<?xml version="1.0" encoding="UTF-8"?>

<rss version="2.0">

<channel>
<image>
<title>freepatentsonline.com</title>
<width>141</width>
<height>131</height>
<link>http://www.freepatentsonline.com/index.html</link>
<url>http://www.freepatentsonline.com/images/logo.gif</url>
</image>

<title>freepatentsonline.com: Heat exchange</title>
<link>http://www.freepatentsonline.com/result.html?query_txt=ccl/165%20and%20isd/11/10/2009&amp;uspat=on</link>
<description>USPTO Class 165 Heat exchange</description>
<language>en-us</language>
<lastBuildDate>Thu, 12 Nov 2009 03:31:57 EST</lastBuildDate>

<item>
<title><![CDATA[Heat exchanger tube]]></title>
<link>http://www.freepatentsonline.com/7614443.html</link>
<description><![CDATA[A heat exchanger tube has an inner peripheral surface serving as an exhaust gas flow path with a flat cross-sectional shape. A thin structure is incorporated in the heat exchanger tube and has a substantially rectangular channel-shaped waveform in cross section. The corrugated fin structure has a curved surface forming waveform meandering with a predetermined wavelength in the lengthwise direction. The wave width of the channel-shaped waveform is H, the wavelength of the waveform meandering in the lengthwise direction is L and the amplitude of the waveform meandering in the lengthwise direction is A. The heat exchanger tube is formed so that H/L is set at 0.17 to 0.20 and the ration (G/H) of a gap G determined by H−A to H is set at −0.21 to 0.19.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Heat exchanger]]></title>
<link>http://www.freepatentsonline.com/7614442.html</link>
<description><![CDATA[A heat exchanger comprising two tanks, and a plurality of tubes for a medium which is to be cooled/heated are arranged in stacked, transverse rows, with the tubes arrayed to extend from the entrance to the exit side of the heat exchanger. The tubes are disposed between and transmit the medium between the tanks. Ducts between the stacked rows of the tubes for flow of a different cooling/heating medium. The ducts are arranged to run transversely to the longitudinal direction of the tubes. The opposing connection surfaces of the tanks converge in the direction of flow of the cooling/heating medium through the heat exchanger. The ducts closer to the connection surfaces are angled convergingly like the connection surfaces. Such a heat exchanger may be used, e.g. as a cooler, and in a motor vehicle.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Enhanced heat pipe cooling with MHD fluid flow]]></title>
<link>http://www.freepatentsonline.com/7614445.html</link>
<description><![CDATA[A cooling apparatus includes a heat pipe base covering a heat source; a heat sink with a plurality of heat sink fins; a plurality of heat pipes connecting the heat pipe base and the heat sink; and a magneto-hydrodynamic (MHD) pump assembly connected to the heat sink. In a method for cooling a heat source with heat pipes, magneto-hydrodynamic (MHD) fluid pipes, and a heat sink, the method includes transmitting heat from evaporating ends of the heat pipes connected to a heat source to condensing ends of the heat pipes connected to the heat sink; and circulating MHD fluid inside the MHD fluid pipes embedded in the heat sink to dissipate heat. In a method for cooling a heat sink connected to a plurality of heat pipes and containing a plurality of MHD fluid pipes, the method includes generating a plurality of magnetic fields using an array of magnets; creating an electric potential from a top surface to a bottom surface of each MHD fluid pipe using a plurality of metal films; and inducing electrically-conductive MHD fluid to circulate in the plurality of MHD fluid pipes by the plurality of magnetic fields and the electric potential.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Rapid thermal cycling device]]></title>
<link>http://www.freepatentsonline.com/7614444.html</link>
<description><![CDATA[A lid for a well plate is provided. A pin penetrates the lid and projects downwardly into a well of the well plate. An electrical charge is applied to the pin and an electrical charge of opposite polarity is applied to an electrically conductive portion of a corresponding well, generating a small flow of electrical current and corresponding electrical fields within the well. Charged materials, such as DNA, selectably are attracted to the pin and segregated from the liquid sample.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Gimballed attachment for multiple heat exchangers]]></title>
<link>http://www.freepatentsonline.com/7616444.html</link>
<description><![CDATA[One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint enables independent application of a retention force to the heat exchanger as a single-point load. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of retention force directed through the gimbal joint to each heat exchanger. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Automated no-idle heating and engine pre-heat using engine coolant]]></title>
<link>http://www.freepatentsonline.com/7614368.html</link>
<description><![CDATA[To avoid engine idling to support cabin heating, an auxiliary coolant heater can heat engine coolant and pump it through compartment heaters or the engine cooling system. The coolant flow control system provides great flexibility in selectively distributing heated coolant for heating and engine preheating.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Solar energy storage system]]></title>
<link>http://www.freepatentsonline.com/7614397.html</link>
<description><![CDATA[A method and apparatus for storing, transporting, and releasing high grade, thermodynamically useful energy for a wide variety of uses. Solar energy is collected and reflected onto a heat storage container using a three-mirror reflecting system. This invention involves a method of heating the heat storage container using a primary, secondary, and tertiary system, which has a core that is partially comprised of an aluminum alloy and a metallic shell with a higher melting point than the aluminum alloy contained within. Once heated, the storage containers can then be transported to different storage areas in order to heat secondary storage containers or can be used in processes such as cooking, powering heat engines, water heating, absorption refrigeration, or drying garbage, waste, or biomass.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Graphite heat dissipation apparatus and clamping frame for clamping graphite heat dissipation fin module]]></title>
<link>http://www.freepatentsonline.com/7616441.html</link>
<description><![CDATA[A graphite heat dissipation apparatus and a clamping frame for clamping a graphite heat dissipation fin module are provided. The graphite heat dissipation apparatus includes a graphite heat dissipation fin module and at least one clamping frame. The graphite heat dissipation fin module includes a substrate and a plurality of graphite fins which are positioned at and extend from one surface of the substrate. The clamping frame includes at least one support bracket, at least one retention plates and a frame body. The support brackets are positioned at top surface of a chassis. The frame body upwardly extends from the support brackets, and the retention plates traverse extend across the side surface of the frame body. The retention plates are used to clamp the substrate so that the graphite fins are positioned above the chassis. The graphite heat dissipation fin module is used to draw hear away from the electronic device which can be positioned below the substrate and at the surface of the chassis.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Cooling device for electrical power units of electrically operated vehicles]]></title>
<link>http://www.freepatentsonline.com/7616443.html</link>
<description><![CDATA[A cooling device for an electrical power unit of electrically operated vehicles, comprising at least one power section and at least one control section. A first cooling circuit containing a heat exchanger with a low coolant temperature is provided mainly for cooling elements of the control sections, and a further cooling circuit with a higher coolant temperature is provided mainly for cooling elements of the power sections.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Exhaust gas heat exchanger, in particular an exhaust gas cooler for exhaust gas recirculation in a motor vehicle]]></title>
<link>http://www.freepatentsonline.com/7614389.html</link>
<description><![CDATA[The invention relates to an exhaust gas heat exchanger, in particular, to an exhaust gas cooler for exhaust gas recirculation in a motor vehicle comprising heat exchanging channels ( 3 ) which are coolable by a fluid and passed through by the exhaust gas, wherein the inventive exhaust gas heat exchanger ( 1 ) is integrated into an oxidation catalyst comprising a support provided with an oxidation catalyst coating ( 6 ) in such a way a deposit ( 5 ) is formed in the channels ( 3 ).]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Cylindrical dryer having conduits for heating medium]]></title>
<link>http://www.freepatentsonline.com/7614161.html</link>
<description><![CDATA[A dryer uses conduits to carry a heating medium, such as steam, to heat the outer surface of the dryer. The volume of steam is successfully reduced to non-explosive levels and the shell need not be designed to prevent an explosion. Conduits may be formed through the shell itself or grooves may be formed on the inner surface of the shell, with the conduits retained within the grooves. Also, the conduits can be placed against the inside surface of the dryer and a material, such as zinc, can be filled in about the conduits. The material serves to both retain the conduits in place and thermally couple the conduits to the dryer to assure efficient heat transfer between the conduits and dryer. These modifications relieve the dryer from the Unfired Pressure Vessel classification to the classification of a piping assembly under ASA code regulations. This results in savings in operation safety, installation cost and operating costs due to the absence of costly inspections.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method of operating a cooling fluid system]]></title>
<link>http://www.freepatentsonline.com/7614613.html</link>
<description><![CDATA[In a gravity fed cooling tower liquid return system having a common header with a plurality of valved sub-headers, a distributive control system, risers on the sub-headers, and sensor/transmitters on the risers, some of the sensor/transmitters controlling the valves on their respective sub-headers, sensing the liquid level in each of the sub-headers, comparing the sensed liquid levels in the distributive control system, and controlling the liquid levels in the sub-headers in response to the sensed liquid levels.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Cooling arrangement]]></title>
<link>http://www.freepatentsonline.com/7614247.html</link>
<description><![CDATA[A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line and a return-flow line with at least one electronic component, which is to be cooled, on the respective printed circuit board or plug-in module. The feed line is coupled with at least one component feed line assigned to the electronic component. The return-flow line is coupled with at least one component return-flow line assigned to the electronic component. The component feed line and the component return-flow line have coupling elements attached at ends of the respective printed circuit board or plug-in module which, together with the counter coupling elements of the feed line and the return-flow line attached at the end of the housing, form a coupling connection, which is releasable.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Vibration damping mechanism and electronic device having the damping mechanism]]></title>
<link>http://www.freepatentsonline.com/7616437.html</link>
<description><![CDATA[A vibration damping mechanism includes a frame, cushioning members, a heat sink, and fastening members. The frame has a base plate and supporting arms disposed on the base plate. Each cushioning member is disposed on a respective one of the supporting arms, and has a through hole. The heat sink supports a hard disk thereon such that the hard disk lies flat against and is secured on the heat sink, and has a plurality of fastening holes. Each fastening member extends through the respective through hole and threadedly engages the respective fastening hole such that the heat sink is suspended on the supporting arms and abuts against the cushioning members. Thus, the area of contact between the heat sink and the hard disk is increased to enhance the heat transfer efficiency, and the cushioning members provide the heat sink and the hard disk with a cushioning effect.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Power electronic module cooling system and method]]></title>
<link>http://www.freepatentsonline.com/7616442.html</link>
<description><![CDATA[An improved cooling mechanism for a power electronics device is provided. More specifically, a cooling mechanism is provided wherein an air directing structure with a finite air-flow resistance is deployed in a cooling channel adjacent to a heatsink in a first cooling zone, such that some portion of the cooling air is forced through the heatsink while the rest of the cooling air bypasses the heatsink to provide additional cooling air to a second cooling zone. Additionally, the air-flow resistance of the air directing structure can be chosen so that the fan operates at its optimal point (maximum power input to the air).]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Structure and method for efficient thermal dissipation in an electronic assembly]]></title>
<link>http://www.freepatentsonline.com/7616445.html</link>
<description><![CDATA[One embodiment of the present invention sets forth an electronic assembly, which comprises a printed circuit board having at least one opening, an electronic component mounted on a first side of the printed circuit board, and a thermal dissipation structure including at least one heat sink having a first surface and a second surface. The first surface includes a first region coupled with a surface of the electronic component, and one or more second region provided with at least a heat dissipating member that is exposed through the opening on a second side of the printed circuit board.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

</channel>
</rss>
