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7570135 |
Piezoelectric vibrator and method for producing the same, an oscillator, an electronic unit and a wave timepiece
A method is provided for producing a piezoelectric vibrator having an airtight terminal comprised of an annular stem, a lead disposed to pass through the stem and formed of a conductive material,...
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7563647 |
Integrated circuit package system with interconnect support
An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact...
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7547581 |
Manufacturing method of a semiconductor device to suppress generation of whiskers
It is suppressed that a whisker occurs on a lead for external connection. A lead for external connection is formed of the alloy (42Alloy) of Fe and Ni, and a plating film which includes alloy of...
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7546675 |
Method and system for manufacturing a wireless communication device
A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless...
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7508054 |
Semiconductor device and a method of manufacturing the same
Means for forming a package is disclosed on which is mounted a semiconductor chip with a high-speed LSI formed thereon, using a wire bonding method. The package comprises a semiconductor chip, a...
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7503112 |
Methods for manufacturing lead frame connectors for optical transceiver modules
Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules are disclosed. The lead frame connectors are...
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7497011 |
Hoop molding method
A hoop molding method comprises forming, in the frame portions, connection portions that link, to the frame portions, at least one molded portion of the at least one bent molded portion or at least...
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7495461 |
Wafer probe
The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.
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7484291 |
Method of manufacturing a disk drive with a lead frame engaged within a host electronic unit socket
A method of manufacturing a disk drive for use with a host electronic unit (HEU). The HEU including a printed circuit board having a socket and HEU disk drive circuitry. The method includes...
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7475460 |
Method of producing an airtight terminal
A method for producing an airtight terminal having an annular stem, a lead passing through the stem and formed of a conductive material, and a filler for fixing the lead in the stem includes (1) a...
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7448129 |
Peel-off plate for an electronic-part delivery system
A peel-off device for an electronic-part delivery system has a front end portion and a recess that is indented inwardly from the front end portion, that is formed through upper and lower surfaces...
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7425470 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
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7405467 |
Power module package structure
A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced...
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7367120 |
Method for producing a solid-state imaging device
A method of manufacturing a solid-state imaging device. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer...
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7367119 |
Method for forming a reinforced tip for a probe storage device
Systems and methods in accordance with the present invention can include a tip contactable with a media. In an embodiment, the tip comprises a substantially hollow structure formed of a metal. The...
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7363704 |
RFID tag and method of manufacturing RFID tag
A method of manufacturing an RFID tag includes forming through-holes on a sheet to embed a plurality of electronic components, such as IC chips; forming a substrate by sticking a bottom plate sheet...
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7354804 |
Method for fabricating lead frame and method of fabricating semiconductor device using the same
A method of fabricating a lead frame for a semiconductor device. The lead frame has a lead electrically connected to a semiconductor chip within sealing resin and sealed into the sealing resin such...
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7350293 |
Low profile ball-grid array package for high power
A low-profile, high power ball grid array, or land grid array, device including a plastic tape having first and second surfaces, a portion of the first surface covered with an adhesive layer. First...
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7346976 |
Method for manufacturing a suspension for disc drive
The method for manufacturing a suspension for disc drive includes a process for manufacturing a semi-finished suspension product integrally including a base plate, a rigid body portion of a load...
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7339262 |
Tape circuit substrate and semiconductor apparatus employing the same
A tape circuit substrate and semiconductor apparatus employing the same, and a method for forming a tape circuit substrate may reduce or eliminate electromagnetic interference (EMI) and provide a...
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7308752 |
Method for making an optical pickup apparatus having a movable unit supported by springs attached to a fixed unit
An optical pickup apparatus is described which includes a movable unit with an objective lens, a focus servo coil for moving the moveable unit containing the objective lens in the optical-axis...
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7299546 |
Method for manufacturing an electronic module
An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer ( 1 ) and a conductive layer on the...
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7299544 |
Apparatus for separating cull of semiconductor package molding system
Disclosed is an apparatus for separating culls coupled to a lead frame when a semiconductor chip is molded. The apparatus includes a lower plate, on which culls coupled to a lead frame are placed,...
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7278202 |
Method for making overlay surface mount resistor
A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to...
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7251872 |
Method for forming a chip package
A chip package is formed which has an array of leads, wherein successive leads are staggered in all three dimensions (X, Y, and Z) relative to one another to permit a large number of leads...
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7237724 |
Smart card and method for manufacturing a smart card
A smart card and a method for manufacturing the same wherein the smart card is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components...
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7234231 |
Method of manufacturing a lead frame
A manufacturing method of an optical coupling device includes, preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in...
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7230829 |
Overmolded electronic assembly with insert molded heat sinks
An overmolded electronic assembly includes a substrate, a plurality of surface mount technology (SMT) integrated circuit (IC) chips, a plurality of heat sinks, a backplate and an overmold material....
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7228622 |
Electronic device carrier and manufacture tape
A method and machine-readable medium are described for a flexible tape constructed of a material suitable to convey electronic devices through an entire manufacturing process without removing the...
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7225537 |
Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces
Memory Cards containing Integrated Circuits and other electronic components (e.g. resistors) in a variety of form factors having high quality external surfaces of polycarbonate, synthetic paper...
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7219421 |
Method of a coating heat spreader
A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally...
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7204017 |
Manufacturing method of a modularized leadframe
A manufacturing method of a modularized leadframe, using a first mold set to contact and hold the upper surface of rows of multiple block leads, using a second mold set to contact and hold at least...
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7204010 |
Method of making a load sensor plate
A load sensor plate ( 100 ) is adapted for manufacture by stamping spaced apart openings ( 110 ) through a thin blank to define flexure beams ( 112 ) beside the openings ( 110 ); and forming the...
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7185425 |
Method for connecting printed circuit boards
By forming a terminal at a tip of a lead part of a lead frame, and by fixing this terminal and a connecting pad which was formed on an upper surface of a first printed circuit board, the lead frame...
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7181835 |
Universal clamping mechanism
A method is provided for processing a lead frame. Generally, a first surface of a lead frame base tape is placed on a first surface of the lead frame. A second surface of the lead frame base tape...
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7174627 |
Method of fabricating known good dies from packaged integrated circuits
A known good die is economically fabricated. A tested integrated circuit is provided which includes a die having a bonding location on an upper surface and a lead. An upper portion of the...
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7174626 |
Method of manufacturing a plated electronic termination
A method of making a lead finish incorporating mechanically flattening the plated coating of metal leads. This may be accomplished by mechanical means such as rolling, stamping, peening, coining,...
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7152316 |
Hybrid integrated circuit device and method of manufacturing the same
To provide a hybrid integrated circuit device in which the rear surface of a circuit board is exposed to the outside and a method of manufacturing the same. Here, leads are fixed to the surface of...
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7134311 |
Device and method for fabricating lead frame by press forming
A device for fabricating a lead frame, by press forming, provided with a die having a flat face, on which a lead frame to be fabricated by press forming is to be placed, and a concavity, which is...
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7132734 |
Microelectronic component assemblies and microelectronic component lead frame structures
The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of...
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7131192 |
Method of manufacturing printed circuit boards using miniature contact block packagings
This invention is a method of manufacturing printed circuit boards using a contact block packaging to provide and support electrical contact blocks relative to a printed circuit board panel. The...
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7127805 |
Electronic device carrier and manufacturing tape
A system and apparatus are described for a flexible tape constructed of a material suitable to convey electronic devices through an entire manufacturing process without removing the electronic...
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7127794 |
Auto-boating process
According to one embodiment of the invention, a method for auto-boating includes supporting a tape substrate having first and second end portions on a boat, sandwiching the first and second end...
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7117587 |
Method for fabricating a substrate, including a plurality of chip package substrates
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on...
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7114248 |
Method of handling an electrical component
A method of handling an electrical component is disclosed. The method includes initiating a first engagement between the electrical component and a conveyor, initiating a second engagement between...
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7112252 |
Assembly method for semiconductor die and lead frame
A LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. The lead frame has stress relief slots formed in the undersides of the lead elements...
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7107671 |
Method of processing a strip of lead frames
A method of processing a strip of lead frames is disclosed. The method includes engaging the strip with a lead frame advancement system, advancing the strip to a tooling member, and performing a...
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7103969 |
Methods and systems for forming a die package
The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep...
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7094619 |
Method of fabricating a light emitting device
A semiconductor light-emitting device has a pair of leads placed in parallel, a light-emitting element on the upper end of one lead, a bonding wire for electrically connecting the semiconductor...
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7082681 |
Methods for modifying a vertical surface mount package
A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. The stub contacts may be formed by trimming the leads of an...
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