Matches 1 - 29 out of 29
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7436054 MEMS microphone with a stacked PCB package and method of producing the same  
A MEMS microphone with a stacked PCB package is described. The MEMS package has at least one MEMS acoustic sensor device located on a PCB stack. A metal cap structure surrounds the at least one...
7427809 Repairable three-dimensional semiconductor subsystem  
A tightly packed three-dimensional electronic system or subsystem comprising multiple stacks of semiconductor elements is described. The system is repairable because the elements connect together...
7425760 Multi-chip module structure with power delivery using flexible cables  
One embodiment of the present invention provides an integrated circuit module. This module includes a semiconductor die with an active face, upon which active circuitry and signal pads reside, and...
7417313 Method for manufacturing an adhesive substrate with a die-cavity sidewall  
A method for manufacturing an adhesive substrate with a die-cavity sidewall is disclosed. A region for forming die-cavity sidewall is defined on one surface of the substrate. The substrate is...
7417294 Microelectronic imaging units and methods of manufacturing microelectronic imaging units  
Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies...
7400038 Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication  
A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate...
7391122 Techniques for flip chip package migration  
Techniques for integrated circuit packaging in a flip chip configuration that ensures a migration path between related integrated circuits and utilizes core I/O (or area I/O) are provided. An...
7378725 Semiconducting device with stacked dice  
Some embodiments of the present invention relate to a semiconducting device and method that include a substrate and a first die that is attached to the substrate. The first die includes active...
7348210 Post bump passivation for soft error protection  
A structure and a method for forming the same. The method includes (a) providing a structure which includes (i) a dielectric layer, (ii) an electrically conducting bond pad on and in direct...
7323765 Die attach paddle for mounting integrated circuit die  
An electrical package for an integrated circuit die which comprises a die-attach paddle for mounting the integrated circuit die. The die-attach paddle has at least one down-set area located on a...
7298045 Stacked semiconductor device  
A first semiconductor element and second semiconductor element are bonded via die-bonding material. A first electrode of the first semiconductor element and a third electrode are joined, by means...
7259443 Methods for forming patterns on a filled dielectric material on substrates  
Methods of forming a pattern of filled dielectric material on a substrate by thermal transfer processes are disclosed comprising exposing to heat a thermally imageable donor element comprising a...
7245011 Prevention of contamination on bonding pads of wafer during SMT  
A semiconductor device is disclosed for preventing contamination on its bonding pads during mounting an electronic component, such as surface mount device (SMD). The semiconductor device includes a...
7233066 Multilayer wiring substrate, and method of producing same  
A method of producing a multilayer wiring substrate is disclosed. The multilayer wiring substrate is free from a core substrate and includes a build up layer which includes an insulator layer and a...
7221048 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier  
A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a...
7205655 Multilayer circuit including stacked layers of insulating material and conductive sections  
The invention relates to the manufacturing of a multilayer structure and especially it relates to the manufacturing of a three-dimensional structure and its use as an electronics assembly substrate...
7190058 Spacer die structure and method for attaching  
A semiconductor spacer structure comprises in order a backgrinding tape layer, a spacer adhesive layer, a semiconductor spacer layer, an optional second spacer adhesive layer, a dicing tape layer....
7170159 Low CTE substrates for use with low-k flip-chip package devices  
Disclosed are techniques that teach the replacement of the typical organic, plastic, or ceramic package substrate used in semiconductor package devices with a low-CTE package substrate. In one...
7109067 Semiconductor device and method for fabricating same  
Lands and Cu wirings are formed on surfaces of a glass epoxy substrate, and a solder mask is formed on the lands and the Cu wirings to form a chip-mounting substrate. A bottom surface of the...
7078797 Hybrid integrated circuit device  
Provided is a hybrid integrated circuit device which can more effectively stabilize a circuit configured to operate at a high speed. A hybrid integrated circuit device of the embodiment includes a...
6984886 System-on-a-chip with multi-layered metallized through-hole interconnection  
The present invention is directed to a high-performance system on a chip which uses multi-layer wiring/insulation through-hole interconnections to provide short wiring and controlled low-impedance...
6962866 System-on-a-chip with multi-layered metallized through-hole interconnection  
The present invention is directed to a high-performance system on a chip which uses multi-layer wiring/insulation through-hole interconnections to provide short wiring and controlled low-impedance...
6828002 Substrate strip with sides having flanges and recesses  
The present invention relates to a substrate strip with sides having flanges and recesses. The substrate strip is obtained by cutting a panel where a plurality of substrate strips can be arrayed....
6780681 Process of manufacturing a semiconductor device  
An insulating substrate has a plurality of semiconductor chip mounting sections arranged one by one along a predetermined direction extending from one to the other end of the substrate, and a resin...
6486003 Expandable interposer for a microelectronic package and method therefor  
A method of fabricating a microelectronic package comprising an expandable structure includes the steps of providing first and second microelectronic elements having electrically conductive parts,...
6441479 System-on-a-chip with multi-layered metallized through-hole interconnection  
The present invention is directed to a high-performance system on a clip which uses multi-layer wiring/insulation through-hole interconnections to provide short wiring and controlled low-impedance...
6153926 Semiconductor device  
A semiconductor device that be able to be manufactured in same equipment dose not depend on a number of semiconductor chips which are mounted on the semiconductor device. The semiconductor device...
5954978 Substrate, a module and a method for fastening components of the module to the substrate  
Module-forming component secured to a substrate using heat activated bonding arrangements are made by resistance heating the bonding medium, for example solder, thermal activated adhesive or...
4210885 Thin film lossy line for preventing reflections in microcircuit chip package interconnections  
Microcircuit chip packages mounted modules are connected together by lossy strip transmission lines parallel to a ground plane without termination. The transmission line segments are designed to...
Matches 1 - 29 out of 29