Matches 1 - 50 out of 1859 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7474009 Optoelectronic molding compound that transmits visible light and blocks infrared light  
A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED or optical sensor. The molding compound includes a partially-cured epoxy...
7474008 Semiconductor device with reduced electromigration  
A high reliability semiconductor device is provided which can prevent electromigration due to the deposition of metal ions originating from wires. The device includes: a flexible wiring board 11 ...
7473993 Semiconductor stack package and memory module with improved heat dissipation  
A semiconductor stack package includes lower and upper individual packages. When the upper individual package is stacked on the lower individual package, a heat-conducting layer provided under the...
7468559 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting  
Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any...
7459345 Packaging method for an electronic element  
A packaging method for an electronic element has: etching portions of a top surface of a metal board to form recesses between raised unetched segments and filling the recesses with a dielectric...
7449774 Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same  
A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected...
7449726 Power semiconductor apparatus  
The power semiconductor apparatus includes a resin package made up of a power semiconductor element and a control semiconductor element which are mounted on a main front surface of a lead frame and...
7446423 Semiconductor device and method for assembling the same  
In a semiconductor device provided with a thinned semiconductor element, the present invention intends to inhibit damage of the semiconductor element in the neighborhood of its outer periphery so...
7446396 Stacked integrated circuit leadframe package system  
A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an...
7443043 Circuit device and method of manufacture thereof  
A circuit device 10 comprises a die pad 11 , bonding pads 12 , a circuit element 9 , affixed onto die pad 11 , and an insulating resin 14 , which seals die pad 11 , bonding pads 12 , and...
7443016 Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant  
A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are...
7436076 Micromechanical component having an anodically bonded cap and a manufacturing method  
A micromechanical component includes a cap wafer made up of at least a first silicon substrate and a thin glass substrate, and having a functional wafer made up of at least a second silicon...
7436075 Ion beam irradiation apparatus and ion beam irradiation method  
The ion beam irradiation apparatus has a vacuum chamber 10 , an ion source 2 , a substrate driving mechanism 30 , rotation shafts 14 , arms 12 , and a motor. The ion source 2 is disposed...
7436074 Chip package without core and stacked chip package structure thereof  
A chip package without a core, including a patterned circuit layer, a chip, a solder mask, a molding compound and multiple outer terminals, is provided. The patterned circuit layer has a first...
7435993 High temperature, high voltage SiC void-less electronic package  
An electronic package designed to package silicon carbide discrete components for silicon carbide chips. The electronic package allows thousands of power cycles and/or temperature cycles between...
7435625 Semiconductor device with reduced package cross-talk and loss  
Structure and method are provided for plastic encapsulated semiconductor devices having reduced package cross-talk and loss. Semiconductor die are first coated with a buffer region having a lower...
7435624 Method of reducing mechanical stress on a semiconductor die during fabrication  
A method of reducing mechanical stress on an integrated circuit is disclosed including applying solder columns to the substrate for adding structural support to the package during the fabrication...
7432601 Semiconductor package and fabrication process thereof  
A semiconductor package mainly includes a chip, a substrate, an encapsulant, a plurality of external terminals and a stress release layer. The substrate has an upper surface and a lower surface....
7432600 System having semiconductor component with multiple stacked dice  
A system includes a semiconductor component having a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the...
7432586 Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages  
An apparatus and method for enhancing thermal performance and electromagnetic interference (EMI) shielding in die-up array integrated circuit (IC) device packages is presented. A die-up array...
7429799 Land patterns for a semiconductor stacking structure and method therefor  
A semiconductor device has a substrate and an encapsulation area on a first surface of the substrate. A first plurality of metal lands is on the first surface of the substrate around a periphery of...
7429790 Semiconductor structure and method of manufacture  
A semiconductor structure ( 100 ) includes a substrate ( 110 ) having a first surface ( 111 ) with a mold lock feature ( 101 ). The semiconductor structure also includes a semiconductor chip ( 120...
7429787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides  
Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second...
7429786 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides  
A semiconductor package subassembly includes a die affixed to, and electrically interconnected with, a die attach side of a first package substrate, and a second substrate having a first side and a...
7427813 Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package  
Provided are semiconductor low-K Si die wire bonding packages with package stress control and fabrication methods for such packages. The packages include molding interface material applied onto the...
7427811 Semiconductor substrate  
A semiconductor wafer having a high degree of thinness and exhibiting an enhanced strength state. A layer of tenacious reinforcement material is disposed over a back side of the wafer while in a...
7427810 Semiconductor device including semiconductor element mounted on another semiconductor element  
A semiconductor device including a first semiconductor element mounted on a first surface of second semiconductor element, wherein solder balls are formed on the first surface of the second...
7427806 Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component  
Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip ( 1 ), which is disposed in a recess ( 2 )...
7425469 Method for encapsulating an electronic component using a foil layer  
The invention relates to a method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of: a) placing at least one foil...
7423340 Semiconductor package free of substrate and fabrication method thereof  
A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of...
7420266 Circuit device and manufacturing method thereof  
Provided is a circuit device having conductive patterns which are equally spaced apart and a manufacturing method thereof. A method for manufacturing a circuit device of the present invention...
7417330 Semiconductor device packaged into chip size and manufacturing method thereof  
A semiconductor device includes a semiconductor substrate having an integrated circuit and at least one connection pad, and at least one external connection electrode electrically connected with...
7417329 System-in-package structure  
A system-in-package structure includes a carrier substrate having a molding area and a periphery area, at least a chip disposed in the molding area, an encapsulation covering the chip and the...
7417314 Semiconductor chip assembly with laterally aligned bumped terminal and filler  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that...
7417309 Circuit device and portable device with symmetrical arrangement  
To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first...
7417305 Electronic devices at the wafer level having front side and edge protection material and systems including the devices  
Methods for applying a dielectric protective layer to a wafer in wafer-level chip scale package manufacture are disclosed. A flowable dielectric protective material with fluxing capability is...
7416923 Underfill film having thermally conductive sheet  
An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally...
7414319 Semiconductor chip assembly with metal containment wall and solder terminal  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a...
7414304 Semiconductor device  
A semiconductor device including a substrate having a main surface including a first area, a second area surrounding the first area, and a third area surrounding the second area; a first insulating...
7408260 Microelectronic assemblies having compliant layers  
A microelectronic assembly includes a microelectronic element such as a semiconductor chip or wafer having a first surface and contacts accessible at the first surface, a compliant layer overlying...
7405656 Device and method for encapsulation and mounting of RFID devices  
This invention involves encapsulating an RFID device in an encapsulating material by known encapsulating processes to form a domed, encapsulated RFID tag. The encapsulating material may be...
7405487 Method and apparatus for removing encapsulating material from a packaged microelectronic device  
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
7405486 Circuit device  
In stack packaging, an IC chip in an upper layer and an IC chip in a lower layer are insulated from each other by use of an insulating adhesive and the like. Thus, if an analog IC chip is stacked...
7405485 Semiconductor device  
A semiconductor device provided with a first semiconductor chip having a first functional surface formed with a first functional element and a first rear surface, a second semiconductor chip having...
7405474 Low cost thermally enhanced semiconductor package  
In one embodiment, a device is packaged using a low-cost thermally enhanced ball grid array (LCTE-BGA) package. The device may include a die with its backside mounted to the bottom side of a...
7402503 Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus  
A dicing sheet which supports electronic-component aggregation with adhesive in the case of separating the electronic-component aggregation in which a plurality of electronic components are...
7400049 Integrated circuit package system with heat sink  
An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit...
7400048 Void-free circuit board and semiconductor package having the same  
A void-free circuit board and a semiconductor package having the same includes a protective layer covering and protecting an electrode pattern formed on an upper surface of a substrate. The...
7400032 Module assembly for stacked BGA packages  
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid...
7397139 Epoxy resin molding material for sealing use and semiconductor device  
An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12...
Matches 1 - 50 out of 1859 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >