Matches 1 - 50 out of 150 1 2 3 >
Match Document Document Title
7462932 Manufacture of mountable capped chips  
A wafer or a portion of a wafer including capped chips such as surface acoustic wave (SAW) chips is provided with terminals by applying a terminal-bearing element such as a dielectric element with...
7462925 Method and apparatus for stacking electrical components using via to provide interconnection  
An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active...
7456494 Surface mount electronic component and process for manufacturing same  
A surface mount electronic component includes a set of a first lead terminal 2 a and a second lead terminal 3 b , a semiconductor element 6 a die-bonded to an island portion 4 a integrally...
7446400 Chip package structure and fabricating method thereof  
A chip package structure including a chip, a lead frame, first bonding wires and second bonding wires is provided. The chip has an active surface, first bonding pads and second bonding pads,...
7443013 Flexible substrate for package of die  
The present invention provides a flexible substrate for a package of a die which has an active surface and a plurality of first bond pads arranged in a form of a row and formed on the active...
7432584 Leadframe for use in a semiconductor package  
A leadframe comprises a die mounting area, a plurality of lead fingers and a metal deposit having a negative electrochemical potential with respect to a standard H 2 half cell. A semiconductor...
7425756 Semiconductor device and electronic device  
This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise...
7420265 Integrated circuit package system with integrated circuit support  
An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the...
7414307 Electronic device and pressure sensor  
An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses...
7408244 Semiconductor package and stack arrangement thereof  
A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a...
7405467 Power module package structure  
A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced...
7402462 Folded frame carrier for MOSFET BGA  
A folded frame carrier has a die attach pad (DAP) 30 and one or more folded edges 32, 33, 34, 35 . Each folded edge has one or more studs 36 and each stud has a trapezoidal tip. The folded...
7400002 MOSFET package  
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic...
7391101 Semiconductor pressure sensor  
A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The...
7378722 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device  
An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and...
7372142 Vertical conduction power electronic device package and corresponding assembling method  
A vertical conduction power electronic device package and corresponding assembly method comprising at least a metal frame suitable to house at least a plate or first semiconductor die having at...
7372133 Microelectronic package having a stiffening element and method of making same  
A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer...
7368807 Low cost method to produce high volume lead frames  
A method ( 300 ) for fabricating a lead frame ( 100 ), comprising forming a plurality of external leads ( 122 ) in a lead frame material ( 108 ), plating a metal ( 222 ) on all surfaces of the lead...
7368326 Methods and apparatus to reduce growth formations on plated conductive leads  
A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer...
7365423 Redistributed solder pads using etched lead frame  
A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which...
7354804 Method for fabricating lead frame and method of fabricating semiconductor device using the same  
A method of fabricating a lead frame for a semiconductor device. The lead frame has a lead electrically connected to a semiconductor chip within sealing resin and sealed into the sealing resin such...
7345357 High density chip scale leadframe package and method of manufacturing the package  
An integrated circuit package having a die pad with a first face and a second face, a plurality of inner leads, and a plurality of sides between the first face and the second face. The plurality of...
7345356 Optical package with double formed leadframe  
Packages for an optical integrated circuit die and a method for making such packages are disclosed. The package includes a die, a die pad, a plurality of lead fingers, and an encapsulating...
7344921 Integrated circuit device having reduced bow and method for making same  
An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The...
7339259 Semiconductor device  
A semiconductor device has an improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side...
7338841 Leadframe with encapsulant guide and method for the fabrication thereof  
A method for fabricating a leadframe with encapsulant guide is provided, including forming a die attach paddle. Leads are formed around at least portions of the die attach paddle, and encapsulant...
7332804 Semiconductor device and method of manufacturing the same  
A semiconductor device and manufacturing the semiconductor device are described. There is provided a method of manufacturing a semiconductor device including, disposing a lead frame inside an outer...
7332375 Method of making an integrated circuit package  
A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces...
7327017 Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound  
A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and...
7326594 Connecting a plurality of bond pads and/or inner leads with a single bond wire  
An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads...
7323366 Manufacturing method of a semiconductor device  
A method of making a semiconductor device including a semiconductor chip having a plurality of pads, and a lead frame having a plurality of leads. Each of the plurality of leads has a mounting...
7314820 Carrier-free semiconductor package and fabrication method thereof  
A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts...
7298026 Large die package and method for the fabrication thereof  
A method for fabricating a large die package with a leadframe having leads and a paddle is provided. An interposer is attached onto the leadframe with the interposer extending over at least a...
7288831 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof  
In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The...
7282786 Semiconductor package and process for making the same  
A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for...
7279780 Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same  
A quad flat no-lead (QFN) grid array semiconductor package and method for making the same are provided. The package includes a semiconductor die and a lead frame having a plurality of conductive...
7274088 Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof  
A flip-ship semiconductor package with a lead frame as a chip carrier is provided, wherein a plurality of leads of the lead frame are each formed with at least a dam member thereon. When a chip is...
7262440 Light emitting diode package and fabrication method thereof  
The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation...
7253514 Self-supporting connecting element for a semiconductor chip  
A connecting element for electrically connecting a semiconductor chip and a superordinate circuit board includes an elastic metal strip that is bent forming two metal limbs with flattened limb...
7250685 Etched leadframe flipchip package system  
The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the...
7242077 Leadframe with die pad  
A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the...
7239008 Semiconductor apparatus and method for fabricating the same  
A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to...
7238549 Surface-mounting semiconductor device and method of making the same  
A semiconductor device X 1 comprises: a first conductor 110 including a first terminal surface 113 a ; a second conductor 120 placed by the first conductor 110 and including a second...
7235877 Redistributed solder pads using etched lead frame  
A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which...
7227240 Semiconductor device with wire bond inductor and method  
A semiconductor device ( 10 ) includes a semiconductor die ( 20 ) and an inductor ( 30, 50 ) formed with a bonding wire ( 80 ) attached to a top surface ( 21 ) of the semiconductor die. The bonding...
7227198 Half-bridge package  
A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The...
7224049 Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same  
A method of fabricating a lead frame for a semiconductor device having a semiconductor chip resin-sealed therein. The lead frame includes a lead to be electrically connected to the semiconductor...
7205180 Process of fabricating semiconductor packages using leadframes roughened with chemical etchant  
A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and...
7196404 Motion detector and method of producing the same  
A method of producing an electronic device electrically and mechanically couples an integrated circuit to a leadframe to produce an intermediate assembly. At least a portion of the intermediate...
7193298 Lead frame  
A lead frame ( 1 ) has a first portion ( 2 ) adapted to have a semiconductor device ( 10 ) mounted thereon and a second portion ( 3 ) including a main member ( 5 ), a number of first contact...
Matches 1 - 50 out of 150 1 2 3 >