|
Match
|
Document |
Document Title |
|
|
7287316 |
Lapping monitor device, system and method
A lapping monitor element that is juxtaposed with a magnetic transducer element having a magnetoresistance effect film to determine the lapping position upon lapping the element height of the...
|
|
|
7285146 |
Resilient abrasive article
A resilient hand-held abrasive article includes a flexible conformable backing layer having opposed first and second major surfaces, a flexible reinforcing layer affixed to at least one of the...
|
|
|
7285039 |
Tools for polishing and associated methods
Methods for making polishing tools and associated tools are disclosed. In one aspect, a method of making a polishing tool is provided. Such a method may include truing a working surface of a...
|
|
|
7285038 |
Sanding attachment for a reciprocating power tool
A sanding attachment, for use in conjunction with an existing reciprocating power tool, for sanding a rough surface of an existing object. The sanding attachment comprises a main part being an...
|
|
|
7285037 |
Systems including differential pressure application apparatus
A differential pressure application apparatus is configured to apply different amounts of pressure to different locations of a substrate, such as a semiconductor device structure. The apparatus may...
|
|
|
7285036 |
Pad assembly for electrochemical mechanical polishing
Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to...
|
|
|
7284548 |
Cutting method by wire saw and cut workpiece receiving member in wire saw
In a cutting method by a wire saw, in which a wire A at a wire array wound around work rollers 10 is made to reciprocate or travel in one direction at a high speed and numerous pieces of wafers...
|
|
|
7284460 |
Balancer
A weight 4 which is held by a weight holder 3 in a balancer has a pressing face 4 b ′ which is pressed against a guide face 12 a provided along the circumferential direction of rotation of...
|
|
|
7284316 |
Method for forming a hard bias structure in a magnetoresistive sensor
A method for forming a hard bias structure in a magnetoresistive sensor is disclosed. A magnetoresistive sensor having a soft magnetic bias layer, spacer layer, and a magnetoresistive layer, is...
|
|
|
7282074 |
Auxiliary dust collection system
An auxiliary dust collection system can be interposed between a sander or other dust producing tool and a vacuum source, e.g., shop vacuum. This auxiliary system has a cyclonic separator connected...
|
|
|
7281970 |
Composite articles and methods of making the same
Composite articles (e.g., abrasive articles (e.g., abrasive wheels and honing sticks), cutting tools, and cutting tool inserts) comprising a glass-ceramic distributed in a ceramic matrix.
|
|
|
7281969 |
Tool sharpening and compound honing jig
A holder, guide, or jig for sharpening tools is disclosed, in which the jig holds and orients a tool to be sharpened to properly align the tool on or against abrasive wheels, discs, or sharpening...
|
|
|
7281968 |
Method of manufacturing auxiliary mirror, method of manufacturing light source lamp, projector, and method of manufacturing hole opening parts
Aspects of the invention can provide a manufacturing method of a sub-mirror that can readily enhance manufacturing yield. The manufacturing method of a sub-mirror used for a light source lamp...
|
|
|
7281967 |
Machine for grinding optical lenses
The invention relates to a machine comprising a train of grinding stones ( 21 ), mounted to rotate about a first axis (A–A′), a lens support ( 15 ), provided with means ( 37 ), for rotating the...
|
|
|
7281809 |
Open lattice mirror structure and method of making same
A method of making a mirror structure includes assembling a supporting isogrid framework, assembling an isogrid back plane, interconnecting the supporting isogrid framework with the isogrid back...
|
|
|
7281537 |
Multi-station block-texture modifying system and block-spacer
Disclosed herein is a block-texture-modifying apparatus for modifying the surface texture of blocks. The apparatus comprises a support for supporting blocks thereon, a multi-station block-texture...
|
|
|
7281535 |
Saw singulation
Improved systems and methods for singulating a substrate into a plurality of integrated circuit devices are disclosed. One aspect of the invention corresponds to a fixture that holds the substrate...
|
|
|
7281317 |
Manufacturing method of flying magnetic head slider
A manufacturing method of a flying magnetic head slider includes a step of providing a substrate with a plurality of inductive write head elements formed thereon, each head element having a pair of...
|
|
|
7278911 |
Conductive polishing article for electrochemical mechanical polishing
Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive...
|
|
|
7278910 |
Wheel scraper for a floor sander
A wheel scraper for a floor sander attaches to the swivel support wheel of a floor sander and scraper debris from the support wheel in order to prevent debris accumulation on the support wheel. The...
|
|
|
7278909 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Method for manufacturing semiconductor device and polishing apparatus
In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched...
|
|
|
7278908 |
Polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular
A polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular is disclosed, which comprises a support body, to which a foam layer is attached,...
|
|
|
7278907 |
Method of adhering polishing pads and jig for adhering the same
The method of adhering polishing pads is capable of easily adhering the polishing pads without damages. The method comprises the steps of: tentatively adhering the polishing pads to polishing...
|
|
|
7278906 |
Adhesive tape and edging method using same
An adhesive tape which is to be arranged between a lens and at least one of a plurality of chucks in an edge-machining apparatus comprises an adhesive face for being in contact with the lens. A...
|
|
|
7278905 |
Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation
A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then...
|
|
|
7278904 |
Method of abrading a workpiece
A method of abrading a surface of a workpiece with a structured abrasive article in the presence of a liquid comprising water and at least one of a sulfonate or sulfate anionic surfactant.
|
|
|
7278903 |
Processing method for wafer and processing apparatus therefor
A processing method for wafers includes: a preparing step for preparing a wafer having an active device region and a reinforcing rib region. The active device region having plural devices is formed...
|
|
|
7278902 |
Enabling location specific burnishing of a disk
Various embodiments of the present invention pertain to enabling location specific burnishing of a disk. According to one embodiment, the smoothness of a disk is evaluated by gliding over a disk to...
|
|
|
7278901 |
Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film
A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided....
|
|
|
7278206 |
Method of preparing terminal board
A terminal board having a plurality of terminals on which ball electrodes are formed can be prepared efficiently and economically without having any short-circuiting between terminals when its...
|
|
|
7275981 |
Symmetrical wall sander
A disc-shaped sanding pad has a round perimeter. Centrally located in the pad is a socket. A ball, coupled to the end of a handle, is inserted into the socket, permitting the sanding pad to both...
|
|
|
7275980 |
Abrasive articles with novel structures and methods for grinding
Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade,...
|
|
|
7275979 |
Apparatus for treating edges of panels and method
An apparatus for treating edge surfaces of panels, comprises conveyor tables to displace panels in sequence, two of the conveyor tables being configured such that panels are sequentially displaced...
|
|
|
7275978 |
Hand power tool which receives its operating voltage from a power supply unit
A hand power tool is connectable to a power supply unit via a multi-wire cable including a plurality of lines for delivering an operative voltage, and the power supply unit is adjustable by an...
|
|
|
7275311 |
Apparatus and system for precise lapping of recessed and protruding elements in a workpiece
An apparatus and system for precise lapping of recessed and protruding elements in a workpiece is disclosed. According to one embodiment, a system is provided having an air bearing surface with...
|
|
|
7275306 |
Damascene method for forming write coils of magnetic heads
An improved damascene method of forming a write coil of a magnetic head. The method includes the steps of forming a hard mask layer over an insulator layer; forming a photoresist layer over the...
|
|
|
7273412 |
Abrasive wheel with improved composing structure
An abrasive wheel with improved structure comprises: an abrasive component, an adapting ring received by the combining hole in the central region of the abrasive component, two covers which are...
|
|
|
7273411 |
Polishing apparatus
A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then...
|
|
|
7273410 |
Guiding and pressing device for a belt sander
A guiding and pressing device for a belt sander includes two triangular guiding blocks or sheet-like inclined guiding blocks, which are disposed at suitable positions on a front side frame of the...
|
|
|
7273409 |
Process for forming spherical components
A process is disclosed for forming a spherical component using a centrifugal processing machine. The process includes the steps of providing a component having an initial shape with at least a...
|
|
|
7273408 |
Paired pivot arm
The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one...
|
|
|
7273407 |
Transparent polishing pad
The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an...
|
|
|
7273406 |
Glass treatment system and method
A system for abrading and scoring glass. An abrading/scoring station includes a table for supporting a large sheet of glass on a generally flat support. A first tool support moves an abrading tool...
|
|
|
7273405 |
Sintered rare earth magnetic alloy wafer and wafer surface growing machine
A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic...
|
|
|
7272883 |
Methods of forming an electrical connection in a magnetic head using a damascene process
In one illustrative example disclosed, a method for use in making a magnetic head involves forming a thermal-assist heater for the magnetic head; forming a plurality of coil layers of a write coil...
|
|
|
7271888 |
Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint...
|
|
|
7270598 |
Orbital sander
An orbital sander is provided having a number of novel features including a high speed permanent magnet DC motor having a relatively flat rpm versus torque curve. The sander includes an AC to DC...
|
|
|
7270597 |
Method and system for chemical mechanical polishing pad cleaning
In one embodiment, a method for cleaning a chemical mechanical polishing (CMP) pad is provided. The CMP pad surface has a residue thereon. Chemicals are applied onto the surface of the CMP pad and...
|
|
|
7270596 |
Chemical mechanical polishing process
A chemical mechanical polishing process includes rotating at least one of a semiconductor substrate and polishing pad relative to the other. A chemical mechanical polishing slurry is provided...
|
|
|
7270595 |
Polishing pad with oscillating path groove network
A polishing pad ( 20 ) for polishing a wafer ( 32 ) or other article, the pad having a groove network ( 60 ) configured to increase the residence time polishing medium ( 46 ) on the pad. The groove...
|