|
Match
|
Document |
Document Title |
|
|
7616451 |
Semiconductor package substrate and method, in particular for MEMS devices
A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the...
|
|
|
7616450 |
Apparatus for inserting and ejecting an electronic enclosure within a cabinet
A cabinet includes spaces for a number of electronic enclosures, each of which has a free end from which a pair of levers extend upward and downward to teeth engaging slots within the cabinet,...
|
|
|
7613010 |
Stereoscopic electronic circuit device, and relay board and relay frame used therein
A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is...
|
|
|
7606048 |
Integrated circuit stacking system
The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The present invention can be used to advantage with packages of a variety of...
|
|
|
7606041 |
Apparatus and method for battery pack circuit board crack prevention
A circuit board apparatus of a battery pack in which tape is attached to low priced flexible printed circuit boards (FPCB) so that it is possible to prevent cracks from being generated in the FPCBs...
|
|
|
7589409 |
Stacked packages and microelectronic assemblies incorporating the same
A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and...
|
|
|
7576997 |
Backplane extension apparatus and method
A method and apparatus for adapting a backplane from one type of connector to another type of connector is disclosed. The method includes providing a backplane with a plurality of connectors, each...
|
|
|
7558073 |
Multifunctional peripheral device
A multifunctional apparatus includes a first circuit board which is installed on a low surface of a main body, receives a current from an external power source and supplies the current to other...
|
|
|
7554177 |
Attachment system incorporating a recess in a structure
An attachment system. The attachment system includes a first structure and a second structure. The first structure has a surface and a recess in the surface. The second structure is molded into the...
|
|
|
7550832 |
Stackable semiconductor package
A stackable semiconductor package includes a top package, a bottom package, an adhesive layer, a plurality of wires and a molding compound. A part of a surface of a chip of the bottom package is...
|
|
|
7545029 |
Stack microelectronic assemblies
A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface...
|
|
|
7525813 |
Semiconductor device
In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring...
|
|
|
7525811 |
Retention device for securing expansion card shields
A retention device for securing expansion card shields ( 30 ) includes a chassis ( 10 ), and a lock member ( 20 ) for securing the expansion card shields to the chassis. The chassis includes a rear...
|
|
|
7521788 |
Semiconductor module with conductive element between chip packages
A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the...
|
|
|
7511965 |
Circuit board device and manufacturing method thereof
In a circuit board device having an electronic component mounted on an electrode land on a board by reflow soldering, voids that adversely affect the solder joint in various ways are prevented from...
|
|
|
7505284 |
System for assembling electronic components of an electronic system
An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal...
|
|
|
7492604 |
Electronic module interconnection apparatus
An electronic apparatus, includes a plurality of electronic modules, each having a maximum thickness of no more than 90 microns, each comprising a substrate having a two sided edge connection...
|
|
|
7477521 |
Isolating stress on a printed circuit board
Printed circuit boards (PCB's) with edge connectors undergo bending stresses whenever the edge connectors are plugged into mating connectors. The bending stresses causes deformation of the printed...
|
|
|
7466560 |
Multilayered printed circuit board
A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to...
|
|
|
7450392 |
Cable modem device and method of assembling the same
There is discolsed a cable modem device capable of reducing unnecessary signals inputted into a circuit substrate which processes signals and signal terminals from the outside and unnecessary...
|
|
|
7435914 |
Tape substrate, tape package and flat panel display using same
A tape substrate having hole(s) formed discontinuously along a bent portion thereof and configured to dissipate stress applied to the bent portion. A tape package using the tape substrate may be...
|
|
|
7435097 |
Radial circuit board, system, and methods
The present invention relates to circuit boards with radially arrayed components. One specific embodiment is a memory circuit board with memory components, such as, for example, DRAM chips,...
|
|
|
7414312 |
Memory-module board layout for use with memory chips of different data widths
A memory module substrate printed-circuit board (PCB) has multi-type footprints and an edge connector for mating with a memory module socket on a motherboard. Two or more kinds of...
|
|
|
7408787 |
Phase change thermal interface materials including polyester resin
An embodiment of a phase change TIM of this invention comprises a polyester matrix with melting temperature near or below operating temperature (typically less than about 130° C.), thermally...
|
|
|
7400515 |
Circuit board electrode connection structure
An electrode connection structure between outer lead(s) of TCP(s), being first circuit board(s), and actuator member electrode(s) for connection to external circuitry, being second circuit...
|
|
|
7400512 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing...
|
|
|
7400511 |
Electronic component mounting structure
An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and...
|
|
|
7394665 |
LSI package provided with interface module and method of mounting the same
In a circuit module package arranged on a mounting board, a circuit module has signal input and output terminals and is mounted on an interposer. The interposer is provided with first signal...
|
|
|
7394148 |
Module having stacked chip scale semiconductor packages
Stacked CSP (chip scale package) modules include a molded first (“top”) chip scale package having a molding side and a substrate side, and a second (“bottom”) package affixed to the...
|
|
|
7372141 |
Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides
Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One...
|
|
|
7362588 |
Flying capacitor type battery voltage detector
In a flying capacitor type battery voltage detector on a circuit substrate, a large number of photo MOS switches having performance highly depending from temperature are dividedly disposed on front...
|
|
|
7355862 |
Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module
A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor...
|
|
|
7351072 |
Memory module, memory extension memory module, memory module system, and method for manufacturing a memory module
A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module...
|
|
|
7342803 |
Printed circuit board and method of manufacturing printed circuit board
A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10 . This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to...
|
|
|
7333346 |
Circuit board having test coupon and method for evaluating the circuit board
A circuit board includes: a substrate; a conductive pattern disposed on a surface of the substrate; a lower insulation layer disposed on the conductive pattern to cover the conductive pattern...
|
|
|
7307854 |
Flexible wired circuit board
A flexible wired circuit board having a fine pitch conductor wiring pattern that can be produced with a high yield rate and improved productivity, includes a first and a second flexible wired...
|
|
|
7304863 |
Integrated circuit including external electronic components with low insertion loss
An integrated circuit package can include electronic components used to enhance the performance of the integrated circuit that is part of the package. In order to reduce some adverse effects of...
|
|
|
7304857 |
Sensor node and circuit board arrangement
An electronic circuit, preferable as a sensor node, has a highly sensitive radio function and is capable of performing a low-power-consumption operation. The electronic device has a board; a...
|
|
|
7301781 |
Semiconductor module
The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor...
|
|
|
7298628 |
Power delivery to base of processor
A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the...
|
|
|
7292454 |
System and method for optimizing printed circuit boards to minimize effects of non-uniform dielectric
A system and method for minimizing the effects of non-uniform dielectric properties includes forming traces on printed circuit boards (PCB) where the fibers within the printed circuit boards are...
|
|
|
7292453 |
Bi-fold mounted printed wiring board
A mounted printed wiring board is disclosed that will allow sensors to be installed in optimal positions thereon with the same time and effort needed for one board, and allow the same to be...
|
|
|
7286366 |
Multilayer circuit board with embedded components and method of manufacture
A multilayer substrate assembly ( 80 ) includes at least one embedded component ( 52 ) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core...
|
|
|
7248482 |
Module with built-in circuit component and method for producing the same
A module with a built-in circuit component of the present invention includes an electric insulating layer, a pair of wiring layers provided on both principal planes of the electric insulating...
|
|
|
7203075 |
Screen mask
A film carrier tape for mounting electronic parts comprises an insulating film, a wiring pattern formed on a surface of the insulating film, and a solder resist layer formed by moving a squeegee...
|
|
|
7203074 |
Electronic circuit building block
Electronic Circuit Building Blocks are mechanically connected to each other to form larger circuit boards using a mechanical bridge connector. The Electronic Circuit Building Blocks include female...
|
|
|
7187558 |
Leadframe-based module DC bus design to reduce module inductance
A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are...
|
|
|
7158387 |
Film carrier tape for mounting electronic part
A film carrier tape for mounting electronic part comprises an insulating film, a wiring pattern formed on a surface of the insulating film, and a solder resist layer formed by moving a squeegee...
|
|
|
7154760 |
Power amplifier module
The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor...
|
|
|
7132746 |
Electronic assembly with solder-bonded heat sink
A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive...
|