Plaque It!
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[0001] Not Applicable.
[0002] Not Applicable.
[0003] 1. Field of the Invention
[0004] This disclosure generally relates to methods and apparatus for coupling components to a circuit board.
[0005] 2. Background Information
[0006] Conventionally, an electrical device (e.g., a processor) is mounted in a socket on a printed circuit board that includes a plurality of integrated circuits secured thereto. Heat dissipation may affect the operation of the processor and thus it is desirable to have a highly effective heat sink for the processor to remove heat generated by the processor. Heat sinks are often attached to the processors/circuit boards by way of thermally conductive epoxy/tapes, a spring-based metal clip, plastic devices, or spring/screw combinations.
[0007] The use of thermally conductive epoxy to mount a heat sink onto the surface of a printed circuit board may be a significantly complex manufacturing procedure thereby increasing the overall cost and complexity of manufacturing. For example, there may be a considerable level of difficulty to depositing an epoxy layer of uniform thickness between the circuit board and the heat sink. The heat sink and the circuit board must be pressed together with a certain amount of pressure for a certain amount of time and in a certain orientation. Failure to control these variables (pressure, time, and orientation) carefully may prevent proper operation of the heat sink. Furthermore, an effective technique to easily separate the heat sink from the processor once the interface has been heated is not known to exist.
[0008] As an alternative to epoxy, a spring-based metal clip can be used to retain the heat sink on the circuit board by snapping onto a BGA socket or edge of an ASIC interposer. Such a clip, however, creates a significant drawback. Specifically, the bowed configuration of the spring-based clip causes a large portion of the clip to protrude above the top surface of the heat sink taking away valuable fin surface area. Furthermore, in high power processor applications, the heat sink required for a given processor may have a much larger footprint than the processor itself This need for such large heat sinks makes the use of wire clips incapable of supporting these heavy objects and puts high stresses on soldered joints.
[0009] A third mechanism for attaching heat sinks to processors/circuit boards includes using plastic components to hold the heat sink in place for thermal compression and structural constraint. Although plastics are beneficial due to their electrical insulation, they are inadequate for sustaining the forces and high temperatures associated with heat sinks used on high powered processors due to inevitable creep, reducing their effectiveness and potential catastrophic failure.
[0010] Finally there is a majority of systems designed that incorporate screws and springs combined with standoffs and/or brace structures to mount the heat sinks to the system. Apart from providing a structurally sound solution this design path is disastrous due volume of loose parts to track, assemble and properly tighten. One of the most significant drawbacks is the fact that a tool is required to perform installation or service.
[0011] With some heat sinks, the processor is installed into a socket on the circuit board and retained in place by a locking mechanism that may be integral to the socket. Processors may be installed onto a socket by hand and it is up to the installer to ensure proper alignment of the processor pins with the holes on the socket. Once the processor is installed, the heat sink is then affixed to the top of the processor by a thermally conductive interface. The size of the heat sink may be large enough to prevent unlocking and removing of the processor while the heat sink is installed. In these situations, the heat sink must be removed from the processor before the processor can be removed from the socket.
[0012] Therefore, there remains a need in the art for methods and apparatus that allow for heat sinks to be installed and uninstalled from a processor or other electrical device without the need for special rework instructions or tools, and performed in an intuitive, user friendly, easy manner. If a large heat sink is intended to be used and that heat sink size in turn requires a large force to hold it in place for shipping, there remains a need for a lever to provide mechanical advantage to apply that load. Furthermore, due to the large number of tolerance variations in PCBs, soldered joints, ASIC package heights, etc. there remains a need for a device that can be compliant and accept these variations while still providing equal load distribution.
[0013] Embodiments of the present invention include a tool-less retention assembly for coupling components together. The assembly may comprise a plate and a lever coupled to the plate.
[0014] For a more detailed description of the embodiments of the present invention, reference will now be made to the accompanying drawings, wherein:
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[0023] Certain terms are used throughout the following description and claims to refer to particular system components. As one skilled in the art will appreciate, computer companies may refer to a component by different names. This document does not intend to distinguish between components that differ in name but not function. In the following discussion and in the claims, the terms “including” and “comprising” are used in an open-ended fashion, and thus should be interpreted to mean “including, but not limited to . . . .” The term “couple” or “couples” is intended to mean either an indirect or direct electrical connection. Thus, if a first device couples to a second device, that connection may be through a direct electrical connection, or through an indirect electrical connection via other devices and connections. Also, the term “board” may be used to refer to a printed circuit board or any type of structure to which components are mounted and interconnected.
[0024] In the description that follows, like parts are marked throughout the specification and drawings with the same reference numerals, respectively. The drawing figures are not necessarily to scale. Certain features of the invention may be shown exaggerated in scale or in somewhat schematic form and some details of conventional elements may not be shown in the interest of clarity and conciseness.
[0025] The following discussion is directed to various embodiments of the invention. Although one or more of these embodiments may be preferred, the embodiments disclosed should not be interpreted or otherwise used as limiting the scope of the disclosure, including the claims, unless otherwise specified. In addition, one skilled in the art will understand that the following description has broad application, and the discussion of any embodiment is meant only to be exemplary, and not intended to intimate that the scope of the disclosure, including the claims, is limited to these embodiments.
[0026] There are shown in the drawings, and herein will be described in detail, various embodiments of the invention with the understanding that the disclosure is to be considered merely an exemplification of the principles of the invention, and is not intended to limit this disclosure including the claims to those embodiments illustrated and described herein.
[0027] Referring initially to
[0028] Pronged plate
[0029] In some embodiments, pronged plate
[0030] In addition, when a “Y” shaped pronged plate
[0031] Fastener
[0032] Referring now to
[0033] Cam lever
[0034] Referring now to
[0035] Lever mount
[0036] Arms
[0037] Arms
[0038] In some embodiments, pronged plate
[0039] Operation
[0040]
[0041] Simply by way of further understanding and without limitation, the initial deflection and loading on pins
[0042] where: δ=deflection
[0043] E=modulus of elasticity
[0044] F=force in cantilever
[0045] b=width of plate
[0046] t=thickness of plate
[0047] L=length of plate
[0048] Assuming, for example and without limitation, that the user is trying to impose a 40 lb. load on the heat sink by hand, approximately 20 lbs. may be placed on the single pin
[0049] Once the pins
[0050] In order to unlock the retention assembly
[0051]
[0052] Therefore from the rule above:
[0053] and
[0054] By way of example, suppose R equals 1 in., P equals {fraction (1/10)} in. and the weight to be lifted equals 40 lb., then the force required at F is approximately 0.64 lb. Notice that the calculated deflection δ from above is equal to the pitch P of the fastener. This means that, neglecting friction, 0.64 lb. at F will raise 40 lb. at W in one complete turn of the fastener, but the weight lifted moves much slower than the force applied at F.
[0055] The stress of the pronged plate
[0056] where: S=Stress
[0057] E=modulus of elasticity
[0058] F=force in cantilever
[0059] t=thickness of plate
[0060] L=length of plate
[0061] By using a material thickness having a stress that is a fraction of the maximum of the full hard material, the user is afforded design flexibility for higher loading with a safety factor.
[0062] The cantilever model is how the heat sink-processor-circuit board-retention assembly generally operates. However, when a shock is experienced by the assembly, the tips of the prongs
[0063] where: δ=deflection
[0064] E=modulus of elasticity
[0065] F=force in beam
[0066] b=width of plate
[0067] t=thickness of plate
[0068] L=length of plate
[0069] The simple beam model allows for 16× the load given the material and mechanical constraints. As a result, the user can apply relatively heavy loads to the heat sink/processor/circuit board/retention assembly without fear of moving the heat sink or damaging the processor. In addition, in the simple beam model, any further deflection may transition the pronged plate
[0070]
[0071] Once the pins are in place, the lever portion
[0072] In some embodiments, a covering
[0073] In order to unlock the retention assembly
[0074]
[0075] and
[0076] Suppose the weight W to be lifted is again 40 lbs., R
[0077] Referring back to
[0078] Arms
[0079] The various embodiments of retention may be used, for example, in a computer system, such as that illustrated in
[0080] While embodiments of the invention are susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example(s) in the drawings and associated description. It should be understood, however, that the drawings and detailed description are not intended to limit the claims to the particular form disclosed, but on the contrary, the intention is to cover all modifications, equivalents and alternatives falling within the spirit and scope of the present invention as defined by the appended claims. For example, this disclosure is not limited to heat sinks and processors. In general, the retention clip can be used to couple any two components together in a computer system or in other systems. Also, the retention clip may be temporarily or permanently used to couple the components.