<?xml version="1.0" encoding="UTF-8"?>

<rss version="2.0">

<channel>
<image>
<title>freepatentsonline.com</title>
<width>141</width>
<height>131</height>
<link>http://www.freepatentsonline.com/index.html</link>
<url>http://www.freepatentsonline.com/images/logo.gif</url>
</image>

<title>freepatentsonline.com: Electricity: measuring and testing</title>
<link>http://www.freepatentsonline.com/result.html?query_txt=ccl/324%20and%20isd/11/10/2009&amp;uspat=on</link>
<description>USPTO Class 324 Electricity: measuring and testing</description>
<language>en-us</language>
<lastBuildDate>Tue, 10 Nov 2009 08:53:08 EST</lastBuildDate>

<item>
<title><![CDATA[Simultaneous MR-excitation of multiple nuclei with a single RF amplifier]]></title>
<link>http://www.freepatentsonline.com/7615997.html</link>
<description><![CDATA[A medical imaging system ( 2 ) excites multiple nuclei through a single RF amplifier ( 24 ). The medical imaging system ( 2 ) includes a magnet ( 10 ) that generates a main magnetic field (Bo) in an examination region. A gradient coil ( 14 ) superimposes magnetic field gradients (G) on the main magnetic field Bo. At least one transmitter ( 28 ) generates multi-nuclei excitation pulses associated with at least two different isotopes and two different frequency spectra. The single amplifier ( 24 ) sends the multi-nuclei excitation pulses to a RF coil ( 18, 20 ) for application to the examination region.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method and circuit arrangement for operating multi-channel transmit/receive antenna devices]]></title>
<link>http://www.freepatentsonline.com/7615999.html</link>
<description><![CDATA[Methods and circuit arrangements for operating a multi-channel transmit/receive antenna device or arrangement, especially for use in a magnetic resonance imaging (MRI) system, are disclosed by which RF amplifiers can be used to their full peak power capability without running the risk that the RF amplifier is damaged due to excessive reflected power at its output. Furthermore by evaluating certain forward and reflected power signals patient safety is achieved with respect to monitoring the limits of the specific absorption rate.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Ultra low output impedance RF power amplifier for parallel excitation]]></title>
<link>http://www.freepatentsonline.com/7616000.html</link>
<description><![CDATA[An ultra low output impedance RF power amplifier for driving a multiple transmit coil Magnetic Resonance Imaging (MRI) system is described, comprising an output matching network with high power MOSFET operatively coupled to at least one transmit coil in the MRI system for a desired output power and impedance. This invention also describes a method for achieving decoupling using the RF power amplifier to drive at least one transmit coil.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Backplane tester and method of use]]></title>
<link>http://www.freepatentsonline.com/7616004.html</link>
<description><![CDATA[The present invention can be generally described as a backplane test device that provides the possible flexibility of being operationally resident on a standard card form factor, and thereby, potentially able to provide a testing capability that does not require the use of hardware or software not residing on the card form factor. Moveover, since the test device may be operationally inserted into a backplane, the present invention may be effectively used in a variety of environments including, but not limited to, those constrained by space considerations, and/or to those that are subject to vibrations due to their operational nature. This may provide a technician with greater flexibility, and could possibly allow a backplane to be tested, and possibly repaired, while the platform is operational.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Digital auto balance bridge]]></title>
<link>http://www.freepatentsonline.com/7616008.html</link>
<description><![CDATA[An AC impedance measurement system is used for measuring the impedance of a DUT. A measured voltage is applied to a first DUT terminal by a first digital to analog converter, the voltage appearing at the second terminal of the DUT is monitored through an analog to digital converter and forced by a second digital to analog converter to a desired negligible value, and a digital controller determines the impedance of the DUT from the measured voltage and the current necessary to force the voltage appearing at the second terminal to the desired negligible value.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method for microwave measurement, measuring device and oscillator]]></title>
<link>http://www.freepatentsonline.com/7616009.html</link>
<description><![CDATA[An object to be measured is measured using microwave radiation. Oscillation energy is generated by means of a feedback coupled active unit. The solution involves generating resonance into at least one oscillator, each oscillator comprising at least one open resonator, each resonator being coupled to at least one active unit, by using the object to be measured as a functional part of the resonator, the object to be measured causing a resonance frequency dependent on the location of a surface of the object to be measured to be generated in each oscillator. A measurement part determines at least one characteristic of the object to be measured on the basis of the resonance frequency of each oscillator.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Line impedance measurement method and system]]></title>
<link>http://www.freepatentsonline.com/7616010.html</link>
<description><![CDATA[A technique is disclosed for determining capacitive, inductive, and resistive components of power line impedance. A measurement circuit switches a burden resistor between power line conductors to cause a droop in a voltage waveform. The voltage waveform is sampled prior to inclusion of the resistor in the circuit, as well as after to identify the droop. The short circuit between the power lines is then removed by opening the circuit and a first effective capacitance in the test circuitry causes a resonant ring due to the inductive component of the power line impedance. The process is repeated a second time with a second effective load capacitance enabled in the test circuitry to cause a second resonant ring. Based upon the frequency of the rings and the voltage measurements, the capacitive, inductive, and resistive components of power line impedance can be computed.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Wafer type probe card, method for fabricating the same, and semiconductor test apparatus having the same]]></title>
<link>http://www.freepatentsonline.com/7616015.html</link>
<description><![CDATA[Example embodiments may provide a wafer type probe card, a method of fabricating a wafer type probe card, and/or a semiconductor test apparatus having the wafer type probe card. The wafer type probe card may include a semiconductor and a plurality of probing chips. The semiconductor substrate may include a plurality of probing area each including a first surface and/or a second surface opposite to the first surface. Each of the plurality of probing chips may include a plurality of conductive first pads arranged in the first surface of each of the plurality of probing areas and/or a plurality of conductive second pads arranged in the second surface of each the plurality of probing chips to be respectively connected to the first pads.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Low profile electronic assembly test fixtures]]></title>
<link>http://www.freepatentsonline.com/7616019.html</link>
<description><![CDATA[Low profile printed circuit board assembly test fixtures and methods are disclosed, the fixtures mountable at a tester having a plurality of conductive interface contacts. The fixture includes a low profile mount defined by a frame having an interface bed at one end and a dynamic plate movably positioned at an opposite end thereof, a chamber being thereby defined and having an opening for evacuating air therefrom to effect movement of the plate. A plurality of conductive terminals extend through the interface bed, each of the terminals having a node at one end positioned at the bottom surface of the bed and corresponding to the position of one of the conductive interface contacts of the tester. A plurality of conductive probes in the chamber are secured at the top surface of the bed, are coupled to the terminals, and extend through the plate. The electronic assembly is selectively positioned atop the plate for probe access.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Circuit and method for detecting skew of transistors in a semiconductor device]]></title>
<link>http://www.freepatentsonline.com/7616022.html</link>
<description><![CDATA[A circuit and method for easily detecting skew of a transistor within a semiconductor device are provided. The circuit for detecting the skew of the transistor includes a linear voltage generating unit for outputting a linear voltage by using a first supply voltage, a first attenuation unit for reducing variation width of the linear voltage according to the performance of the transistor, a saturation voltage generating unit for outputting a saturation voltage by using a second supply voltage, and a comparison unit for comparing an output of the first attenuation unit and the saturation voltage.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method and apparatus for DC integrated current sensor]]></title>
<link>http://www.freepatentsonline.com/7615989.html</link>
<description><![CDATA[Integrated current sensors are used in DC electric power systems. An integrated current sensor ( 200 B) according to one embodiment comprises: a DC inductor ( 111 B) including a resistive component and an inductive component, wherein a DC current passes through the DC inductor ( 111 B); an integrator circuit ( 161 ), the integrator circuit ( 161 ) receiving a voltage associated with the DC inductor ( 111 B); and a feedback system operationally connected to the DC inductor ( 111 B) and to the integrator circuit ( 161 ), to subtract a voltage associated with the resistive component and obtain a voltage associated with the inductive component.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Detection apparatus for a capacitive proximity sensor]]></title>
<link>http://www.freepatentsonline.com/7616011.html</link>
<description><![CDATA[A switched capacitance detection circuit is responsive to changes in the fringing capacitance of a capacitive proximity sensor having at least one capacitive sensor element. In cases where the sensor has a single sensor element, the switching frequency of the detection circuit is controlled to maintain measurement accuracy in the presence of sensor moisture while minimizing power consumption and electromagnetic radiation. In cases where the sensor has multiple sensor elements, the capacitance values for each sensor element are differenced, absolute-valued and summed to form an output in which common-mode effects due to sensor moisture, temperature and sensor aging are canceled out.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Micromechanical positional state sensing apparatus method and system]]></title>
<link>http://www.freepatentsonline.com/7616013.html</link>
<description><![CDATA[A micromechanical device may include one or more piezoresistive elements whose electrical resistance changes in response to externally or internally induced strain. The present invention leverages the piezoresistive properties of such devices to sense the positional state of the device. A sensing circuit may be integrated into the device that senses an electrical resistance of at least a portion of the micromechanical device and provides information regarding the positional state of the micromechanical device. The micromechanical device may be a compliant device that includes relatively flexible members such as mechanical beams or ribbons. The positional states may be continuous positional states (such as the position of an actuator) or discreet positional states (such as the positional state of a bistable memory device). In certain embodiments, the micromechanical device is a threshold detector that latches to a particular stable configuration when an applied force exceeds a selected value.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Probe card assembly and kit]]></title>
<link>http://www.freepatentsonline.com/7616016.html</link>
<description><![CDATA[In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Temperature detection function-incorporating current sensor]]></title>
<link>http://www.freepatentsonline.com/7615986.html</link>
<description><![CDATA[A temperature detection function-incorporating current sensor includes a Hall IC, connector terminals for respectively outputting signals, detected by the Hall IC, to the exterior. The Hall IC includes a magnetism detection portion for detecting a magnitude of a magnetic field, a temperature detection portion for detecting an ambient temperature, and a temperature compensation portion for correcting an error of the magnetism detection portion due to temperature dependency based on the temperature detected by the temperature detection portion. The detection signal of the magnetism detection portion, corrected with respect to the error, and the temperature signal detected by the temperature detection portion are outputted via the connector terminals to the exterior. In this current sensor, it is not necessary to provide an additional temperature detection part, and also it is not necessary to effect an operation for connecting such a part to a board. Therefore, the product can be formed into a compact design and a low-cost design, and can be easily assembled.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Device for determining electrical variables]]></title>
<link>http://www.freepatentsonline.com/7615987.html</link>
<description><![CDATA[A device for determining electrical variables, having a housing and an electrical main conductor, which is provided for conducting a load current, and which has a measuring section, having an electrical evaluation unit which is connected to the electrical main conductor in an electrically conductive manner, the measuring section being directly sealed and held by the housing, which is developed as an injection molded housing.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Wide range current sensing method and system]]></title>
<link>http://www.freepatentsonline.com/7615988.html</link>
<description><![CDATA[A current measurement technique is disclosed in which a family of transformer coils having the same number of turns and the same winding resistance may be associated an active circuit for presenting a burden resistance of substantially zero value. The impedance of the coils will vary with their window size, and the active circuitry will reduce the burden resistance accordingly so that reductions and impedance do not result in introducing additional error into measurements. The circuitry may be used for measuring current in single conductors or in multiple conductors passing through the transformer coil, such as for ground fault measurement, monitoring and control.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method and apparatus for actively controlling quench protection of a superconducting magnet]]></title>
<link>http://www.freepatentsonline.com/7615998.html</link>
<description><![CDATA[A method and apparatus for actively controlling quench protection of a superconducting magnet includes a magnetic resonance imaging (MRI) system and a computer readable storage medium having stored thereon a computer program comprising instructions which when executed by a computer cause the computer to detect a quench condition of the superconducting magnet. The instructions also cause the computer to actively control a quench protection system of the superconducting magnet in response to the detected quench condition.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method and apparatus for borehole wall resistivity imaging in the presence of conductive mud and rugose borehole]]></title>
<link>http://www.freepatentsonline.com/7616001.html</link>
<description><![CDATA[A resistivity imaging tool is used in a borehole having a conductive fluid. Second differences between axially spaced apart electrodes are used in the imaging. A calibration compensates for the effects of borehole rugosity.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method for determining deterioration of accumulator battery, method for measuring internal impedance of secondary battery, equipment for measuring internal impedance of secondary battery, equipment for determining deterioration of secondary battery, and power supply system]]></title>
<link>http://www.freepatentsonline.com/7616003.html</link>
<description><![CDATA[A method for determining the deterioration of an accumulator battery, hooked up with loads in a system, based on the result of measuring internal resistances of an accumulator battery, the method including predetermining a temperature at which the deterioration of the accumulator battery is determined, calculating temperature correction coefficients, predetermining resistance-voltage conversion factors, measuring the internal resistances and temperature of the accumulator battery, converting the measured internal resistance values into the internal resistance values, converting the internal resistance values at the specified temperature into the terminal discharge voltage values and determining whether the accumulator battery is deteriorated or not by means of comparison of the terminal discharge voltage values.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Systems, methods, and apparatus for measuring capacitance in a stator component]]></title>
<link>http://www.freepatentsonline.com/7616012.html</link>
<description><![CDATA[Embodiments of the invention can provide systems, methods, and apparatus for providing a capacitance paddle for measuring capacitance in a stator component such as a stator bar. In one embodiment, a system for measuring capacitance can include an output device operable to measure capacitance in an object. Furthermore, the system can include at least three contacts operable to mount to the object to be sensed. In addition, the system can include at least one conductive material operable to mount to the object to be sensed. Moreover, the system can include a compressible material adjacent to at least some of the at least three contacts and the at least one conductive material, wherein the compressible material can be compressed to permit the contacts to simultaneously contact the object to be sensed, and wherein the output device can output a measure of capacitance associated with the object.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Integrated circuit probing apparatus having a temperature-adjusting mechanism]]></title>
<link>http://www.freepatentsonline.com/7616018.html</link>
<description><![CDATA[A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Probe pad, substrate having a semiconductor device, method of testing a semiconductor device and tester for testing a semiconductor device]]></title>
<link>http://www.freepatentsonline.com/7616020.html</link>
<description><![CDATA[In an embodiment, a semiconductor device is tested using a probe pad that includes a probing region with which a probe needle makes contact, and a sensing region bordering an edge of the probing region. Electrical signals are applied, and measured results indicate the probe needle's location relative to a test position on the semiconductor device.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method and device for determining an operational lifetime of an integrated circuit device]]></title>
<link>http://www.freepatentsonline.com/7616021.html</link>
<description><![CDATA[An integrated circuit device includes a degradable test structure, a first external interface pin and a second external interface pin, a first conductive path coupling a first node of the degradable test structure and the first external interface pin, and a second conductive path coupling a second node of the degradable test structure and the second external interface pin. Another integrated circuit device includes a non-volatile memory device, a counter comprising an input configured to receive a first clock signal and an output to provide a count value, and control logic configured to store the count value of the counter in the non-volatile memory, whereby the non-volatile memory is externally accessible.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method of detecting a malfunction of an encoder for a vehicle drive system]]></title>
<link>http://www.freepatentsonline.com/7616023.html</link>
<description><![CDATA[A method of detecting a malfunction of an encoder used in a vehicle drive system includes determining an error of a motor speed based on an estimated motor speed, wherein the estimated motor speed is a function of measured current over a predetermined interval of time. The method further includes determining a maximum allowable error of the motor speed at the measured current. Yet further, the method includes comparing the error of the motor speed with the maximum allowable error of the motor speed, thereby detecting the malfunction of the encoder.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Probe for measuring characteristics of an excitation current of a plasma, and associated plasma reactor]]></title>
<link>http://www.freepatentsonline.com/7615985.html</link>
<description><![CDATA[A probe for measuring electrical characteristics of an excitation current of a plasma is provided. The probe is mounted on a conductive line that includes an inner conductor and an outer conductor. The probe includes a current sensor and a voltage sensor. The current sensor includes a groove formed in the ground of one of the conductors in order to form a detour for the current flowing through the conductor, and a point for measuring electric voltage between a ground connected to the conductor and a point of the groove. The current sensor thus is able to measure a voltage proportional to the first time derivative of intensity (I plasma ) of the excitation current. The voltage sensor is a shunt sensor capable of measuring a voltage proportional to the first time derivative of the voltage (V plasma ) of the excitation current. A plasma reactor including a probe of the aforementioned type is also provided.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Apparatus and method for detecting electronic device testing socket]]></title>
<link>http://www.freepatentsonline.com/7615992.html</link>
<description><![CDATA[An apparatus for detecting an electronic device testing socket including a testing base, a detecting circuit board, a depth gauge, and a conductive pressing block is provided. The detecting circuit board disposed on the testing base has a carrying surface for carrying an electronic device testing socket. The electronic device testing socket includes a plurality of pin units, and each of the pin units includes an S-shaped pin and a pair of elastic rods accommodated within recesses thereof. The depth gauge disposed on the testing base presses against a top surface of the conductive pressing block, and presses with a bottom surface thereof against the electronic device testing socket. The depth gauge is adapted to adjust a distance between the top surface of the conductive pressing block and the carrying surface. The detecting circuit board is electrically connected to the pin units for detecting the status of the pin units.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Magnetic line-type position-angle detecting device]]></title>
<link>http://www.freepatentsonline.com/7615993.html</link>
<description><![CDATA[To provide a magnetic line-type position-angle detecting device capable of detecting an absolute position on a non-contact basis and with high resolution and inexpensive construction, the magnetic line-type position-angle detecting device includes a magnetic line sensor  1  having a plurality of magnetic sensor elements  1 a  arranged in line, and a magnetic generating element  2  confronting the magnetic line sensor and movable in a direction conforming to the line of the magnetic sensor elements  1 a . The magnetic sensor elements  1 a  of the magnetic line sensor  1  are sequentially selected by a scanning circuit  3 , a signal from the selected sensor element  1 a  is processed into a digital signal through an amplifier  4 , and an analog-to-digital converting circuit  5 . By a calculation processing circuit  6 , a distribution of magnetic fields applied to the magnetic line sensor  1  are measured to calculate the position and/or angle of the magnetic generating element  2.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Magnetoresistive speed sensor]]></title>
<link>http://www.freepatentsonline.com/7615994.html</link>
<description><![CDATA[Consistent with an example embodiment, there is a magnetoresistive speed sensor with a permanent magnet and a sensor for a magnetic field for detecting the speed of an object rotating about an x-axis. The magnetoresistive speed sensor is equipped with a measuring direction, in which an external magnetic interference field does not influence the measurement result. The measuring direction is aligned parallel with an x-direction and two sensors are disposed with displacement from one another and normal to the measuring direction.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Loadboard enhancements for automated test equipment]]></title>
<link>http://www.freepatentsonline.com/7615990.html</link>
<description><![CDATA[An enhanced loadboard and method for enhanced automated test equipment (ATE) signaling. More specifically, embodiments provide an effective mechanism for reducing signal degradation and error interjection by replacing one or more relays with signal splitters for directing signals between one or more pins of a coupled ATE instrument, where the signal splitters reduce loadboard size and operating cost.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Thin film device for detection of physical quantities]]></title>
<link>http://www.freepatentsonline.com/7615995.html</link>
<description><![CDATA[A thin-film device for detecting the variation of intensity of physical quantities, in particular a magnetic field, in a continuous way, comprises an electrical circuit including one or more sensitive elements, which are designed to vary their own electrical resistance as a function of the intensity of a physical quantity to be detected. One or more of the sensitive elements comprise at least one nanoconstriction, and the nanoconstriction comprises at least two pads made of magnetic material, associated to which are respective magnetizations oriented in directions substantially opposite to one another and connected through a nanochannel. The nanochannel is able to set up a domain wall that determines the electrical resistance of the nanoconstriction as a function of the position, with respect to the nanochannel, of the domain wall formed in the sensor device. At least one cross section of the nanochannel is configured so as to present a variable extension along one or more axes as a function of different values of the physical quantity to be detected.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method and system for electrolyzer diagnosis based on curve fitting analysis and efficiency optimization]]></title>
<link>http://www.freepatentsonline.com/7616006.html</link>
<description><![CDATA[The present invention provides a method and system for electrolyzer diagnosis based on curve fitting analysis and efficiency optimization. The present invention relates to monitoring the electrochemical cell components by using curve fitting and estimating the overall electrolyzer performance by using predictive models. The system according to the present invention includes an extraction unit for selecting suitable operation zones, a filtering unit, a curve fitting unit performing linear or non-linear regression by using user-defined equations applied to current-voltage data points and a curve fitting goodness analysis unit. The zones are defined as start-up zones, shutdown zones and load change zones. The system further includes a curve fitting parameters characterization unit for classifying curve fitting parameters by respect to the electrolyzer cells components technology and reference values, and a characterization database for storing fitting coefficients and their characterization.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Pulsed I-V measurement method and apparatus]]></title>
<link>http://www.freepatentsonline.com/7616014.html</link>
<description><![CDATA[A method and apparatus for measuring a pulsed I-V characteristic of a DUT that has a signal terminal and a return terminal includes connecting a pulse unit between the signal and return terminals, the pulse unit having a pulse source and a pulsed current measuring device; pulsing the signal terminal with the pulse unit; measuring a pulsed current through the signal terminal with the current measuring device in response to the pulsing; and outputting, storing, displaying, or otherwise using the current measurement.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method for measuring analog channel resistance of a semiconductor device having a gate, a source, a drain, a drain sense and a source sense]]></title>
<link>http://www.freepatentsonline.com/7615991.html</link>
<description><![CDATA[A semiconductor device and a method for measuring an analog channel resistance thereof are provided. The semiconductor device includes a substrate, a gate insulating layer and a gate formed on the substrate, a source and a drain formed in the substrate and at both sides of the gate, a source sense connected to the source, and a drain sense connected to the drain.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Battery management system and apparatus with anomaly reporting]]></title>
<link>http://www.freepatentsonline.com/7616002.html</link>
<description><![CDATA[The invention relates to the management of large stationary batteries. The invention is a comprehensive process for the management of stationary batteries that are used for backup power and are deployed in widely dispersed locations. The OMS™ (Optimization Management System) solution is comprised of Mega-Tags (preferably serialized bar-coded identification labels), a battery testing and data acquisition device, and web-based software. The OMS™ system employs algorithmic testing to determine whether a particular battery unit needs to be replaced or whether it can be advantageously redeployed. It also determines whether a particular deployment location contains anomalous readings, signifying potential problems with either the batteries themselves or possibly with other electrical equipment at the location. These components work together to provide a platform for managing a large number of perishable, expensive, and geographically dispersed assets.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Device, method, program, and recording medium for error factor measurement, and output correction device and reflection coefficient measurement device provided with the device for error factor measurement]]></title>
<link>http://www.freepatentsonline.com/7616007.html</link>
<description><![CDATA[There is provided an error factor measurement device for measuring an error factor in a switch branch signal source including a signal source and a switch, and the error factor measurement device includes a reference error factor component recording unit which records respective components E 12 a , E 21 a  of a frequency tracking error factor when a predetermined output terminal is connected to a signal source, a derived error factor product recording unit which records an error factor product E 12 b ×E 21 b  which is a product of respective components of a frequency tracking error factor when respective multiple output terminals other than predetermined output terminal are connected to the signal source, an error factor ratio deriving unit which derives an error factor ratio E 21 a /E 12 a , and a frequency tracking error factor deriving unit which derives E 12 b , E 21 b  based on the error factor product and the error factor ratio, where E 21 a /E 12 a =E 21 b /E 12 b  holds.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Corrective device protection]]></title>
<link>http://www.freepatentsonline.com/7616005.html</link>
<description><![CDATA[A control system for an electrical power system includes an electrical corrective device, a voltage measuring device coupled to each phase of the electric power system, a current measuring device connected between each phase of the electric power system and the electrical corrective device, and a protective device connected to outputs of the voltage measuring device and the current measuring device. The protective device includes a controller configured to detect an imbalance using the measured voltages and currents output from the voltage measuring device and the current measuring device without using or independently of other recent voltage or current measurements for other points in the electrical corrective device and independently of a neutral-ground measurement at the electrical corrective device.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Examination method for CPP-type magnetoresistance effect element having two free layers]]></title>
<link>http://www.freepatentsonline.com/7615996.html</link>
<description><![CDATA[An examination method is structured, with respect to a magnetization direction of an orthogonalizing bias function part formed on a posterior part of an magnetoresistance (MR) effect element, of changing the magnetization direction of the orthogonalizing bias function part between a first magnetization forming mode, wherein the magnetization direction is from the anterior side of the element to the posterior side thereof, and a second magnetization forming mode, wherein the magnetization direction is from the posterior side of the element to the anterior side thereof, measuring the output waveform of the element in response to an external magnetic field for each magnetization forming mode and checking the state of the output waveforms of both modes in order to examine whether or not the magnetization directions of the first magnetic layer and the second magnetic layer, both of which functions as free layers, are antiparallel to each other in the track width direction before the orthogonalizing bias function part starts functioning. With the structure, it is realized to easily examine whether or not the magnetization directions of two free layers have surely been made antiparallel to each other before operating the orthogonalizing bias function part of an element.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Self-test circuit for high-definition multimedia interface integrated circuits]]></title>
<link>http://www.freepatentsonline.com/7617064.html</link>
<description><![CDATA[A high-definition multimedia interface circuit uses a high-definition multimedia interface encoder to produce a plurality of channels of data. An output circuit, connected to the high-definition multimedia interface encoder, produces a plurality of channels of high frequency data from the data produced by the high-definition multimedia interface encoder. A multiplexer selects a channel for sampling, and a capacitive coupler capacitively couples the multiplexer to a sampling circuit. The sampling circuit produces sampled data corresponding to the high frequency data having a clock rate less than a clock rate of the high frequency data. A test circuit compares the sampled data with the data produced by the high-definition multimedia interface encoder.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Probe station thermal chuck with shielding for capacitive current]]></title>
<link>http://www.freepatentsonline.com/7616017.html</link>
<description><![CDATA[To reduce the time to make measurements and the noise in measurements obtained by probing a device supported on surface of a thermal chuck in a probe station, a conductive member is arranged to intercept current coupling the thermal unit of the chuck to the surface supporting the device. The conductive member is capacitively coupled to the thermal unit but free of direct electrical connection thereto.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method of creating contour structures to highlight inspection region]]></title>
<link>http://www.freepatentsonline.com/7614147.html</link>
<description><![CDATA[An integrated circuit has a wiring layer below an insulator layer. A pad comprises a conductive material that is on the insulator layer. The pad has a wirebond connection region and a probe pad region. An inspection mark is between the wirebond connection region and the probe pad region. The inspection mark comprises an opening in the insulator layer that is filled with the conductive material. In addition, a contact that is through the insulator layer is adapted to electrically connect the conductor wire in the wiring layer to the pad. The contact is formed of the same conductive material used for the pad and the inspection mark.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Antitheft system]]></title>
<link>http://www.freepatentsonline.com/7616100.html</link>
<description><![CDATA[An antitheft system for use in a vehicle includes an angle sensor for outputting a signal that represents a body angle of the vehicle, an angle variation determination unit for determining an angle variation of the body angle at a predetermined interval based on the signal outputted from the angle sensor, a theft detection unit for determining whether the vehicle is in a theft condition based on a comparison of the angle variation with a predetermined value, and a temperature sensor for sensing temperature of the angle sensor. The angle variation determination unit compensates the signal from the angle sensor based on the temperature of the angle sensor sensed by the temperature sensor before determining the angle variation.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[System and method for detecting detector masking]]></title>
<link>http://www.freepatentsonline.com/7616109.html</link>
<description><![CDATA[A system and method is provided for indicating a masking event using transmission wiring delegated for indicating intrusion and tampering events. The method of indicating a masking event utilizes measurable changes in resistance to indicate the current masking state of a detector. When a detector is not masked, a first resistance value is measurable on the transmission wiring, while when a detector is masked, a second resistance value is measurable on the transmission wiring. The transmission wiring connects the detector to a control unit that executes a security-related response based on the value of the measured resistance.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Power supply method for semiconductor integrated circuit in test and CAD system for semiconductor integrated circuit]]></title>
<link>http://www.freepatentsonline.com/7617463.html</link>
<description><![CDATA[In a power supply port decision step, first, a required minimum number of power supply ports for use in a test is found based on power consumption information and the required minimum number of power bumps out of plural power bumps are decided as the power supply ports for use in the test. Then, processing is repeatedly performed until neither a voltage drop violation nor a current density violation is detected by a power mesh analysis. The processing consists of additionally deciding, as the power supply port for use in the test, a power bump corresponding to a place where the voltage drop violation occurs when the violation is detected by the power mesh analysis, and of modifying a layout of a place where the current density violation occurs when the violation is detected by the power mesh analysis.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method and apparatus of estimating state of health of battery]]></title>
<link>http://www.freepatentsonline.com/7615967.html</link>
<description><![CDATA[Disclosed is a method and apparatus of estimating a state of health (SOH) of a battery using internal resistance, which has been found to act as a parameter exerting the greatest influence on the SOH of the battery. The method comprises the steps of: storing an SOH estimation table constructing SOH values corresponding to various values of internal resistance according to temperature and a state of charge (SOC) in a memory; performing measurement of the temperature and estimation of the SOC of the battery when a request is made to estimate the SOH; detecting the internal resistance value of the battery; and reading the SOH values corresponding to the measured temperature, the estimated SOC of the battery, and the detected internal resistance value of the battery from the SOH estimation table.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Semiconductor wafer and semiconductor device, and method for manufacturing same]]></title>
<link>http://www.freepatentsonline.com/7615781.html</link>
<description><![CDATA[There is a room for improvement in conventional semiconductor devices in terms of reducing the chip area. A semiconductor device  1  comprises an evaluation transistor  10  (first characteristic evaluation device), an evaluation transistor (second characteristic evaluation device), measurement pads  30  (first measurement pads) and measurement pads  40  (second measurement pads). The measurement pad  30  and the measurement pad  40  are provided in different layers in the interconnect layer.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Ignition apparatus for internal combustion engine]]></title>
<link>http://www.freepatentsonline.com/7617040.html</link>
<description><![CDATA[An ignition apparatus which allows for an accurate diagnosis of a spark plug in an internal combustion engine provided with plural spark plugs for each cylinder is provided for an internal combustion engine. The ignition apparatus is for an internal combustion engine provided with plural spark plugs for each cylinder, and includes an input port which receives fail signals S 3  and S 4  generated corresponding to each of the plural spark plugs for diagnosis of the spark plugs. An input timing of the fail signal to the input port is made different for each of the plural fail signals. Ignition timings S 1,  S 2  of the plural spark plugs are set to different times.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method and apparatus for analyzing delay defect]]></title>
<link>http://www.freepatentsonline.com/7617431.html</link>
<description><![CDATA[The apparatus for analyzing a delay defect of the present invention obtains the RC of the maximal incidence among region codes (RCs) to which check circuits detecting errors caused with gradual increase in the frequency of an operational clock pulse fed to an integrated circuit belongs. The apparatus obtains information on latch in which an error is caused with the RC of the maximal incidence, with reference to a mapping table that describes the mapping relationship between an RC and a latch. The apparatus extracts a circuit portion in which an error can be captured with the region code of the maximal incidence by exhaustively tracing back circuit portions connected with each obtained latch, from the latch to the latch described in the mapping table. The apparatus gives delay defects to the input and the output pin of each of logic elements included in the extracted circuit portion, generates test patterns for detecting the given delay defects, and performs delay tests.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

</channel>
</rss>
