. The substrate has a dielectric layer, a metal layer having a conducting trace...
7436054 MEMS microphone with a stacked PCB package and method of producing the same  
A MEMS microphone with a stacked PCB package is described. The MEMS package has at least one MEMS acoustic sensor device located on a PCB stack. A metal cap structure surrounds the at least one...
7435619 Method of fabricating a 3-D package stacking system  
The present invention provides a system for 3D package stacking system, comprising providing a substrate, attaching a ball grid array package, in an inverted position, to the substrate, forming a...
7432600 System having semiconductor component with multiple stacked dice  
A system includes a semiconductor component having a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the...
7432599 Memory module having interconnected and stacked integrated circuits  
A multi-chip memory module may be formed including two or more stacked integrated circuits mounted to a substrate or lead frame structure. The memory module may include means to couple one or more...
7432593 Semiconductor package assembly and method for electrically isolating modules  
A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for...
7432588 Semiconductor device and method of fabricating the same  
A semiconductor device 100 comprises a leadframe 104 having an island portion 102 ; two chips of a first semiconductor chip 110 and a second semiconductor chip 120 , respectively having top...
7432587 Integrated device including connections on a separate wafer  
An integrated semiconductor device includes semiconductor regions and isolation regions in a first wafer of semiconductor material, and, on a second wafer of semiconductor material, interconnection...
7429792 Stack package with vertically formed heat sink  
A stack package includes a base substrate having connection pads on an upper surface thereof and ball lands on a lower surface thereof; at least two semiconductor chps stacked by intervening a...
7429788 Thin multichip flex-module  
A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed...
7429787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides  
Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second...
7429786 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides  
A semiconductor package subassembly includes a die affixed to, and electrically interconnected with, a die attach side of a first package substrate, and a second substrate having a first side and a...
7429785 Stacked integrated circuit chip assembly  
A stacked arrangement of integrated circuit chips are bonded to a lead frame. Two side-by-side integrated circuit chips have bottom contact pads bonded to a lead frame structure having contact...
7429784 Package structure  
A package structure is provided herein. The package structure includes a first substrate and a second substrate. A first seal ring having a first height is disposed around a predetermined area of...
7429782 Semiconductor stack block comprising semiconductor chips and methods for producing the same  
A semiconductor stack block contains either stacked semiconductor chip size semiconductor devices or semiconductor devices with semiconductor chips in a plastic housing composition, the...
7427810 Semiconductor device including semiconductor element mounted on another semiconductor element  
A semiconductor device including a first semiconductor element mounted on a first surface of second semiconductor element, wherein solder balls are formed on the first surface of the second...
7425758 Metal core foldover package structures  
Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The...
7423339 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice  
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board,...
7423338 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice  
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board,...
7423337 Integrated circuit device package having a support coating for improved reliability during temperature cycling  
An apparatus and method for increasing integrated circuit device package reliability is disclosed. According to one embodiment of the present invention, a support coating is added to a wafer after...
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