[0001] This is a continuation of copending U.S. application Ser. No. 10/293,517 filed on Nov. 13, 2002, which is a continuation of U.S. application Ser. No. 09/769,833, now U.S. Pat. No. 6,517,375B2, which was filed on Jan. 25, 2001 and issued on Feb. 11, 2003 and which claims priority under 35 U.S.C. ยง 119(e) to provisional application Serial No. 60/177,826 filed on Jan. 25, 2000.
[0002] 1. Field Of The Invention
[0003] The present invention relates generally to a technique for identifying multiple circuit components and, more particularly, to a technique for identifying the location of multiple memory modules.
[0004] 2. Description Of The Related Art
[0005] This section is intended to introduce the reader to various aspects of art which may be related to various aspects of the present invention which are described and/or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present invention. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.
[0006] Microprocessor-based systems generally incorporate a plurality of electrical components. Electrical components, such as control chips, processor chips and memory modules, are often mounted on a substrate such as a printed circuit board or a ceramic board. The substrates generally contain conductive traces which allow the electrical components to be electrically coupled to each other via the substrate. Aside from connecting the electrical devices to one another, the substrate often provides a means of routing electrical signals to and from the components on the substrate to other substrates or external components of the system.
[0007] For example, a computer system may include dozens of electrical devices, including memory devices. Several memory devices may be disposed on a single printed circuit board thereby creating a memory module or memory cartridge. The signals from the memory devices are routed to the edge of the printed circuit board so that the memory cartridge can be coupled to other system components. The memory cartridge may be electrically coupled to another substrate containing various other electrical components such as other memory devices, controllers, processors, or drivers, for instance. Furthermore, a plurality of memory cartridges may be mounted on a single printed circuit board thereby creating an array of memory cartridges.
[0008] Occasionally, when a system is running, one or more of the memory cartridges may fail. In this instance, it may be desirable to change the faulty memory cartridge. Further, it may be desirable to change the memory cartridge without powering down the entire system or disrupting normal operations. In the past, memory cartridges have been physically secured and electrically coupled to a substrate using solder or some other means of permanently attaching the memory cartridge to the substrate. This makes removal and replacement of the memory cartridges difficult. In other instances, the memory cartridge may be attached to the substrate by a connector which will permit removal of the memory cartridge. However, replacing the bad memory cartridge often requires powering the system down.
[0009] The present invention may address one or more of the problems set forth above.
[0010] Certain aspects commensurate in scope with the disclosed embodiments are set forth below. It should be understood that these aspects are presented merely to provide the reader with a brief summary of certain forms the invention might take and that these aspects are not intended to limit the scope of the invention. Indeed, the invention may encompass a variety of aspects that may not be set forth below.
[0011] In one embodiment of the present invention, there is provided a system comprising: a first substrate configured to provide location identification signals to a plurality of locations on the first substrate; a plurality of connectors coupled to the first substrate at the plurality of locations, each connector comprising an identification device uniquely configured to provide substrate location information and to receive the corresponding location identification signals; and a plurality of second substrates, each second substrate coupled to a corresponding connector such that the unique identification device couples the corresponding location identification signals to the second substrate.
[0012] In another embodiment of the present invention, there is provided a system comprising: a first substrate; and a plurality of connectors coupled to the first substrate and configured to receive a plurality of second substrates, each connector comprising a plurality of unique identification devices uniquely configured to provide substrate location information and to electrically couple a plurality of location identification signals to a corresponding second substrate, the electrical signals being received from traces on the first substrate.
[0013] In yet another embodiment of the present invention, there is provided a connector configured to be coupled to a first substrate and configured to receive a second substrate, wherein the connector comprises an identification device uniquely configured to provide location information and to electrically couple a plurality of location identification signals to the second substrate, the electrical signals being received from traces on the first substrate.
[0014] In still another embodiment of the present invention, there is provided a method of identifying the location of a substrate in a system comprising the acts of: providing a first substrate; coupling a plurality of connectors to the first substrate, the connectors each comprising a plurality of contacts and traces arranged in a unique configuration with respect to the others of the plurality of connectors, wherein the unique contact and trace configuration provides location information; electrically coupling each of the plurality of contacts to the first substrate; providing a logical signal to each of the plurality of contacts, the logical signals providing a unique identifier for each of the plurality of connectors, wherein the unique identifier corresponds to a unique location of one of the plurality of connectors; coupling a plurality of second substrates to the plurality of connectors; electrically coupling the plurality of second substrates to the plurality of contacts; and latching the plurality of logical signals of the plurality of contacts to a plurality of control devices existing on the plurality of second substrates.
[0015] The foregoing and other advantages of the invention will become apparent upon reading the following detailed description and upon reference to the drawings in which:
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[0020] FIGS.
[0021] One or more specific embodiments of the present invention will be described below. In an effort to provide a concise description of these embodiments, not all features of an actual implementation may be described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another. Moreover, it should be appreciated that such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.
[0022] Turning now to the drawings, and referring initially to
[0023] The system
[0024] Various other devices may be coupled to the processor
[0025] Because the processor
[0026] A variety of memory devices, such as DRAMS, SDRAMS, SRAMS, etc., can make up the volatile memory
[0027] The memory module
[0028]
[0029] It may be advantageous to know the location of a particular memory cartridge
[0030]
[0031] By providing logical signals from the memory cartridges
[0032] As an example, assume that the input
[0033] It should be appreciated that while the discussion of the present embodiment has illustrated a system wherein traces carrying like logical signals are electrically coupled on the motherboard
[0034] The different configurations of traces to create the unique cartridge identifiers in accordance with the embodiment discussed in
[0035] While the present system illustrates five memory cartridges
[0036] Further, using the same technique, it may be advantageous to provide an identification scheme for each memory module in a memory cartridge. Thus, it is possible to use the same identification technique that was used to provide memory cartridge
[0037] The address location provided by the unique identifier provides location information which may be useful if a memory cartridge fails. The memory controller
[0038] While the invention may be susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and have been described in detail herein. However, it should be understood that the invention is not intended to be limited to the particular forms disclosed. Rather, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the following appended claims.