|
Match
|
Document |
Document Title |
|
|
7462888 |
Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
The temperature of a bipolar semiconductor element using a wide-gap semiconductor is raised using heating means, such as a heater, to obtain a power semiconductor device being large in controllable...
|
|
|
7462886 |
Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
The temperature of a bipolar semiconductor element using a wide-gap semiconductor is raised using heating means, such as a heater, to obtain a power semiconductor device being large in controllable...
|
|
|
7456498 |
Integrated circuit package and system interface
A method for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low...
|
|
|
7449775 |
Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion
A decoupling package stack including a circuit board, a substrate mounted on and electrically coupled to the circuit board, a semiconductor die mounted on and electrically coupled to the substrate...
|
|
|
7446408 |
Semiconductor package with heat sink
A package is provided for a semiconductor device including a semiconductor device support substrate having at least one interconnect metal therein connectible to a ground and having at least one...
|
|
|
7439601 |
Linear integrated circuit temperature sensor apparatus with adjustable gain and offset
Embodiments of the invention include a temperature sensor apparatus, method and system for providing an output voltage response that is linear to the temperature of the integrated circuit to which...
|
|
|
7439591 |
Gate layer diode method and apparatus
Method, apparatus, and article of manufacture for a diode defined by a portion of a gate layer of an integrated circuit. Illustrative, non-limiting embodiments of the invention are provided,...
|
|
|
7417315 |
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of...
|
|
|
7417312 |
Use of solder paste for heat dissipation
A circuit board includes at least one trace having at least one heat spreader disposed thereon, the heater spreader being formed of a solidified paste, such as a paste that includes a mixture of...
|
|
|
7411281 |
Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
Die-down array integrated circuit (IC) device packages with enhanced thermal, electrical, and input/output properties are presented. A die-down array IC device package includes a heat spreader...
|