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<title>freepatentsonline.com: Electricity: electrical systems and devices</title>
<link>http://www.freepatentsonline.com/result.html?query_txt=ccl/361%20and%20isd/11/10/2009&amp;uspat=on</link>
<description>USPTO Class 361 Electricity: electrical systems and devices</description>
<language>en-us</language>
<lastBuildDate>Tue, 10 Nov 2009 08:53:09 EST</lastBuildDate>

<item>
<title><![CDATA[IC card]]></title>
<link>http://www.freepatentsonline.com/7616447.html</link>
<description><![CDATA[An IC memory card ( 11 ) has a mode change switch ( 18 ) for switching operation modes of a semiconductor component in the vicinity of an end side opposite the external connection terminals ( 17 a  to  17 i ). A controller LSI ( 24 ) detects the status of the mode change switch ( 18 ) and switches operation modes according to the detected status.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Subassembly with at least two component parts as well as a sealing module]]></title>
<link>http://www.freepatentsonline.com/7616453.html</link>
<description><![CDATA[The invention relates to a Subassembly ( 1 ) with at least two component parts ( 2, 3 ), as well as a sealing module ( 4 ). To improve the exchangeability of seals ( 5, 6 ) for a subassembly comprising at least two component parts ( 2, 3 ), especially when complex seal geometries are involved, it is proposed that the subassembly ( 1 ) with at least two component parts ( 2, 3 ) which can be assembled to form the subassembly, features at least one sealing module ( 4 ) to accept at least one seal ( 5,6 ), which can be used between two component parts ( 2, 3 ) in each case.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Semiconductor device including protection circuit and switch circuit and its testing method]]></title>
<link>http://www.freepatentsonline.com/7616417.html</link>
<description><![CDATA[In a semiconductor device including a semiconductor element to be protected having first and second electrodes, and a protection circuit coupled between the first and second electrodes, a switch circuit is inserted between the first and second electrodes in series to the protection circuit. The switch circuit is turned ON by such a voltage that turns ON the semiconductor element.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Over current protection circuit for power supplies]]></title>
<link>http://www.freepatentsonline.com/7616422.html</link>
<description><![CDATA[An over current protection circuit provides over current protection (O.C.P) and short current protection (S.C.P) and can selectively operate in auto recover mode or latch off mode by replacing certain elements therein. Hence, the present invention can be designed easily and is cheaper than the prior art.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Crash-hardened memory device and method of creating the same]]></title>
<link>http://www.freepatentsonline.com/7616449.html</link>
<description><![CDATA[A crash-hardened memory device in which only a single electronic component, such as a memory chip, mounted on a small printed circuit board (PCB), is protected against an impact. The portion of the PCB containing the electronic component is wrapped in fire-retardant material and RF shielding tape. The wrapped PCB assembly is placed in a rigid, hardened enclosure which provides an environmental seal for the portion of the PCB containing the electronic component. A portion of the PCB extends outside of the enclosure to allow electrical connections to be made to the electronic component contained inside. A score line is created on the PCB to create an acceptable shear point between the internal and external portions of the PCB in the event of a crash. Threaded fasteners extend through and beyond both enclosure halves to provide a means for mounting the crash-hardened memory device on an external surface.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Apparatus for inserting and ejecting an electronic enclosure within a cabinet]]></title>
<link>http://www.freepatentsonline.com/7616450.html</link>
<description><![CDATA[A cabinet includes spaces for a number of electronic enclosures, each of which has a free end from which a pair of levers extend upward and downward to teeth engaging slots within the cabinet, aiding in the insertion and removal of the enclosures from the cabinet. An electronic enclosure that is wider than a standard width includes additional teeth on crank plates turning with the levers. The electronic enclosure may include an electrically-operated interlock mechanism preventing the insertion or removal of the electronic enclosure by preventing movement of a shaft attached to either or both of the levers.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Leakage current interrupter]]></title>
<link>http://www.freepatentsonline.com/7616413.html</link>
<description><![CDATA[A leakage current interrupter is provided. The leakage current interrupter includes: a leakage current detector having resistors connected to the external metal cover of the power cable, and generating a voltage corresponding to a leakage current through the resistors when the leakage current flows through the external metal cover of the power cable; a power source connected to the power line and the neutral line to generate DC power when AC power is applied through the power line and the neutral line; a power interrupter opening the power line and the neutral line when the DC power is applied; and a controller applying the DC power to the power interrupter when the leakage current detector generates a voltage. Therefore, it is possible to reduce manufacturing cost, and to provide a self-test function to the leakage current interrupter to increase the operation reliability of the leakage current interrupter. Therefore, it is possible to reduce manufacturing cost, and to provide a self-test function to the leakage current interrupter to increase operation reliability of the leakage current interrupter.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[ESD protection circuit for high speed signaling including T/R switches]]></title>
<link>http://www.freepatentsonline.com/7616414.html</link>
<description><![CDATA[An ESD protection circuit for a transistor having a drain and source coupled to high-speed signaling pins of an integrated circuit includes a first string of clamping elements and a second string of clamping elements. The first string of clamping elements has a collective capacitance less than the capacitance of a single clamping element. The first string of clamping elements is operably coupled to the drain and source of the transistor and conducts when a first polarity ESD voltage is applied to the high-speed pins. The second string of clamping elements has a collective capacitance less than the capacitance of one clamping element. The second string of clamping elements is operably coupled to the drain and source of the transistor and conducts when a second polarity ESD voltage is applied to the high speed signaling pins.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Electrostatic discharge protection circuit and electrostatic discharge protection method of a semiconductor memory device]]></title>
<link>http://www.freepatentsonline.com/7616415.html</link>
<description><![CDATA[An electrostatic discharge (ESD) protection circuit protects a gate oxide of elements in an internal circuit against ESD. During an ESD test, if the sum of driving voltages of ESD protectors connected between a power pad and a ground pad is higher than the gate oxide breakdown voltage of elements in the internal circuit, the structure of the ESD protector is changed or another ESD protector is additionally provided so as to protect the gate oxide of the elements in the internal circuit against ESD.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Mitigation of current collapse in transient blocking units]]></title>
<link>http://www.freepatentsonline.com/7616418.html</link>
<description><![CDATA[A transient blocking unit (TBU) includes at least two depletion mode transistors connected to each other such that they can rapidly switch from a normal low-impedance state to a high-impedance current blocking state in response to an over-voltage or over-current condition. This behavior makes TBUs useful for protecting electrical devices and circuit from harmful electrical transients. Some kinds of transistors can exhibit a phenomenon known as current collapse, where channel conductance is temporarily reduced after exposure to high voltage. Although current collapse is undesirable, transistors exhibiting current collapse can have otherwise favorable properties for TBU applications. According to the present invention, a TBU is provided where a diode is placed in parallel with a TBU transistor that can exhibit current collapse. The diode prevents high power dissipation in a current collapsed transistor, thereby reducing the vulnerability of the TBU to permanent damage or destruction in service.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Switchgear control apparatus]]></title>
<link>http://www.freepatentsonline.com/7616419.html</link>
<description><![CDATA[A switchgear control apparatus includes a zero point interval detecting circuit, an interruption time judgment circuit and a reclosing time decision circuit. The zero point interval detecting circuit detects time intervals between successive zero points of a main circuit current. The interruption time judgment circuit judges that interruption time of the main circuit current is time of a zero point immediately preceding a zero point at which a difference between the time interval between two successive zero points and half the period of a commercial AC voltage exceeds a specific value. Upon detecting the gradient of the main circuit current at the interruption time, the reclosing time decision circuit sets reclosing time at a point in phase where the AC voltage has a maximum negative value if the gradient is positive, and at a point in phase where the AC voltage has a maximum positive value if the gradient is negative.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Electronic equipment, driving method thereof and method of driving electronic circuit]]></title>
<link>http://www.freepatentsonline.com/7616423.html</link>
<description><![CDATA[In order to compensate fluctuation of the characteristics of a field effect transistor and detect capacitive change of a capacitive element for measurement with high precision, the electronic circuit of the present invention includes; a transistor outputting current in response to voltage change, which is supplied from a variable voltage source to a current control terminal by capacitive coupling via the capacitive element for measurement; and the constant current source to output reference current; and the current detection circuit to detect output current outputted from the transistor. After making the reference current pass through the transistor and compensating fluctuation of threshold voltage, a switching element is turned “OFF” so as to make the current path between the gate and the drain of the transistor to be non conductive. The voltage applied to the gate electrode from the variable voltage source via the capacitive element for measurement is changed thereby and output current level is detected by the current detection circuit so as to obtain the changed amount of the capacity of the capacitive element for measuring.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Surge suppression module with disconnect]]></title>
<link>http://www.freepatentsonline.com/7616424.html</link>
<description><![CDATA[A transient voltage suppression (TVSS) device is disclosed. The device comprises a surge module connected to a base module that connects the surge module to an electrical buss. The base module has a disconnect switch that allows the surge module to be isolated from the buss when the switch is off and connected to the buss when the switch is on. In this manner, maintenance or replacement of the surge module can be performed safely without removing power from the buss.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Separator for electric double layer capacitor and electric double layer capacitor containing same]]></title>
<link>http://www.freepatentsonline.com/7616428.html</link>
<description><![CDATA[A separator for an electric double layer capacitor, characterized in that a thickness of the entire separator is 25 μm or less, a layer of an ultrafine fibrous aggregate prepared by an electrostatic spinning process is contained, an average fiber diameter of ultrafine fibers constituting the ultrafine fibrous aggregate layer is 1 μm or less, and a maximum pore size of the ultrafine fibrous aggregate is not more than 3 times a mean flow pore size is disclosed.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Current inputs interface for an electrical device]]></title>
<link>http://www.freepatentsonline.com/7616433.html</link>
<description><![CDATA[According to an aspect of the present disclosure, an electrical power meter, is disclosed. The electrical power meter includes a housing for containing electrical circuitry therein, the housing including at least one of voltage and current inputs, the housing including passages extending entirely therethrough, wherein the passages are configured to receive a CT lead therethrough, and wherein the CT leads are not electrically connected to the electrical circuitry therein; and a face plate operatively supported on a surface of the housing, wherein the face plate includes at least one of displays, indicators and buttons. It is envisioned that the through passages are located along a side of the housing.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Electric connection box]]></title>
<link>http://www.freepatentsonline.com/7616438.html</link>
<description><![CDATA[An electric connection box according to one aspect of the present invention can include conductive members on a circuit board, a case accommodating the circuit board, a ventilation path formed in the case and through which air can flow in a vertical direction, a suction port formed in the case to be in communication with the ventilation path, an exhaust port formed in the case to be in communication with the ventilation path, the exhaust port positioned above the suction port, cooled portions positioned on the conductive members and positioned in the ventilation path so as to allow air to flow in the vertical direction between conductive members, and heat generating components connected to the cooled portions of the conductive members.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Electric connection box]]></title>
<link>http://www.freepatentsonline.com/7616439.html</link>
<description><![CDATA[One aspect of the present invention can include an electric connection box having a circuit board, a case inside of which said circuit board is housed, a plurality of fitting depressions capable of being fitted with an external electrical component, positioned on a side wall of the case opposing a board surface of the circuit board. Further, an air path inside of said case is defined by the plurality of fitting depressions positioned as an arrayed side by side with a spacing in between, and the air path circulates the air up and down between the plurality of fitting depressions, and an inlet positioned in the case and in communication with the air path, an exhaust outlet is positioned in the case in communication with the air path and positioned above said inlet, and a heat generating component is positioned in the air path.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Semiconductor package substrate and method, in particular for MEMS devices]]></title>
<link>http://www.freepatentsonline.com/7616451.html</link>
<description><![CDATA[A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Excessive surge protection method and apparatus]]></title>
<link>http://www.freepatentsonline.com/7616420.html</link>
<description><![CDATA[A surge protection apparatus connected between an electrical power line source and a load includes a voltage input, an inductor, and a protective barrier. The voltage input is coupled to the electrical power line. The inductor is coupled between the voltage input and the load. The protective barrier is interposed between the inductor and the load, and is configured to physically isolate the inductor from the load.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Photo-sensitive MEMS structure]]></title>
<link>http://www.freepatentsonline.com/7616425.html</link>
<description><![CDATA[A heat-sensitive apparatus includes a substrate with a top surface, one or more bars being rotatably joined to the surface and having bimorph portions, and a plate rotatably joined to the surface and substantially rigidly joined to the one or more bars. Each bimorph portion bends in response to being heated. The one or more bars and the plate are configured to cause the plate to move farther away from the top surface in response to the one or more bimorph portions being heated.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Capacitor and method for fabricating the same]]></title>
<link>http://www.freepatentsonline.com/7616426.html</link>
<description><![CDATA[A capacitor includes a lower electrode, a dielectric structure over the lower electrode, the dielectric structure including at least one crystallized zirconium oxide (ZrO 2 ) layer and at least one amorphous aluminum oxide (Al 2 O 3 ) layer, and an upper electrode formed over the dielectric structure. A method for fabricating a capacitor includes forming a lower electrode over a certain structure, forming a dielectric structure including at least one crystallized zirconium oxide (ZrO 2 ) layer and at least one amorphous aluminum oxide (Al 2 O 3 ) layer over the lower electrode, and forming an upper electrode over the dielectric structure.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Electric double layer capacitor]]></title>
<link>http://www.freepatentsonline.com/7616429.html</link>
<description><![CDATA[Provided is an electric double layer capacitor including a large capacity single cell having a large electrostatic capacity and a small capacity single cell are connected to the same exterior case in parallel, and a thickness of a separator of the large capacity single cell is made thicker than a thickness of a separator of the small capacity single cell. With this structure, a supply amount of an electrolyte solution to the large capacity single cell is markedly increased compared with the small capacity single cell, thereby being capable of preventing degradation of the large capacity single cells and the small capacity single cells and providing the electric double layer capacitor having an excellent cycle life and having a large power storage amount while keeping characteristics capable of instantaneously allowing large current to flow.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Handheld electronic device having a cover turnable 360 degrees relative to a body thereof]]></title>
<link>http://www.freepatentsonline.com/7616435.html</link>
<description><![CDATA[A handheld electronic device ( 300 ) mainly comprises a cover ( 310 ), a main body ( 320 ), a monitor ( 328 ) mounted on the main body, a keyboard ( 318 ) mounted on the cover and a hinge structure ( 330 ) to which pivot portions ( 312 ), ( 322 ) of the cover and main body are hinged. The pivot portions have teeth ( 314 ), ( 324 ) on circumferential peripheries thereof. The teeth mesh with each other. The cover can rotate for 360 degrees relative to the main body thereby moving from a first position to a second position, wherein at the first position, the cover abuts against a top surface ( 326 ) of the main body, and at the second position, the cover abuts against a bottom surface of the main body. The trajectory of the cover during its rotation relative to the main body follows a predetermined path.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Flex circuit constructions for high capacity circuit module systems and methods]]></title>
<link>http://www.freepatentsonline.com/7616452.html</link>
<description><![CDATA[Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A strain relief portion of the flex circuitry has preferably fewer layers than the portion of the flex circuitry along which the integrated circuitry is disposed and may further may exhibit more flexibility than the portion of the flex circuit populated with integrated circuitry. The substrate form is preferably devised from thermally conductive materials.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Monolithic ceramic capacitor]]></title>
<link>http://www.freepatentsonline.com/7616427.html</link>
<description><![CDATA[A monolithic ceramic capacitor includes a first same-polarity-electrode-connecting conductor and a second same-polarity-electrode-connecting conductor that are provided inside a ceramic laminate. The first same-polarity-electrode-connecting conductor is electrically connected to all of the first outer electrodes, and the second same-polarity-electrode-connecting conductor is electrically connected to all of the second outer electrodes. Preferably, a plurality of first same-polarity-electrode-connecting conductors and a plurality of second same-polarity-electrode-connecting conductors are successively disposed in the laminating direction inside the ceramic laminate.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Mobile terminal device and method for radiating heat therefrom]]></title>
<link>http://www.freepatentsonline.com/7616446.html</link>
<description><![CDATA[In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure. Furthermore, the rigidity of the circuit board can be raised, and the reliability of the mobile terminal device can be improved.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Capacitor electrode member, method for manufacturing the same, and capacitor provided with the electrode member]]></title>
<link>http://www.freepatentsonline.com/7616430.html</link>
<description><![CDATA[The invention provides a capacitor electrode member in which layers constituting the electrode member are highly adhesive. The capacitor electrode member comprises aluminum material ( 1 ), a carbon-containing layer ( 2 ) formed on the surface of the aluminum material ( 1 ), and further an interposition layer ( 3 ) containing an aluminum element and a carbon element, the interposition layer being formed between the aluminum material ( 1 ) and the carbon-containing layer ( 2 ). The interposition layer ( 3 ) constitutes a first surface portion which is formed on at least a part of the region of the surface of the aluminum material ( 1 ) and contains a carbide of aluminum. The carbon-containing layer ( 2 ) constitutes a second surface portion ( 21 ) formed so as to extend outward from the first surface portion ( 3 ). The carbon-containing layer ( 2 ) further contains carbon particles ( 22 ) and the second surface portion ( 21 ) is formed between the first surface portion ( 3 ) and the carbon particles ( 22 ) and contains a carbide of aluminum.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Configurable universal telecom framework]]></title>
<link>http://www.freepatentsonline.com/7614509.html</link>
<description><![CDATA[Embodiments of interlocking uprights members for a telecommunications equipment cabinet are presented herein. In some embodiments, the cabinet is configured to hold a plurality of telecommunications components and has at least one variable dimension. The cabinet may be formed by adjustably joining a pair of identical sub-assemblies in one of a plurality of positions. Additionally, each sub-assembly may include a plurality of upright members, with each of the plurality of upright members having an edge that is configured to interlock, substantially along a length of the upright member, with an edge of a corresponding upright member of the other sub-assembly.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Display with foldable base]]></title>
<link>http://www.freepatentsonline.com/7614591.html</link>
<description><![CDATA[A foldable base is applied to a display to be folded up for easy storage. The foldable base includes a first portion and a second portion, wherein the first portion is pivotably connected to the second portion via a shaft. The main body of the shaft, positioned at a turning space within the foldable base, at least includes a positioning plane and a curved surface. When the first portion is pivoted around the second portion, the main body of the shaft is simultaneously rotated in the turning space. Since the main body of the shaft is physically interfered by the turning space, the first portion of the foldable base can be spontaneously sent back to a first position (such as a start-to-rotate position) or folded up to a second position (such as a storage position) after the first portion is rotated to a certain angle.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Fiducial markings for quality verification of high density circuit board connectors]]></title>
<link>http://www.freepatentsonline.com/7614800.html</link>
<description><![CDATA[A printed circuit board having a pattern of fiducial marks on opposed edges of the board for assuring accuracy and alignment of an electrical connector printed on the board. The fiducial marks are printed as staggered indicia extending orthogoral to the printed contact row array of the electrical connector so that when the board is cut or routed, an inspection process can determine if the physical edges of the board, which determine the pin alignment with a mating receptacle, are within specification.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Tuner device]]></title>
<link>http://www.freepatentsonline.com/7616081.html</link>
<description><![CDATA[A tuner device comprising: a tuner module, disposed on a surface of a substrate and comprising: a circuit component adapted to demodulate a signal received from an antenna device; a printed circuit board mounted with the circuit component and a plurality of connector pins extending perpendicular to the surface of the substrate; and a metallic case, housing the printed circuit board so as to shield the circuit component, and made of an unsolderable material; and a bracket made of a solderable material, and fixed to the metallic case while holding the tuner module so as to dispose the tuner module on the surface of the substrate.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[System to protect electrical fuses]]></title>
<link>http://www.freepatentsonline.com/7616416.html</link>
<description><![CDATA[A method and system is disclosed for protecting electrical fuse circuitry. A electrical fuse circuit with electrostatic discharge (ESD) protection has at least one electrical fuse, a programming device coupled in series with the electrical fuse having at least a transistor for receiving a control signal for controlling a programming current flowing through the electrical fuse, a voltage source coupled to the fuse and the programming device for providing the programming current, and a protection module coupled to a gate of the transistor at its first end for reducing charges accumulated at the gate of the transistor due to electric static charges arriving at the voltage source, thereby preventing the programming device from accidentally programming the fuse.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Electrical enclosure and support assembly therefor]]></title>
<link>http://www.freepatentsonline.com/7616431.html</link>
<description><![CDATA[A support assembly is provided for an electrical enclosure including a housing having first and second opposing sides, electrical bus members, and at least one electrical switching apparatus, such as a circuit breaker. Each of the electrical bus members is electrically connectable to a corresponding one of the circuit breakers. The support assembly includes at least one support member having first and second opposing ends, first and second opposing edges, and a plurality of apertures extending from the first edge toward the second edge and receiving the electrical bus members. A fastener assembly supports the support member(s) between the first and second sides of the housing. Each support member extends only a portion of the width between the first and second sides of the housing, and supports the electrical bus members, without being attached to the housing at a location between the first and second sides thereof.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Fan unit and methods of forming same]]></title>
<link>http://www.freepatentsonline.com/7616440.html</link>
<description><![CDATA[The described embodiments relate to fans units. One exemplary fan unit includes a housing supporting a motor. The fan unit also includes an impeller coupled to the motor and configured to be rotated by the motor. The impeller comprises at least a first structure configured to move air past the housing and at least one second different structure configured to force air into the housing.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Electrical interface system]]></title>
<link>http://www.freepatentsonline.com/7616421.html</link>
<description><![CDATA[An interface system may be used to connect an electrical device to an electrical bus. The interface system may include a first end and a second end in electrical communication with the first end. Where the interface system is used to connect an electrical device to an electrical bus, the first end may be connected to the electrical bus and the second end may be connected to the electrical device. The interface system may also include a reverse current blocking circuit configured to block current from flowing from the second end to the first end. Additionally, the interface system may include a discharge circuit electrically connected between the first end and the second end for discharging the blocked current.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Arrangement of non-signal through vias and wiring board applying the same]]></title>
<link>http://www.freepatentsonline.com/7615708.html</link>
<description><![CDATA[An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact surface, while the arrangement of non-signal through vias includes first non-signal through vias and a second non-signal through via. The first non-signal through vias pass through the core layer and are electrically connected to some of the contact pads. The second non-signal through via which passes through the core layer is disposed between the first non-signal through vias and is not electrically connected to the contact pads. The interval between the second non-signal through via and anyone of the surrounding first non-signal through vias is smaller than or equal to 0.72 times of the minimum interval between any two of the contact pads electrically connected to the corresponding first non-signal through vias.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Graphite heat dissipation apparatus and clamping frame for clamping graphite heat dissipation fin module]]></title>
<link>http://www.freepatentsonline.com/7616441.html</link>
<description><![CDATA[A graphite heat dissipation apparatus and a clamping frame for clamping a graphite heat dissipation fin module are provided. The graphite heat dissipation apparatus includes a graphite heat dissipation fin module and at least one clamping frame. The graphite heat dissipation fin module includes a substrate and a plurality of graphite fins which are positioned at and extend from one surface of the substrate. The clamping frame includes at least one support bracket, at least one retention plates and a frame body. The support brackets are positioned at top surface of a chassis. The frame body upwardly extends from the support brackets, and the retention plates traverse extend across the side surface of the frame body. The retention plates are used to clamp the substrate so that the graphite fins are positioned above the chassis. The graphite heat dissipation fin module is used to draw hear away from the electronic device which can be positioned below the substrate and at the surface of the chassis.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Gimballed attachment for multiple heat exchangers]]></title>
<link>http://www.freepatentsonline.com/7616444.html</link>
<description><![CDATA[One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint enables independent application of a retention force to the heat exchanger as a single-point load. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of retention force directed through the gimbal joint to each heat exchanger. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Direct methanol fuel cell and portable computer having the same]]></title>
<link>http://www.freepatentsonline.com/7615303.html</link>
<description><![CDATA[The invention is directed to a direct methanol fuel cell (DMFC) and a portable computer having the same. The portable computer includes a display unit rotatably coupled to a main unit. The display unit includes a display panel, a liquid fuel tank, and a direct methanol fuel cell (DMFC) on the backside of the display panel. The main unit comprises a keyboard, and a liquid supply device under the keyboard to circulate an output from the DMFC to the fuel tank. The portable computer has a thin monopolar type DMFC on the backside of the display panel, which provides a longer operating time, and also improves portability by supplying an energy source promptly.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Enhanced-reliability printed circuit board for tight-pitch components]]></title>
<link>http://www.freepatentsonline.com/7615705.html</link>
<description><![CDATA[A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent component contacts do not contact the same bundle of glass fibers. This angle may be accomplished by manufacturing a printed circuit board panel with the glass fibers at an angle with respect to its edges. This angle may also be accomplished by placing parts on a printed circuit board panel that has a traditional X-Y orthogonal weave of glass fiber bundles at an angle with respect to the edges of the panel. This angle may also be accomplished by starting with a traditional panel that has an X-Y orthogonal weave, laying out parts on the panel along the X-Y weave, then placing components on the parts at an angle with respect to the edges of the parts.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Support frame for wall mounting an electrical apparatus]]></title>
<link>http://www.freepatentsonline.com/7615711.html</link>
<description><![CDATA[Support frame ( 1 ) for wall mounting at least one electrical apparatus ( 20, 21, 22, 23 ), the frame ( 1 ) comprising: a surround casing ( 4 ) for wall fixing, enclosing an opening ( 5 ) that defines a assembly housing adapted to accepting and retaining said at least one electrical apparatus ( 20, 21, 22  and  23 ), the opening ( 5 ) being defined by a facing pair of fixing panels ( 6  and  7 ) and a facing pair of connecting panels ( 9  and  10 ) with ends attached to said fixing panels ( 6  and  7 ) and the fixing panels ( 6  and  7 ) comprising attachment elements ( 8 ) for mounting said at least one electrical apparatus ( 20, 21, 22  and  23 ). The connecting panels ( 9  and  10 ) include coupling components ( 11 ), adapted to engaging with respective complementary coupling components ( 12 ) substantially located on end sections of a divider ( 13 ) that can be removably coupled to said frame ( 1 ) to subdivide said opening.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Apparatus, system, and method for AC bus loss detection and AC bus disconnection for electric vehicles having a house keeping power supply]]></title>
<link>http://www.freepatentsonline.com/7616460.html</link>
<description><![CDATA[An alternating current (AC) bus malfunction detection and protection module monitors an AC voltage that is provided on a bus by a house keeping power supply of a power system. If the AC voltage on the bus falls below a first level, the module provides a delay before power inverter switching is disabled. If the AC voltage on the bus falls below a second level, the module disables the power inverter switching without delay.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method for controlling system to work at appropriate temperature]]></title>
<link>http://www.freepatentsonline.com/7617020.html</link>
<description><![CDATA[A method for controlling a system to work at an appropriate temperature provides a control manner allowing not only a temperature factor but also a time factor to be considered when a system is heated. When a heated value of the system reaches a certain preset value, a controller will then executes corresponding control modes to emit control signals to allow each of components of the system to obtain a better protection while being heated.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Engine control apparatus]]></title>
<link>http://www.freepatentsonline.com/7614377.html</link>
<description><![CDATA[An engine control apparatus in which, when it is detected by a starter switch that a starter has changed-over from a drive state into a non-drive state, an ECU (engine control unit) predicts a time period in which an engine is completely stopped, on the basis of a revolution speed of the engine at that time, so as to turn OFF an output of a starting motor relay for the predicted period.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[High-contrast laser mark on substrate surfaces]]></title>
<link>http://www.freepatentsonline.com/7615404.html</link>
<description><![CDATA[As part of a first configured laser operation, a smooth, more reflective marking area is formed at a surface of a substrate (e.g., integral heat spreader, or IHS). In a second configured laser operation, a mark is formed at the surface of the substrate within the marking area. The mark contrasts strongly with the reflective surface of the substrate in the marking area. As a result, the mark may be read with an optoelectronic imaging system with a higher rate of reliability than marks disposed at a substrate surface having a microtopographical profile with greater variation from a nominal surface plane. An IHS with a mark so disposed provides benefits when include as a portion of an integrated circuit package, which in turn provides benefits when included as a portion of an electronic system.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Memory module with stacked semiconductor devices]]></title>
<link>http://www.freepatentsonline.com/7615869.html</link>
<description><![CDATA[Embodiments are described in which a stacked arrangement of integrated circuit packages comprises a dummy substrate comprising an embedded discrete or distributed capacitor connected to first and/or second power voltages, or an embedded termination register connected to one or more clock, control, address, and/or data signals(s).]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Systems and methods for mounting components of an information handling system]]></title>
<link>http://www.freepatentsonline.com/7616436.html</link>
<description><![CDATA[Systems and methods for mounting components of an information handling system such as a desktop computer or other desktop information handling system. The supported components may be motorized or other vibration-producing components that are supported and mounted directly or indirectly to a mounting structure of an information handling system using an isolation apparatus that is configured on a first end with one or more insertable snap-fit retaining features configured to retainably engage one or more internal retaining features of the mounting structure in order to fixedly couple the isolation apparatus to the mounting structure, and that is configured on an opposing second end with one or more insertable pins that may in turn be employed to couple the isolation apparatus to the vibration-producing component.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Power electronic module cooling system and method]]></title>
<link>http://www.freepatentsonline.com/7616442.html</link>
<description><![CDATA[An improved cooling mechanism for a power electronics device is provided. More specifically, a cooling mechanism is provided wherein an air directing structure with a finite air-flow resistance is deployed in a cooling channel adjacent to a heatsink in a first cooling zone, such that some portion of the cooling air is forced through the heatsink while the rest of the cooling air bypasses the heatsink to provide additional cooling air to a second cooling zone. Additionally, the air-flow resistance of the air directing structure can be chosen so that the fan operates at its optimal point (maximum power input to the air).]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Structure and method for efficient thermal dissipation in an electronic assembly]]></title>
<link>http://www.freepatentsonline.com/7616445.html</link>
<description><![CDATA[One embodiment of the present invention sets forth an electronic assembly, which comprises a printed circuit board having at least one opening, an electronic component mounted on a first side of the printed circuit board, and a thermal dissipation structure including at least one heat sink having a first surface and a second surface. The first surface includes a first region coupled with a surface of the electronic component, and one or more second region provided with at least a heat dissipating member that is exposed through the opening on a second side of the printed circuit board.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Wrap-around overmold for electronic assembly]]></title>
<link>http://www.freepatentsonline.com/7616448.html</link>
<description><![CDATA[An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Electromagnetic relay]]></title>
<link>http://www.freepatentsonline.com/7616082.html</link>
<description><![CDATA[The electromagnetic relay of the present invention comprises a base ( 10 ), an electromagnet ( 20 ) disposed on the base, an armature ( 30 ) supported rotatably by the base, a movable spring ( 40 ) whose one end has a movable contact ( 41 ) and the opposite end is secured to the base, a fixed contact ( 51 ) disposed opposite to the movable contact, and a card ( 60 ). The card has a coupling part ( 61 ) to be coupled to the armature and an insertion hole ( 62 ) to which the one end of the movable spring is inserted, and it deforms the movable spring elastically in conjunction with a swing motion of the armature to selectively open or close a connection between the movable contact and the fixed contact. The movable spring has a U-shaped hook formed by bending the one end of the movable spring toward the opposite end side, and the hook can pass through the insertion hole while being pushed by an inner surface of the insertion hole and being deformed elastically, and an end of the hook is engaged with the card.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Diaphragm pressure measuring cell arrangement]]></title>
<link>http://www.freepatentsonline.com/7614308.html</link>
<description><![CDATA[A diaphragm pressure measuring cell arrangement has a housing body at least partly made of sapphire material and a planar sapphire diaphragm with a peripheral edge joined by a first edge seal to the housing body to form a reference vacuum chamber. An outer surface of the diaphragm is exposed to a medium to be measured. A ceramic supporting body is attached to the back side of the housing body by sealing glass and includes a surface area overhanging that surrounds the housing body to form a first sealing surface. A tubular sensor casing incorporates the measuring cell for mounted the ceramic support body, the casing including an inside second surrounding sealing surface corresponding to the first sealing surface. A metal ring seal is between the sealing surfaces and a pressing member presses sealing surfaces together.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Smart cards and smart card systems supporting multiple interfaces]]></title>
<link>http://www.freepatentsonline.com/7614566.html</link>
<description><![CDATA[A smart card includes a first interface configured to perform a first type interfacing operation with a host using a plurality of contact pads defined by a contact type smart card protocol, a second interface configured to perform a second type interfacing operation with the host using a subset of the plurality of contact pads, and a controller configured to determine a priority between the first and second interfaces.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Cooling arrangement]]></title>
<link>http://www.freepatentsonline.com/7614247.html</link>
<description><![CDATA[A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line and a return-flow line with at least one electronic component, which is to be cooled, on the respective printed circuit board or plug-in module. The feed line is coupled with at least one component feed line assigned to the electronic component. The return-flow line is coupled with at least one component return-flow line assigned to the electronic component. The component feed line and the component return-flow line have coupling elements attached at ends of the respective printed circuit board or plug-in module which, together with the counter coupling elements of the feed line and the return-flow line attached at the end of the housing, form a coupling connection, which is releasable.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards]]></title>
<link>http://www.freepatentsonline.com/7615861.html</link>
<description><![CDATA[A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Electrical distribution panel for a number of critical and non-critical loads]]></title>
<link>http://www.freepatentsonline.com/7616432.html</link>
<description><![CDATA[An electrical distribution panel includes first and second power inputs, a first circuit breaker electrically between the first power input and a first load bus, a second load bus, an automatic transfer switch having a first input electrically connected to the first load bus, a second input electrically connected to the second power input, and an output electrically connected to the second load bus. The transfer switch selectively electrically connects one of the first and second inputs to the output thereof. Pairs of circuit breakers each includes a second breaker having a first terminal electrically connected to the first load bus, and a second terminal, a third breaker including a first terminal electrically connected to the second load bus, and a second terminal, a power output electrically connected to the second terminals, and an interlock cooperating with the circuit breaker pair to prevent both of them from being closed simultaneously.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Vibration damping mechanism and electronic device having the damping mechanism]]></title>
<link>http://www.freepatentsonline.com/7616437.html</link>
<description><![CDATA[A vibration damping mechanism includes a frame, cushioning members, a heat sink, and fastening members. The frame has a base plate and supporting arms disposed on the base plate. Each cushioning member is disposed on a respective one of the supporting arms, and has a through hole. The heat sink supports a hard disk thereon such that the hard disk lies flat against and is secured on the heat sink, and has a plurality of fastening holes. Each fastening member extends through the respective through hole and threadedly engages the respective fastening hole such that the heat sink is suspended on the supporting arms and abuts against the cushioning members. Thus, the area of contact between the heat sink and the hard disk is increased to enhance the heat transfer efficiency, and the cushioning members provide the heat sink and the hard disk with a cushioning effect.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method of providing connector compatibility for data interface]]></title>
<link>http://www.freepatentsonline.com/7614148.html</link>
<description><![CDATA[Cable connection unions are rapidly replaced in a universal seismic data acquisition-module without opening a main electronic circuitry protective chamber. Different connector types required for the many data transmission cable designs needed to service a wide range of survey conditions are more easily accommodated without exposing primary circuitry to the elements.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Connector locking latch with signal providing early warning of disconnection]]></title>
<link>http://www.freepatentsonline.com/7614893.html</link>
<description><![CDATA[A device and method are provided that generate an early warning disconnect signal from an electrical connector supplying external power to a connected device. The connected device includes an early warning disconnect power management circuit, operational to generate power consumption control information in response to generation of the early warning disconnect signal from the electrical connector. In one example, the electrical connector includes a lock release mechanism and a signaling mechanism, the signaling mechanism is operationally coupled with the lock release mechanism and configured to generate the early warning disconnect signal from the electrical connector to the connected device prior to the lock release mechanism being in an unlocked state.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Corrective device protection]]></title>
<link>http://www.freepatentsonline.com/7616005.html</link>
<description><![CDATA[A control system for an electrical power system includes an electrical corrective device, a voltage measuring device coupled to each phase of the electric power system, a current measuring device connected between each phase of the electric power system and the electrical corrective device, and a protective device connected to outputs of the voltage measuring device and the current measuring device. The protective device includes a controller configured to detect an imbalance using the measured voltages and currents output from the voltage measuring device and the current measuring device without using or independently of other recent voltage or current measurements for other points in the electrical corrective device and independently of a neutral-ground measurement at the electrical corrective device.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Desktop liquid crystal displaying device]]></title>
<link>http://www.freepatentsonline.com/7616434.html</link>
<description><![CDATA[A desktop liquid crystal displaying (LCD) device, which can be disposed on a surface, includes an LCD monitor, a first frame and a second frame. The LCD monitor has a bottom side facing the surface. The first frame and the second frame are mounted on the LCD monitor. The first frame and the second frame protrude from the bottom side of the LCD monitor towards the surface and are placed over the surface to support the LCD monitor. Portions of the first frame and the second frame extruding from the bottom side of the LCD monitor are distanced apart over 25 centimeters.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Electrostatic chuck module and cooling system]]></title>
<link>http://www.freepatentsonline.com/7615133.html</link>
<description><![CDATA[An electrostatic chuck module for a semiconductor manufacturing apparatus which can be cooled with water and in which there is no penetration leak includes an electrostatic chuck plate of alumina and a cooling plate which is bonded to the electrostatic chuck, wherein the cooling plate is formed by forging processing to a Cu-based composite material comprising Cu—W, Cu—W—Ni, Cu—Mo, or Cu—Mo—Ni. By adjusting the ratio of Cu and Ni having a great thermal expansion coefficient and W and Mo having a small thermal expansion coefficient in a Cu-based composite material, it is possible to obtain a highly thermally conductive material having the same thermal expansion coefficient as an alumina material for an electrostatic chuck. However, since such a composite material has a penetration leak, it cannot be used in a vacuum system. According to the present invention, by conducting forging processing, a penetration leak can be prevented. Also, corrosion resistance which is important for a cooling plate can be improved by applying a Ni, Cr or Cu film by plating or sputtering.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Methods for assembling computers]]></title>
<link>http://www.freepatentsonline.com/7614149.html</link>
<description><![CDATA[Apparatuses and methods for preventing disengagement of electrical connectors in the assembly of computers. In one embodiment, a computer system includes a chassis, an electrical component contained within the chassis, an electrical connector engaged with a receptacle on the electrical component, and a retainer to prevent disengagement of the electrical connector from the receptacle. The retainer has a mounting portion that can attach to at least one of the electrical component or the computer chassis, and a connector interface adjacent to the electrical connector to prevent the connector from disengaging from the receptacle on the electrical component. In one aspect of this embodiment, the retainer is a one-piece retainer with a mounting portion that attaches to only one surface of the electrical component. In other embodiments, the retainer can be a two-piece retainer having a bracket and a movable retainer portion. The bracket can attach to two surfaces of the electrical component, and the movable retainer portion can be operatively coupled to the bracket so that it can be positioned adjacent to the connector to prevent the connector from disengaging from the receptacle. In either one-piece or two-piece form, the retainer can prevent disengagement of a center ribbon cable connector from a 3½-inch drive device.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[TV mute finger ring]]></title>
<link>http://www.freepatentsonline.com/RE40956.html</link>
<description><![CDATA[TV Mute Finger Ring with a hollow C shaped finger ring housing. The housing contains the standard electronics and IR transmitting LED associated with activating the mute function of a standard TV. The housing also contains a battery type electrical power source. The C shaped ring housing has a loop type fastener strip attached to one end of the C shape and a hook type fastening panel affixed to the opposite end of the C shape so that said loop type fastener can removably attach to said hook fastener thereby forming a full ring that can be worn on the user's forefinger. The C shaped housing contains a momentary on-off switch and attached outwardly accessible switch cover located in a position where the user's thumb can easily reach said switch cover. The IR transmitter is covered by a transparent plastic lens that is flush with the outer surface of said C shaped housing. The plastic lens is positioned so that said lens and said IR transmitting LED are pointed outwardly in the general direction of said TV.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Rigid-flex printed circuit board with weakening structure]]></title>
<link>http://www.freepatentsonline.com/7615860.html</link>
<description><![CDATA[A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure formed along each joint of the connection section and the first and second sections. Each FPCB has a bending section corresponding to the connection section on the RPCB; first and second sections separately extended from two lateral edges of the bending section and having at least one RPCB bonding side each corresponding to the FPCB bonding sides of the first and second sections of the RPCB. When a proper pressure is applied against the weakening structures, the RPCB may be easily bent broken at the weakening structures to remove the connection section therefrom.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Method for fabricating an interposer]]></title>
<link>http://www.freepatentsonline.com/7614142.html</link>
<description><![CDATA[A method for fabricating an interposer includes: forming on one primary surface of a first substrate a thin-film capacitor including a first capacitor electrode, a crystalline capacitor dielectric film formed on the first electrode and a second capacitor electrode formed on the dielectric film; and forming on the primary surface of the first substrate and the capacitor a first layer as semi-cured, and a first partial electrode to be a part of a through-electrode, buried in the first resin layer and electrically connected to the first electrode or the second electrode. The method further includes cutting an upper part of the first partial electrode and an upper part of the first resin layer with a cutting tool; forming on one primary surface of a second substrate a second resin layer as semi-cured, and a second partial electrode to be a part of the through-electrode, buried in the second resin layer and disposed in alignment with the first partial electrode; cutting an upper part of the second partial electrode and an upper part of the second resin layer with a cutting tool; making thermal processing with the first resin layer and the second resin layer in close contact with each other to adhere the first resin and the second resin layer to each other while jointing the first and second partial electrodes to each other; removing the first substrate; forming on said one primary surface of the second substrate a third resin layer, covering the thin-film capacitor, burying a third partial electrode to be a part of the through-electrode in the third resin layer, supporting the third resin layer by a supporting substrate; and removing the second substrate.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Standing apparatus]]></title>
<link>http://www.freepatentsonline.com/7614594.html</link>
<description><![CDATA[A standing apparatus is provided. The standing apparatus includes a base, a link, and a stopping device. The base is placed on a seat surface to support a display device. The link has one side connected with the display device and the other side rotatably connected to the base. The stopping device maintains a folded state of the link when the link is folded with respect to the base. The stopping device includes a stopper and a stopper fixing groove. The stopper is supported by one of the base and the link, and the stopper fixing groove is formed in the other of the base and the link to allow the link to maintain a folded state by automatically interfering with the stopper when the link reaches the folded state.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Integrated antenna type circuit apparatus]]></title>
<link>http://www.freepatentsonline.com/7615856.html</link>
<description><![CDATA[An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes an insulating base, a semiconductor circuit device, chip parts, a molding resin, an antenna conductor, a ground conductor, and external lead electrodes. The plurality of chip parts are mounted on the insulating base, and are soldered to electrodes of wiring conductors on the top of the insulating base for electric and physical connection. The insulating base has a multilayer structure, being formed by laminating a plurality of insulator layers. The antenna conductor is formed on the bottom of the insulating base. A wiring conductor adjacent to the antenna conductor is provided with the ground conductor so that it overlaps with the antenna conductor.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Heat dissipating package structure and method for fabricating the same]]></title>
<link>http://www.freepatentsonline.com/7615862.html</link>
<description><![CDATA[A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; a heat spreader having a first surface, an opposed second surface and a hollow structure, the second surface of the heat spreader being mounted on the chip, wherein the chip is larger in size than the hollow structure such that the chip is partly exposed to the hollow structure; an encapsulant formed between the heat spreader and the chip carrier, for encapsulating the chip, wherein the first surface and sides of the heat spreader are exposed from the encapsulant to dissipate heat produced from the chip; and a plurality of conductive elements disposed on the chip carrier, for electrically connecting the chip to an external device. The present invention also provides a method for fabricating the heat dissipating package structure.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Cooling device for electrical power units of electrically operated vehicles]]></title>
<link>http://www.freepatentsonline.com/7616443.html</link>
<description><![CDATA[A cooling device for an electrical power unit of electrically operated vehicles, comprising at least one power section and at least one control section. A first cooling circuit containing a heat exchanger with a low coolant temperature is provided mainly for cooling elements of the control sections, and a further cooling circuit with a higher coolant temperature is provided mainly for cooling elements of the power sections.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

<item>
<title><![CDATA[Chip-stacked package structure having leadframe with multi-piece bus bar]]></title>
<link>http://www.freepatentsonline.com/7615853.html</link>
<description><![CDATA[The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads arranged in rows facing each other and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips stacked together and provided on the die pad, the plurality of chips and the plurality of inner leads arranged in rows facing each other being electrically connected with each other; and an encapsulant provided to cover the chip-stacked structure and the leadframe; wherein the leadframe comprises at least a bus bar provided between the plurality of inner leads arranged in rows facing each other and the die pad, the bus bar being formed by multiple pieces.]]></description>
<pubDate>Tue, 10 Nov 2009 08:00:00 EST</pubDate>
</item>

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