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Match Document Document Title
7470983 Semiconductor device reducing warping due to heat production  
A semiconductor device includes an intermediate layer provided between a semiconductor element and a heat sink. The intermediate layer moderates thermal stress resulting from a difference between...
7466016 Bent lead transistor  
A metal backing tab supports the semiconductor device and has an extending portion extending from an edge. A top leg, a middle leg and a bottom leg are all coupled to the semiconductor device and...
7459784 High capacity thin module system  
Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and...
7456052 Thermal intermediate apparatus, systems, and methods  
Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached...
7453145 Electronics unit  
An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components...
7450174 Two-dimensional image detector with disturbance-blocking buffer  
A two-dimensional image detector includes a sensitive semiconductor layer for converting optical information or radiological information corresponding to a two-dimensional image of a detection...
7449775 Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion  
A decoupling package stack including a circuit board, a substrate mounted on and electrically coupled to the circuit board, a semiconductor die mounted on and electrically coupled to the substrate...
7446410 Circuit module with thermal casing systems  
Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the...
7443023 High capacity thin module system  
Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and...
7439614 Circuit device with dummy elements  
In a manufacturing method of a hybrid integrated circuit device 10 according to the present invention, a first dummy pattern D 1 is provided on a first wiring layer 18 A. Furthermore, a second...
7436060 Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly  
A semiconductor integrated circuit package incorporating a preformed one-piece mold cap and heatspreader assembly is disclosed. One implementation includes a substrate with a die attached to the...
7431071 Fluid circuit heat transfer device for plural heat sources  
A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources....
7427566 Method of making an electronic device cooling system  
A method is provided. The method includes forming a conductive layer on an inner surface of a substrate and providing a sacrificial layer over the conductive layer. The method includes forming a...
7417312 Use of solder paste for heat dissipation  
A circuit board includes at least one trace having at least one heat spreader disposed thereon, the heater spreader being formed of a solidified paste, such as a paste that includes a mixture of...
7417299 Direct connection multi-chip semiconductor element structure  
A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips...
7400506 Method and apparatus for cooling a memory device  
A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat...
7400035 Semiconductor device having multilayer printed wiring board  
A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support...
7397664 Heatspreader for single-device and multi-device modules  
A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric...
7382618 Heat dissipating apparatus for computer add-on cards  
A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of...
7365422 Package of leadframe with heatsinks  
A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed...
7365418 Multi-chip structure  
A multi-chip structure at least including a first chip, a second chip and a first thermal-conductive layer is provided. The first chip has a first surface and a plurality of first pads disposed on...
7359201 Heat-generating electronic part cover and cover mounting method  
A cover is mounted to a heat-generating electronic part (T) for electrical insulation and heat dissipation purposes. The cover comprises a hollow cover body ( 20 ) of rectangular prism shape having...
7358605 Heat dissipation structure for electronic device  
A heat dissipation structure for an electronic device comprises a plurality of covering members made of a compressed wooden material, and a metal heat dissipation frame held between the covering...
7355276 Thermally-enhanced circuit assembly  
A circuit assembly for mounting one or more integrated circuits that effectively dissipates heat generated by the integrated circuits, and a corresponding method for fabricating such a circuit...
7348664 Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device  
A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first...
7342306 High performance reworkable heatsink and packaging structure with solder release layer  
A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of...
7332807 Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same  
A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric...
7330355 Fixed pillar with heat loss  
A fixed pillar with heat loss is a fixed pillar for losing heat. The fixed pillar with heat loss includes a metal body, a screw thread and a plurality of grooves. The metal body is a hollow body....
7327027 Thermal interface structure with integrated liquid cooling and methods  
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved...
7323776 Elevated heat dissipating device  
The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate....
7323255 Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate  
First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of...
7315080 Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader  
A ball grid array package is manufactured by mounting a semiconductor die to a first surface of a substrate and mounting a die adapter to the semiconductor die. The semiconductor die is wire bonded...
7312525 Thermally enhanced package for an integrated circuit  
A circuit assembly having an insulating base, a heat-conducting plate and a circuit containing die is disclosed. The die is in thermal contact with the heat-conducting plate, which is bonded to the...
RE39957 Method of making semiconductor package with heat spreader  
A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least...
7304381 Package and method for attaching an integrated heat spreader  
In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat...
7304372 Semiconductor package  
A semiconductor package including a bidirectional compound semiconductor component and two power semiconductor devices connected in a cascode configuration.
7301232 Integrated circuit package with carbon nanotube array heat conductor  
An integrated circuit package includes a die mounted on a substrate, an integrated heat spreader set above the die, and an array of carbon nanotubes mounted between the die and the integrated heat...
7288839 Apparatus and methods for cooling semiconductor integrated circuit package structures  
Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal...
7285851 Liquid immersion cooled multichip module  
In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid...
7274105 Thermal conductive electronics substrate and assembly  
An electronics assembly is provided including a circuit board substrate having a top surface and a bottom surface and a plurality of thermal conductive vias extending from the top surface to the...
7268429 Technique for manufacturing an overmolded electronic assembly  
A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending...
7268428 Thermal paste containment for semiconductor modules  
A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal...
7256492 Heat sink and display panel including heat sink  
A heat sink that absorbs heat generated from at least one semiconductor device and dissipates the heat absorbed includes: a first surface adapted to match and contact at least one semiconductor...
7256491 Thermal interconnect systems methods of production and uses thereof  
A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat...
7245022 Semiconductor module with improved interposer structure and method for forming the same  
Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an...
7236367 Power electronics component  
The invention relates to a power electronics component that comprises a planar ceramics substrate ( 2 ) on whose one face condutor tracks ( 6 ), applied in thick-film technique, are disposed for...
7235880 IC package with power and signal lines on opposing sides  
A package for integrated circuits is described. The package has a package substrate with a land side and an opposite die side, a first set of low level signal connectors on the die side to connect...
7235876 Semiconductor device having metallic plate with groove  
A semiconductor device includes: first and second metallic plates, each of which includes a heat radiation surface and an inner surface; a semiconductor element between the metallic plates; a block...
7221570 Heat dissipating device for an integrated circuit chip  
An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip...
7211891 Electronic heat pump device, laser component, optical pickup and electronic equipment  
There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device...
Matches 1 - 50 out of 679 1 2 3 4 5 6 7 8 9 10 11 12 13 14 >