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<title>freepatentsonline.com: Adhesive bonding and miscellaneous chemical manufacture</title>
<link>http://www.freepatentsonline.com/result.html?query_txt=ccl/156%20and%20isd/11/10/2009&amp;uspat=on</link>
<description>USPTO Class 156 Adhesive bonding and miscellaneous chemical manufacture</description>
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<lastBuildDate>Tue, 10 Nov 2009 08:53:04 EST</lastBuildDate>

<item>
<title><![CDATA[Structural damage repair elements and kit]]></title>
<link>http://www.freepatentsonline.com/7615129.html</link>
<description><![CDATA[Structural damage repair elements including inserts and a structural damage repair kit is provided. The structural damage repair elements typically include two or more layers of materials having an adhesive therebetween that are subsequently compressed together. The structural damage repair kit includes a chemical molding agent, an optional jig, one or more structural damage repair elements and a sealant. Both hollow and solid elongated objects, as well as relatively flat, curved objects may be repaired with the kit. The structural damage repair elements include rods, wafers, and/or adhesive saturated inserts.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method and apparatus for fray-free textile cutting]]></title>
<link>http://www.freepatentsonline.com/7615128.html</link>
<description><![CDATA[A method and apparatus for fray-free cutting at the perimeter of an area of a textile sheet on a textile-receiving surface, including applying an anti-fray substance onto the sheet along a path at the perimeter by an anti-fray substance applicator movable along the surface as directed by a controller based on programmed information regarding the perimeter, and cutting the sheet at the perimeter by a cutter movable along the surface as directed by the controller based on the programmed information.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Methods of forming printed circuit boards]]></title>
<link>http://www.freepatentsonline.com/7615130.html</link>
<description><![CDATA[Provided are methods of forming a printed circuit board having optical functionality. The methods involve: (a) providing a first, printed circuit board substrate; (b) forming an optical waveguide structure comprising a clad and a core structure on a second substrate separate from the printed circuit board substrate, wherein the optical waveguide structure comprises a silicon-containing material; (c) separating the optical waveguide structure from the second substrate; and (d) affixing the optical waveguide structure to the printed circuit board substrate. The invention has particular applicability in the electronics and optoelectronics industries for the formation of hybrid printed circuit boards.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Plasma processing apparatus having high frequency power source with sag compensation function and plasma processing method]]></title>
<link>http://www.freepatentsonline.com/7615132.html</link>
<description><![CDATA[A plasma processing apparatus suitable for high-speed and high-definition etching is provided. By applying to a wafer chucking electrode  9  a voltage waveform in which an absolute value of high frequency voltage increases with time and switching between a positive voltage and a negative voltage occurs, a rectangular high frequency voltage is caused to be generated in the wafer  10 , with the result that the duty ratio of the rectangular high frequency voltage decreases and that the high energy ion ratio in the energy distribution of ions incident on the wafer increases. Therefore, high efficiency and high accuracy etching becomes possible, providing the advantage that the material selection ratio is improved.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Plasma etching chamber and plasma etching system using same]]></title>
<link>http://www.freepatentsonline.com/7615131.html</link>
<description><![CDATA[Disclosed is a plasma etching chamber for completely dry-cleaning a film material and particles deposited at the periphery of a wafer through plasma etching while generating plasma at the top to the bottom sides of the periphery of the wafer. A pair of top and bottom anodes facing each other is placed around the periphery of the wafer under the application of radio frequency through a cathode. Alternatively, a top cathode and a bottom anode are placed around the periphery of the wafer while facing each other and a view-ring shields the area of the cathode, the anode and the wafer from the outside. A plasma etching system includes a plurality of the above-structured etching chambers. A handler takes wafers from a plurality of cassette stands or load ports, and posture-corrects the orientation frat locations of the wafers by a wafer alignment unit. The wafers are charged into the plasma etching chambers directly or via load lock chambers. The handler takes the etched wafers from the chambers, and returns the wafers to the cassettes or the load ports directly or via the load lock chambers.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Electrostatic chuck module and cooling system]]></title>
<link>http://www.freepatentsonline.com/7615133.html</link>
<description><![CDATA[An electrostatic chuck module for a semiconductor manufacturing apparatus which can be cooled with water and in which there is no penetration leak includes an electrostatic chuck plate of alumina and a cooling plate which is bonded to the electrostatic chuck, wherein the cooling plate is formed by forging processing to a Cu-based composite material comprising Cu—W, Cu—W—Ni, Cu—Mo, or Cu—Mo—Ni. By adjusting the ratio of Cu and Ni having a great thermal expansion coefficient and W and Mo having a small thermal expansion coefficient in a Cu-based composite material, it is possible to obtain a highly thermally conductive material having the same thermal expansion coefficient as an alumina material for an electrostatic chuck. However, since such a composite material has a penetration leak, it cannot be used in a vacuum system. According to the present invention, by conducting forging processing, a penetration leak can be prevented. Also, corrosion resistance which is important for a cooling plate can be improved by applying a Ni, Cr or Cu film by plating or sputtering.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Process of producing key units wherein marking on their tops made of light-transmitting material can be completed later on]]></title>
<link>http://www.freepatentsonline.com/7616224.html</link>
<description><![CDATA[A method is provided for marking a key top made of a translucent material with a character, a symbol, or the like, and a process is provided for quickly producing an illumination key unit. The inside of a transparent plastic key top is irradiated intermittently with focused laser light having a wavelength belonging to near infrared region of 1064 nm or less, visible region or near ultraviolet region to form an aggregation of multiple fine carbonization black points and an aggregation of points whitened by fine cracks or bubbling representing a character, a symbol, or the like. After a process capable of being carried out without determining a destination has ended, production is interrupted temporarily or ended and marking is performed by irradiating the top surface of the key top with laser light upon determination of a character, a symbol, or the like, related with the destination.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Cast dielectric composite linear accelerator]]></title>
<link>http://www.freepatentsonline.com/7615942.html</link>
<description><![CDATA[A linear accelerator having cast dielectric composite layers integrally formed with conductor electrodes in a solventless fabrication process, with the cast dielectric composite preferably having a nanoparticle filler in an organic polymer such as a thermosetting resin. By incorporating this cast dielectric composite the dielectric constant of critical insulating layers of the transmission lines of the accelerator are increased while simultaneously maintaining high dielectric strengths for the accelerator.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[High modulus nonconductive adhesive useful for installing vehicle windows]]></title>
<link>http://www.freepatentsonline.com/7615167.html</link>
<description><![CDATA[The invention is a composition comprising
 a) one or more isocyanate functional polyether based prepolymers containing one or more organic based polymers dispersed therein; b) one or more isocyanate functional polyester based prepolymers which is solid at 23° C.; c) one or more polyisocyanates having a nominal functionality of about 3 or greater; d) one or more conductive carbon blacks in an amount such that the composition has a dielectric constant of about 15 or less; and e) one or more catalysts for the reaction of isocyanate moieties with hydroxyl groups, wherein the composition demonstrates upon cure a modulus of 2.0 MPa or greater at 25° C. measured according to ASTM D4065; a dielectric constant of about 15 or less; a sag of an uncured sample of less than 2 mm, a press flow viscosity of about 20 to about 50 and a storage modulus of about 5.3×10 5  Pa or greater.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Architectural resin panel with three-dimensional patterns]]></title>
<link>http://www.freepatentsonline.com/7615276.html</link>
<description><![CDATA[A decorative architectural panel can be formed using multiple image layers to create one or more three-dimensional effects in a final product. In particular, a reference image layer comprises an extruded sheet having an artistically-designed reference image formed thereon. A next image layer comprises an extruded sheet having a differently sized iteration of the artistically designed reference image. A manufacturer can place the next image layer over the reference image layer, and set the combined image layers such that the final product shows the artistically-designed image in three-dimensions. Additional image layers, such as a color layer, or a layer having embedded objects, can be combined with the stratified product for additional artistic effects.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Pulsed mass flow delivery system and method]]></title>
<link>http://www.freepatentsonline.com/7615120.html</link>
<description><![CDATA[A system for delivering a desired mass of gas, including a chamber, a first valve controlling flow into the chamber, a second valve controlling flow out of the chamber, a pressure transducer connected to the chamber, an input device for providing a desired mass to be delivered, and a controller connected to the valves, the pressure transducer and the input device. The controller is programmed to receive the desired mass from the input device, close the second valve and open the first valve, receive chamber pressure measurements from the pressure transducer, and close the inlet valve when pressure within the chamber reaches a predetermined level. The controller is then programmed to wait a predetermined waiting period to allow the gas inside the chamber to approach a state of equilibrium, then open the outlet valve at time=t 0 , and close the outlet valve at time=t* when the mass of gas discharged equals the desired mass.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Water-tight double-sided roof patch]]></title>
<link>http://www.freepatentsonline.com/7614194.html</link>
<description><![CDATA[A method for sealing joints formed by the intersection and/or overlap of roofing membranes is disclosed. The method comprises the steps of applying strips of double sided tape to roofing membranes so as to secure the membranes to one another and to fill voids created at the intersection of the membranes. Securing the membranes using double-sided tape creates a tight seal which prevents the seepage of water and debris into the joint. A roof joint patch kit is also disclosed which comprises a roll of roofing membrane and a plurality of double-sided tape strips.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method of manufacturing a magnetic slider head]]></title>
<link>http://www.freepatentsonline.com/7614137.html</link>
<description><![CDATA[Embodiments of the invention relate to manufacturing method of a magnetic head slider which flies stably even with a reduced peripheral speed resulting from a trend toward a magnetic disk having a smaller diameter. According to one embodiment, a method of manufacturing a magnetic head slider comprises forming a leading side rail surface and a trailing side rail surface, a leading stepped bearing surface and a trailing stepped bearing surface, and a negative-pressure groove surface on an air bearing surface through etching, forming a first stepped surface on the leading side rail surface through sputtering, and forming a second stepped surface by forming a carbon layer on the first stepped surface through sputtering. The first stepped surface has a first height with respect to the leading side rail surface and the second stepped surface has a second height with respect to the first stepped surface.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Cementitious boards]]></title>
<link>http://www.freepatentsonline.com/7615504.html</link>
<description><![CDATA[A cementitious board and methods of making the same are disclosed by a cementitious board including a cementitious core, a plurality of warp yarns and weft yarns and a coating applied to produce a coating weight distribution ratio of less than about 2.0:1, based upon the weight of the resinous coating of the weft yarns, over the weight of the resinous coating on the warp yarns.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

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