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Match Document Document Title
7456091 Semiconductor device and method of manufacturing the same  
A semiconductor device of the present invention includes a chip which has a pad; a bump electrode formed on the pad; and a wire whose stitch bonding is made on the bump electrode. The wire...
7413935 Semiconductor device and method of fabricating the same  
A method of fabricating a semiconductor device includes hardening resin at a temperature that is less than or equal to the boiling point of the resin and until the hardening reaction ratio of the...
7371661 Wafer bonding method  
A wafer bonding method, comprising steps of: coating a medium layer respectively on the surfaces of two wafers; removing impurities formed on the surface of each medium layer; laminating the two...
7365424 Microelectronic component assemblies with recessed wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7364950 Semiconductor device and method of manufacturing the same  
A semiconductor device is provided including a semiconductor element having a plurality of electrodes, a plurality of bonding portions of a lead frame, a plate-like current path material which...
7355285 Structure of mounting electronic component  
The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit...
7350685 Method of mounting electronic component  
The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the...
7348621 Non-volatile memory cells  
A non-volatile memory cell and method of fabrication are provided. The non-volatile memory cell includes a substrate of a first conductivity type, a first dopant region of a second conductivity...
7342267 MOSFET package  
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic...
7332757 MOSFET package  
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic...
7331737 Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip  
To provide a semiconductor device that enables high integration degree, and a manufacturing method therefor. A multi-chip module according to an embodiment of the present invention includes: a...
7314818 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment  
A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump....
7294853 Substrate for mounting a semiconductor  
A substrate ( 1 ) is formed from a non-electrically conducting material and is for mounting a semiconductor chip ( 10 ). The substrate has a semiconductor chip mounting portion ( 6 ). A number of...
7279061 Process for the production of improved metallized films  
Improved metallized films are produced by transferring a protective layer onto a metal layer from the side of the film remote from the metal layer. The transfer preferably takes place in the...
7276436 Manufacturing method for electronic component module and electromagnetically readable data carrier  
A semiconductor bear chip having a bump subjected to high temperatures is pressed, from the upper side, onto a wiring board including a wiring pattern, a thermosetting resin film covering an...
7264146 Ultrasonic tool and ultrasonic bonder  
An ultrasonic tool, for bonding two materials to each other by joining a face of one of the materials to a face of the other material using the action of ultrasonic waves applied to one of the...
7262124 Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus  
A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire has a crushed part formed therein by crushing the part of the wire and a top...
7256488 Semiconductor package with crossing conductor assembly and method of manufacture  
A semiconductor package uses various forms of conductive traces that connect to die bond pads via bond wires. In one form, adjacent bond wires are intentionally crossed around midpoints thereof to...
7256485 Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip  
To provide a semiconductor device that enables high integration degree, and a manufacturing method therefor. A multi-chip module according to an embodiment of the present invention includes: a...
7250684 Circular wire-bond pad, package made therewith, and method of assembling same  
A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also...
7250328 Microelectronic component assemblies with recessed wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7245026 Configuration and method for contacting circuit structure  
A configuration and method for contacting a circuit is described. A carrier is disposed adjacent a circuit, and a setting element at which an electrical connection formed of a conductive material...
7242090 Device package  
Device packages often include walls build on a heat sink that surrounds a device die that thermally interacts with the heat sink. Use of raised or depressed feature on said heat sink that contacts...
7241678 Integrated die bumping process  
An integrated die bumping process includes providing a load board, defining a plurality of die regions on a surface of the load board for placing dice of a plurality of die specifications, affixing...
7232709 Process for producing a semiconductor device  
The process for producing a semiconductor device according to the invention comprises a pre-sticking/fixing step of pre-sticking/fixing a semiconductor element through an adhesive sheet to an...
7230322 Semiconductor device and method of manufacturing the same  
A semiconductor device is provided including a semiconductor element having a plurality of electrodes, a plurality of bonding portions of a lead frame, a plate-like current path material which...
7229906 Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine  
The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump...
7229854 Electronic component mounting method and apparatus and ultrasonic bonding head  
A component mounting apparatus includes a component feeder ( 20 ) that feeds a component ( 2 ) with its bump electrodes facing down, a mounting head ( 5 ) that mounts the component onto a substrate...
7226815 Method for manufacturing semiconductor device  
A manufacturing method is for providing an excellent wire bonding property in the manufacturing of a semiconductor device using an organic resin wiring substrate. In the manufacturing of the...
7216794 Bond capillary design for ribbon wire bonding  
A device ( 100 ) and method ( 200 ) for bonding a ribbon wire ( 104 ) to a workpiece ( 106 ) comprising feeding the ribbon wire through a passageway ( 116 ) of an ultrasonic bond capillary ( 102 )...
7214607 Compliant wirebond pedestal  
A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the...
7208059 Method of ultrasonic-mounting electronic component and ultrasonic mounting machine  
The ultrasonic mounting method is capable of uniformly bonding bumps of an electronic component to a circuit board and improving reliability of ultrasonic-mounting the electronic component. The...
7192861 Wire bonding for thin semiconductor package  
An assembly of a semiconductor chip ( 301 ) having an integrated circuit (IC) including at least one contact pad ( 320 ) on its surface ( 301 a ), wherein the contact pad has a metallization...
7188759 Methods for forming conductive bumps and wire loops  
A method of forming a conductive bump is provided. The method includes depositing a conductive bump on a bonding location using a bonding tool such that a junction exists between (1) a length of...
7180161 Lead frame for improving molding reliability and semiconductor package with the lead frame  
A lead frame for improving molding reliability and a semiconductor package with the lead frame are proposed. At least one embossed structure, such as a metal bump or recessed portion, is formed on...
7179686 Manufacturing method of semiconductor device  
A method of manufacturing a semiconductor device including a die pad section, a first semiconductor chip having a surface on which a first electrode section is formed, a second semiconductor chip...
7176580 Structures and methods for wire bonding over active, brittle and low K dielectric areas of an IC chip  
Disclosed are structures and methods that facilitate the use of wire bonding technology over active areas of an IC chip. The invention is also suitable for use with IC structures that use brittle...
7176570 Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment  
A tip of a wire formed in the shape of a ball is bonded to an electrode by using a tool. A part of the wire is drawn from the tip bonded to the electrode. A bump is formed on the electrode by...
7176056 Semiconductor integrated circuit device and method of manufacturing the same  
Arrangements are provided to effectively prevent wire disconnection generated due to an increase of heat applied to a semiconductor integrated circuit device The semiconductor integrated circuit...
7174629 Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor  
An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at...
7172958 High-frequency wiring structure and method for producing the same  
A high-frequency wiring structure includes a microstrip line having a ground conductor, a dielectric disposed on the ground conductor, and a transmission conductor that is at least partially...
7160797 Method of bumping die pads for wafer testing  
A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor...
7153764 Method of manufacturing a semiconductor device including a bump forming process  
A method of manufacturing a semiconductor device includes an improved bump forming process. The bump forming process includes a bump forming step for forming a bump on the pad by feeding a gold...
7152308 Wirebonder to bond an IC chip to a substrate  
Thick film bond surfaces ( 8 ) on a support structure ( 10 ), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit ( 16 ) having raised bosses...
7151318 Semiconductor component and method for contacting said semiconductor component  
The semiconductor component has several regularly arranged active cells ( 1 ), each comprising at least one main defining line ( 8 ). A bonding wire ( 18, 20 ) is fixed to at least one bonding...
7151316 Semiconductor device  
A semiconductor device includes a substrate, a plurality of bonding fingers formed on the surface of the substrate, and a semiconductor element arranged above the surface of the substrate and...
7148504 Semiconductor device  
One of aspects of the present invention is to provide a semiconductor device, which includes an insulating substrate, and a semiconductor chip mounted on the insulating substrate. The semiconductor...
7138328 Packaged IC using insulated wire  
A packaged IC including insulated wire for electrically connecting conductive structures of the packaged IC. In some embodiments, the packaged IC includes an IC die attached to a package substrate,...
7112873 Flip chip metal bonding to plastic leadframe  
A plastic substrate can be provided and thereafter a plurality of metal-to-metal connections can be ultrasonically bonded to the plastic substrate. One or more dies and a plurality of conductive...
7095122 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
Matches 1 - 50 out of 455 1 2 3 4 5 6 7 8 9 10 >